SG2013068986A - Probe card and manufacturing method thereof - Google Patents

Probe card and manufacturing method thereof

Info

Publication number
SG2013068986A
SG2013068986A SG2013068986A SG2013068986A SG2013068986A SG 2013068986 A SG2013068986 A SG 2013068986A SG 2013068986 A SG2013068986 A SG 2013068986A SG 2013068986 A SG2013068986 A SG 2013068986A SG 2013068986 A SG2013068986 A SG 2013068986A
Authority
SG
Singapore
Prior art keywords
manufacturing
probe card
probe
card
Prior art date
Application number
SG2013068986A
Other languages
English (en)
Inventor
Lee Chung-Tse
Wu Chien-Chou
Chen Tsung-Yi
Chen Ming-Chi
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of SG2013068986A publication Critical patent/SG2013068986A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG2013068986A 2012-09-19 2013-09-13 Probe card and manufacturing method thereof SG2013068986A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101134326A TWI454710B (zh) 2012-09-19 2012-09-19 Probe card and its manufacturing method

Publications (1)

Publication Number Publication Date
SG2013068986A true SG2013068986A (en) 2014-04-28

Family

ID=50273836

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013068986A SG2013068986A (en) 2012-09-19 2013-09-13 Probe card and manufacturing method thereof

Country Status (5)

Country Link
US (1) US9341648B2 (zh)
JP (1) JP5740442B2 (zh)
CN (1) CN103675369B (zh)
SG (1) SG2013068986A (zh)
TW (1) TWI454710B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM463903U (zh) * 2013-05-15 2013-10-21 Star Techn Inc 測試組件
KR102522869B1 (ko) * 2016-07-14 2023-04-19 인튜어티브 서지컬 오퍼레이션즈 인코포레이티드 컴팩트한 양안 영상 포착 디바이스
WO2019046419A1 (en) * 2017-08-30 2019-03-07 Formfactor, Inc. VERTICAL PROBE ARRANGEMENT COMPRISING A SPACE TRANSFORMER WITH MEMBRANE JUXTAPOSÉ
TWI645195B (zh) * 2017-11-14 2018-12-21 旺矽科技股份有限公司 Probe card
CN108254676A (zh) * 2018-03-26 2018-07-06 苏州联讯仪器有限公司 一种高精度激光器芯片老化夹具
CN110531125B (zh) * 2018-05-23 2022-05-17 旺矽科技股份有限公司 空间转换器、探针卡及其制造方法
TWI792528B (zh) * 2021-08-31 2023-02-11 旺矽科技股份有限公司 探針卡及其晶圓測試組件

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US6690185B1 (en) * 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
JP3565086B2 (ja) * 1999-04-16 2004-09-15 富士通株式会社 プローブカード及び半導体装置の試験方法
US6891385B2 (en) * 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US7459795B2 (en) * 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
KR20080012253A (ko) * 2004-12-02 2008-02-11 에스브이 프로브 피티이 엘티디 분할된 기판을 구비하는 프로브 카드
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
CN101501510A (zh) * 2005-09-19 2009-08-05 佛姆法克特股份有限公司 测试单个管芯的装置和方法
US8311758B2 (en) * 2006-01-18 2012-11-13 Formfactor, Inc. Methods and apparatuses for dynamic probe adjustment
KR100609652B1 (ko) * 2006-02-16 2006-08-08 주식회사 파이컴 공간변형기와 상기 공간변형기의 제조방법 및 상기공간변형기를 갖는 프로브 카드
JP5190195B2 (ja) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス 電気的接続装置
KR100703044B1 (ko) * 2007-01-12 2007-04-09 (주)에이펙스 검사용 프로브 카드 및 그 제조 방법
KR100791945B1 (ko) * 2007-08-23 2008-01-04 (주)기가레인 프로브 카드
JP4986785B2 (ja) 2007-09-21 2012-07-25 日本電子材料株式会社 プローブカード
JP2009115520A (ja) 2007-11-02 2009-05-28 Japan Electronic Materials Corp プローブカードの製造方法
US8033012B2 (en) * 2008-03-07 2011-10-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating a semiconductor test probe card space transformer
US7692436B2 (en) * 2008-03-20 2010-04-06 Touchdown Technologies, Inc. Probe card substrate with bonded via
KR101060816B1 (ko) 2008-08-05 2011-08-30 삼성전기주식회사 세라믹 프로브 카드의 제조 방법
CN101738573A (zh) * 2008-11-17 2010-06-16 京元电子股份有限公司 晶圆测试装置及其测试方法
KR20110072394A (ko) 2009-12-22 2011-06-29 삼성전기주식회사 기둥형 도전체를 이용하여 형성한 다층 세라믹 기판과 프로브 기판 및 그의 제조방법
WO2012011627A1 (ko) * 2010-07-19 2012-01-26 (주) 마이크로프랜드 프로브 카드 및 그 제조방법
JP5426494B2 (ja) 2010-07-20 2014-02-26 日本電子材料株式会社 プローブカードの製造方法
TWI428608B (zh) * 2011-09-16 2014-03-01 Mpi Corp 探針測試裝置與其製造方法

Also Published As

Publication number Publication date
JP5740442B2 (ja) 2015-06-24
US9341648B2 (en) 2016-05-17
TWI454710B (zh) 2014-10-01
CN103675369A (zh) 2014-03-26
CN103675369B (zh) 2016-03-23
TW201413251A (zh) 2014-04-01
US20140077833A1 (en) 2014-03-20
JP2014062902A (ja) 2014-04-10

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