SG44540A1 - Silicon polyimide precursor composition - Google Patents

Silicon polyimide precursor composition

Info

Publication number
SG44540A1
SG44540A1 SG1996001874A SG1996001874A SG44540A1 SG 44540 A1 SG44540 A1 SG 44540A1 SG 1996001874 A SG1996001874 A SG 1996001874A SG 1996001874 A SG1996001874 A SG 1996001874A SG 44540 A1 SG44540 A1 SG 44540A1
Authority
SG
Singapore
Prior art keywords
polyimide precursor
precursor composition
silicon polyimide
silicon
composition
Prior art date
Application number
SG1996001874A
Other languages
English (en)
Inventor
Ryuji Kobayashi
Kouichi Kunimune
Original Assignee
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Corp filed Critical Chisso Corp
Publication of SG44540A1 publication Critical patent/SG44540A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/02—Polysilicates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG1996001874A 1989-02-02 1990-02-01 Silicon polyimide precursor composition SG44540A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1022497A JP2619515B2 (ja) 1989-02-02 1989-02-02 シリコンポリイミド前駆体組成物

Publications (1)

Publication Number Publication Date
SG44540A1 true SG44540A1 (en) 1997-12-19

Family

ID=12084381

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996001874A SG44540A1 (en) 1989-02-02 1990-02-01 Silicon polyimide precursor composition

Country Status (6)

Country Link
US (1) US5071908A (fr)
EP (1) EP0381506B1 (fr)
JP (1) JP2619515B2 (fr)
KR (1) KR930004942B1 (fr)
DE (1) DE69029413T2 (fr)
SG (1) SG44540A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04351666A (ja) * 1991-05-29 1992-12-07 Shin Etsu Chem Co Ltd 硬化性樹脂組成物及び電子部品用保護膜
JPH04351667A (ja) * 1991-05-29 1992-12-07 Shin Etsu Chem Co Ltd 硬化性樹脂組成物及び電子部品用保護膜
JP3227892B2 (ja) * 1993-04-20 2001-11-12 チッソ株式会社 シリコン含有ポリアミド酸誘導体及びそれを用いた感光性樹脂組成物
JP3004583U (ja) * 1994-02-15 1994-11-22 相云 李 石材研磨機
JP3731229B2 (ja) * 1995-10-20 2006-01-05 チッソ株式会社 ポリアミド酸、ポリイミド膜及びこれを用いた液晶配向膜、液晶表示素子
US5962113A (en) * 1996-10-28 1999-10-05 International Business Machines Corporation Integrated circuit device and process for its manufacture
CN115315462A (zh) * 2020-03-24 2022-11-08 东丽株式会社 树脂膜、其制造方法、树脂组合物、显示器及其制造方法
CN112143000B (zh) * 2020-08-17 2022-10-11 永丰航盛电子有限公司 一种全有机pi/pvdf薄膜复合材料的制备方法
CN114539535B (zh) * 2020-11-25 2023-04-07 中蓝晨光化工研究设计院有限公司 一种含酰胺基单组份室温固化弹塑性硅树脂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3948835A (en) * 1973-06-07 1976-04-06 Ciba-Geigy Corporation Silicon-modified prepolymers
US3950308A (en) * 1973-06-07 1976-04-13 Ciba-Geigy Corporation Crosslinked polymers containing siloxane groups
JPS591423B2 (ja) * 1977-12-29 1984-01-12 鐘淵化学工業株式会社 室温硬化性組成物
JPS61108627A (ja) * 1984-11-02 1986-05-27 Chisso Corp 可溶性ポリイミドシロキサン前駆体及びその製造方法
US4499252A (en) * 1984-03-28 1985-02-12 Nitto Electric Industrial Co., Ltd. Process for producing polyimide precursor
JPH0617474B2 (ja) * 1985-05-31 1994-03-09 チッソ株式会社 高接着性シリコン含有ポリアミド酸の製造法
US4609700A (en) * 1985-06-19 1986-09-02 Chisso Corporation Soluble imide oligomer and a method for producing the same
JP2609256B2 (ja) * 1987-07-21 1997-05-14 鐘淵化学工業株式会社 硬化性組成物
DE3852987T2 (de) * 1987-11-10 1995-06-01 Chisso Corp Silizium enthaltendes Polyimid-Prepolymer, davon abgeleitete ausgehärtete Produkte und Verfahren zu deren Herstellung.

Also Published As

Publication number Publication date
EP0381506A3 (fr) 1993-02-03
US5071908A (en) 1991-12-10
DE69029413D1 (de) 1997-01-30
KR900013018A (ko) 1990-09-03
KR930004942B1 (ko) 1993-06-10
JPH02202950A (ja) 1990-08-13
EP0381506A2 (fr) 1990-08-08
EP0381506B1 (fr) 1996-12-18
JP2619515B2 (ja) 1997-06-11
DE69029413T2 (de) 1997-05-15

Similar Documents

Publication Publication Date Title
GB2234112B (en) Semiconductor component
GB8615534D0 (en) Composition
GB8623459D0 (en) Composition
EP0269319A3 (en) Polyimide
GB8609337D0 (en) Semiconductor devices
GB8724250D0 (en) Composition
EP0261419A3 (en) Semiconductive ceramic composition
GB8714145D0 (en) Phtoresist composition
EP0233085A3 (en) Ceramic wiring substrate
GB8612010D0 (en) Semiconductor devices
GB2188479B (en) Semiconductor devices
SG44540A1 (en) Silicon polyimide precursor composition
GB8721400D0 (en) Composition
GB8612550D0 (en) Composition
GB8622124D0 (en) Composition
GR900300025T1 (en) Processing polyimide precursor compositions
EP0231075A3 (en) Semiconductor structures
GB8719058D0 (en) Ceramic composition
GB8710281D0 (en) Making semiconductor device
GB8629312D0 (en) Fastening devices
GB8719817D0 (en) Semiconductor devices
GB9000616D0 (en) Novel polyimide
EP0430430A3 (en) Polyimide
EP0274354A3 (en) Photostructurable polyimide compositions
GB8627666D0 (en) Semiconductor device manufacture