ES8405555A1 - Procedimiento para encapsular componentes electronicos - Google Patents
Procedimiento para encapsular componentes electronicosInfo
- Publication number
- ES8405555A1 ES8405555A1 ES524157A ES524157A ES8405555A1 ES 8405555 A1 ES8405555 A1 ES 8405555A1 ES 524157 A ES524157 A ES 524157A ES 524157 A ES524157 A ES 524157A ES 8405555 A1 ES8405555 A1 ES 8405555A1
- Authority
- ES
- Spain
- Prior art keywords
- poly
- electronic components
- encapsulation
- arylene sulfide
- containing mercaptosilane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/5406—Silicon-containing compounds containing elements other than oxygen or nitrogen
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31533—Of polythioether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Organic Insulating Materials (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
- Silicon Polymers (AREA)
Abstract
PROCEDIMIENTO PARA ENCAPSULAR COMPONENTES ELECTRONICOS.COMPRENDE VARIAS ETAPAS: A) PRODUCIR UNA MEZCLA DE POLI(SULFURO DE ARILENO) Y MERCAPTOSILANO Y OPCIONALMENTE VIDRIO DE REFUERZO Y CARGA; B) CALENTAR LA MEZCLA A LA TEMPERATURA DEL PUNTO DE FUSION DEL POLI(SULFURO DE ARILENO); C) ENCAPSULAR EL COMPONENTE ELECTRONICO CON LA MEZCLA. LA MEZCLA SE COMBINA EN PORCENTAJE EN PESO DE 25 A 45 DE POLI(SULFURO DE ARILENO) MERCAPTOSILANO DE 20 A 50 DE VIDRIO REFORZANTE Y 18 A 38 DE CARGA. LA VISCOSIDAD DE LA COMPOSICION RESULTANTE HA DE SER INFERIOR A 1.200 POISES, SEGUNSE DETERMINA EN UN REOMETRO CAPILAR A 343JC BAJO UN ESFUERZO DE 1.000 (SEG)-1. LA CARGA SE ELIGE ENTRE SILICE, TALCO Y SULFATO DE CALCIO. EL MERCAPTOSILANO ES MERCAPTOPROPILTRIMETOXISILANO. PARA ENCAPSULAR LOS COMPONENTES ELECTRONICOS SE INTRODUCE LA COMPOSICION EN UNA MAQUINA DE MOLDEO POR INYECCION PARA PRODUCIR UNA FUSION QUE SE EXTRUYE AL INTERIOR DE UN MOLDE DE INYECCION EN DONDE SE SITUA EL COMPONENTE ELECTRONICO A ENCAPSULAR.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/399,110 US4782195A (en) | 1982-07-16 | 1982-07-16 | Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane |
Publications (2)
Publication Number | Publication Date |
---|---|
ES524157A0 ES524157A0 (es) | 1984-06-01 |
ES8405555A1 true ES8405555A1 (es) | 1984-06-01 |
Family
ID=23578192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES524157A Expired ES8405555A1 (es) | 1982-07-16 | 1983-07-15 | Procedimiento para encapsular componentes electronicos |
Country Status (8)
Country | Link |
---|---|
US (1) | US4782195A (es) |
EP (1) | EP0100913B2 (es) |
JP (1) | JPS5931503A (es) |
AT (1) | ATE28252T1 (es) |
CA (1) | CA1230441A (es) |
DE (1) | DE3372422D1 (es) |
ES (1) | ES8405555A1 (es) |
SG (1) | SG48588G (es) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4994514A (en) * | 1982-07-16 | 1991-02-19 | Phillips Petroleum Company | Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane |
CA1241482A (en) * | 1985-04-16 | 1988-08-30 | John E. Leland | Poly(arylene sulfide) compositions with improved insulation resistance and cracking resistance |
JPH0621169B2 (ja) * | 1987-04-06 | 1994-03-23 | ポリプラスチックス株式会社 | 改良されたポリフエニレンサルフアイド樹脂の製造方法 |
JPH0639113B2 (ja) * | 1987-09-02 | 1994-05-25 | ポリプラスチックス株式会社 | ウエルド部を有するポリアリーレンサルファイド樹脂成形品 |
EP0302648A3 (en) * | 1987-08-03 | 1989-08-09 | Polyplastics Co. Ltd. | Weld-containing polyarylene sulfide resin molded article |
