SG48588G - Encapsulation of electronic components with poly(arylene sulfide)containing mercaptosilane - Google Patents

Encapsulation of electronic components with poly(arylene sulfide)containing mercaptosilane

Info

Publication number
SG48588G
SG48588G SG485/88A SG48588A SG48588G SG 48588 G SG48588 G SG 48588G SG 485/88 A SG485/88 A SG 485/88A SG 48588 A SG48588 A SG 48588A SG 48588 G SG48588 G SG 48588G
Authority
SG
Singapore
Prior art keywords
poly
electronic components
encapsulation
arylene sulfide
containing mercaptosilane
Prior art date
Application number
SG485/88A
Other languages
English (en)
Original Assignee
Phillips Petroleum Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23578192&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG48588(G) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Phillips Petroleum Co filed Critical Phillips Petroleum Co
Publication of SG48588G publication Critical patent/SG48588G/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5406—Silicon-containing compounds containing elements other than oxygen or nitrogen
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31533—Of polythioether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Details Of Resistors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Silicon Polymers (AREA)
SG485/88A 1982-07-16 1988-07-16 Encapsulation of electronic components with poly(arylene sulfide)containing mercaptosilane SG48588G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/399,110 US4782195A (en) 1982-07-16 1982-07-16 Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane

Publications (1)

Publication Number Publication Date
SG48588G true SG48588G (en) 1989-01-27

Family

ID=23578192

Family Applications (1)

Application Number Title Priority Date Filing Date
SG485/88A SG48588G (en) 1982-07-16 1988-07-16 Encapsulation of electronic components with poly(arylene sulfide)containing mercaptosilane

Country Status (8)

Country Link
US (1) US4782195A (de)
EP (1) EP0100913B2 (de)
JP (1) JPS5931503A (de)
AT (1) ATE28252T1 (de)
CA (1) CA1230441A (de)
DE (1) DE3372422D1 (de)
ES (1) ES8405555A1 (de)
SG (1) SG48588G (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994514A (en) * 1982-07-16 1991-02-19 Phillips Petroleum Company Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
CA1241482A (en) * 1985-04-16 1988-08-30 John E. Leland Poly(arylene sulfide) compositions with improved insulation resistance and cracking resistance
JPH0621169B2 (ja) * 1987-04-06 1994-03-23 ポリプラスチックス株式会社 改良されたポリフエニレンサルフアイド樹脂の製造方法
EP0302648A3 (de) * 1987-08-03 1989-08-09 Polyplastics Co. Ltd. Schweissnaht enthaltender Formkörper aus Polyarylensulfidharz
JPH0639113B2 (ja) * 1987-09-02 1994-05-25 ポリプラスチックス株式会社 ウエルド部を有するポリアリーレンサルファイド樹脂成形品
DE3828056A1 (de) * 1988-08-18 1990-02-22 Bayer Ag Polyarylensulfid-formmassen und deren verwendung als einbettmasse fuer aktive und passive elektronische bauelemente
JPH07107133B2 (ja) * 1988-11-30 1995-11-15 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物
DE69306481T2 (de) * 1992-06-15 1997-04-30 Kureha Chemical Ind Co Ltd Harzgebundene magnetische Zusammensetzung und Gussstücke daraus
KR100364062B1 (ko) * 1994-03-17 2003-02-05 이데미쓰세끼유가가꾸가부시끼가이샤 폴리아릴렌설파이드수지조성물

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123495A (en) * 1964-03-03 Sealants compositions and article of
US3297473A (en) * 1964-01-02 1967-01-10 Thiokol Chemical Corp Sealant composition and process
US3577346A (en) * 1968-11-14 1971-05-04 Minnesota Mining & Mfg Insulated electrical conductors having corona resistant polymeric insulation containing organo metallic compounds
US3608033A (en) * 1969-06-17 1971-09-21 Liquid Nitrogen Processing Process for production of molding compositions containing high weight percentage of glass
JPS5112861A (ja) * 1974-07-24 1976-01-31 Mitsui Petrochemical Ind Horiariirensurufuidojushisoseibutsu
JPS5252958A (en) * 1975-10-23 1977-04-28 Mitsubishi Rayon Co Ltd Glass-fiber reinforced polyphenylene sulfide resin compositions
CA1102107A (en) * 1976-07-01 1981-06-02 Donald G. Needham Arc resistant composition
US4176098A (en) * 1976-07-01 1979-11-27 Phillips Petroleum Company Arc resistant composition
JPS5529526A (en) * 1978-08-21 1980-03-01 Shin Etsu Chem Co Ltd Polyphenylene sulfide resin composition
DE2907195A1 (de) * 1979-02-23 1980-08-28 Tschernichov Waermebestaendiges material
US4269756A (en) * 1979-12-27 1981-05-26 Union Carbide Corporation Use of organotitanate in the encapsulation of electrical components
JPS5713585A (en) * 1980-06-26 1982-01-23 Toshiba Corp Paper feed error detecting device
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
US4337182A (en) * 1981-03-26 1982-06-29 Phillips Petroleum Company Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation
CA1222588A (en) * 1981-09-10 1987-06-02 Jennings P. Blackwell Glass-filled polyarylene sulfide compositions containing organosilanes
US4350786A (en) * 1981-09-10 1982-09-21 Phillips Petroleum Company Organosilane antistatic agents for glass-filled polyarylene sulfides

Also Published As

Publication number Publication date
ATE28252T1 (de) 1987-07-15
ES524157A0 (es) 1984-06-01
EP0100913A1 (de) 1984-02-22
US4782195A (en) 1988-11-01
EP0100913B2 (de) 1995-05-03
ES8405555A1 (es) 1984-06-01
JPS5931503A (ja) 1984-02-20
DE3372422D1 (en) 1987-08-13
CA1230441A (en) 1987-12-15
JPH0461442B2 (de) 1992-09-30
EP0100913B1 (de) 1987-07-08

Similar Documents

Publication Publication Date Title
DE3375695D1 (en) Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
DE3177003D1 (en) Electronic circuit chip carrier
EP0135310A3 (en) Moulding compositions for the encapsulation of electronic components
JPS5759864A (en) Organic compound, manufacture and composition containing same
AU571916B2 (en) High concentration encapsulation
ES8307854A1 (es) Un metodo para la preparacion de una composicion de organo- polisiloxano vulcanizable a la temperatura ambiente.
GB2088635B (en) Encapsulation for semiconductor integrated circuit chip
DE3375620D1 (en) Encapsulated electronic components and encapsulation compositions
IL59455A (en) Lead frame and chip carrier housing for i.c.packaging
EP0097833A3 (en) Substrate for integrated circuit packages
ES8600015A1 (es) Un procedimiento para preparar una goma de mascar aromatizada con una composicion aromatizante constituida por un polimero hidrofilo y un agente aromatizante.
CA1259737C (de)
ES8403502A1 (es) Procedimiento para modificar las propiedades tecnicas de los polimeros de sulfuro de arileno de vidrio.
ATE33030T1 (de) Durch laser bedruckbare poly(arylensulfid)mischungen.
DE3372422D1 (en) Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
EP0106319A3 (en) Poly(arylene sulfide) containing talc
ATE25697T1 (de) Polyarylensulfidzusammensetzungen.
GB2073947B (en) Integrated circuit encapsulation
GB2160707B (en) Ga as integrated circuit package
JPS5721844A (en) Resin composition for sealing electronic parts
ES2012105A6 (es) Un procedimiento para la estabilizacion de una materia polimera previamente a la elaboracion del articulo final.
ZA814409B (en) Polyarylene sulphide compositions
AU511909B2 (en) Poly (arylene sulfide) composition
JPS57136770A (en) Silver peroxide cell
JPS5249260A (en) Stabilized halogen-containing resin compositions