DE3828056A1 (de) * | 1988-08-18 | 1990-02-22 | Bayer Ag | Polyarylensulfid-formmassen und deren verwendung als einbettmasse fuer aktive und passive elektronische bauelemente |
JPH07107133B2 (ja) * | 1988-11-30 | 1995-11-15 | ポリプラスチックス株式会社 | ポリアリーレンサルファイド樹脂組成物 |
DE69306481T2 (de) * | 1992-06-15 | 1997-04-30 | Kureha Chemical Ind Co Ltd | Harzgebundene magnetische Zusammensetzung und Gussstücke daraus |
KR100364062B1 (ko) * | 1994-03-17 | 2003-02-05 | 이데미쓰세끼유가가꾸가부시끼가이샤 | 폴리아릴렌설파이드수지조성물 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3123495A (en) * | 1964-03-03 | Sealants compositions and article of | ||
US3297473A (en) * | 1964-01-02 | 1967-01-10 | Thiokol Chemical Corp | Sealant composition and process |
US3577346A (en) * | 1968-11-14 | 1971-05-04 | Minnesota Mining & Mfg | Insulated electrical conductors having corona resistant polymeric insulation containing organo metallic compounds |
US3608033A (en) * | 1969-06-17 | 1971-09-21 | Liquid Nitrogen Processing | Process for production of molding compositions containing high weight percentage of glass |
JPS5112861A (ja) * | 1974-07-24 | 1976-01-31 | Mitsui Petrochemical Ind | Horiariirensurufuidojushisoseibutsu |
JPS5252958A (en) * | 1975-10-23 | 1977-04-28 | Mitsubishi Rayon Co Ltd | Glass-fiber reinforced polyphenylene sulfide resin compositions |
US4176098A (en) * | 1976-07-01 | 1979-11-27 | Phillips Petroleum Company | Arc resistant composition |
CA1102107A (en) * | 1976-07-01 | 1981-06-02 | Donald G. Needham | Arc resistant composition |
JPS5529526A (en) * | 1978-08-21 | 1980-03-01 | Shin Etsu Chem Co Ltd | Polyphenylene sulfide resin composition |
DE2907195A1 (de) * | 1979-02-23 | 1980-08-28 | Tschernichov | Waermebestaendiges material |
US4269756A (en) * | 1979-12-27 | 1981-05-26 | Union Carbide Corporation | Use of organotitanate in the encapsulation of electrical components |
JPS5713585A (en) * | 1980-06-26 | 1982-01-23 | Toshiba Corp | Paper feed error detecting device |
JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
US4337182A (en) * | 1981-03-26 | 1982-06-29 | Phillips Petroleum Company | Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation |
CA1222588A (en) * | 1981-09-10 | 1987-06-02 | Jennings P. Blackwell | Glass-filled polyarylene sulfide compositions containing organosilanes |
US4350786A (en) * | 1981-09-10 | 1982-09-21 | Phillips Petroleum Company | Organosilane antistatic agents for glass-filled polyarylene sulfides |
-
1982
- 1982-07-16 US US06/399,110 patent/US4782195A/en not_active Expired - Fee Related
-
1983
- 1983-06-03 CA CA000429621A patent/CA1230441A/en not_active Expired
- 1983-07-15 AT AT83106956T patent/ATE28252T1/de not_active IP Right Cessation
- 1983-07-15 ES ES524157A patent/ES8405555A1/es not_active Expired
- 1983-07-15 DE DE8383106956T patent/DE3372422D1/de not_active Expired
- 1983-07-15 EP EP83106956A patent/EP0100913B2/en not_active Expired - Lifetime
- 1983-07-15 JP JP58129259A patent/JPS5931503A/ja active Granted
-
1988
- 1988-07-16 SG SG485/88A patent/SG48588G/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0100913B1 (en) | 1987-07-08 |
ATE28252T1 (de) | 1987-07-15 |
ES524157A0 (es) | 1984-06-01 |
US4782195A (en) | 1988-11-01 |
EP0100913A1 (en) | 1984-02-22 |
CA1230441A (en) | 1987-12-15 |
EP0100913B2 (en) | 1995-05-03 |
JPH0461442B2 (es) | 1992-09-30 |
DE3372422D1 (en) | 1987-08-13 |
JPS5931503A (ja) | 1984-02-20 |
SG48588G (en) | 1989-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19991108 |