SG193234A1 - Film and packaging body - Google Patents
Film and packaging body Download PDFInfo
- Publication number
- SG193234A1 SG193234A1 SG2013062559A SG2013062559A SG193234A1 SG 193234 A1 SG193234 A1 SG 193234A1 SG 2013062559 A SG2013062559 A SG 2013062559A SG 2013062559 A SG2013062559 A SG 2013062559A SG 193234 A1 SG193234 A1 SG 193234A1
- Authority
- SG
- Singapore
- Prior art keywords
- segment
- solubility parameter
- carrier tape
- cover tape
- film
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 229920002959 polymer blend Polymers 0.000 claims abstract description 47
- 229920000642 polymer Polymers 0.000 claims abstract description 40
- 239000002344 surface layer Substances 0.000 claims abstract description 18
- 239000012790 adhesive layer Substances 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 62
- 239000004743 Polypropylene Substances 0.000 description 51
- 239000004793 Polystyrene Substances 0.000 description 40
- 239000004417 polycarbonate Substances 0.000 description 38
- 229920001223 polyethylene glycol Polymers 0.000 description 37
- 229920006223 adhesive resin Polymers 0.000 description 36
- 239000004840 adhesive resin Substances 0.000 description 36
- 229920005989 resin Polymers 0.000 description 34
- 239000011347 resin Substances 0.000 description 34
- 239000010410 layer Substances 0.000 description 30
- 229920005604 random copolymer Polymers 0.000 description 30
- -1 polyethylene terephthalate Polymers 0.000 description 21
- 239000000463 material Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 18
- 238000007334 copolymerization reaction Methods 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 11
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 11
- 229920003314 Elvaloy® Polymers 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 8
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 8
- 229920000573 polyethylene Polymers 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 125000001453 quaternary ammonium group Chemical group 0.000 description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910001416 lithium ion Inorganic materials 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000009820 dry lamination Methods 0.000 description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 230000009191 jumping Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- VMXUWOKSQNHOCA-UKTHLTGXSA-N ranitidine Chemical compound [O-][N+](=O)\C=C(/NC)NCCSCC1=CC=C(CN(C)C)O1 VMXUWOKSQNHOCA-UKTHLTGXSA-N 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZPFAVCIQZKRBGF-UHFFFAOYSA-N 1,3,2-dioxathiolane 2,2-dioxide Chemical compound O=S1(=O)OCCO1 ZPFAVCIQZKRBGF-UHFFFAOYSA-N 0.000 description 1
- OIXNFJTTYAIBNF-UHFFFAOYSA-N 2-(chloromethyl)oxirane;oxirane Chemical compound C1CO1.ClCC1CO1 OIXNFJTTYAIBNF-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- CVEPFOUZABPRMK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;styrene Chemical compound CC(=C)C(O)=O.C=CC1=CC=CC=C1 CVEPFOUZABPRMK-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical compound N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006245 ethylene-butyl acrylate Polymers 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229940006186 sodium polystyrene sulfonate Drugs 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D43/00—Lids or covers for rigid or semi-rigid containers
- B65D43/02—Removable lids or covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
- B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/518—Oriented bi-axially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
- B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
- B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D2575/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D2575/3209—Details
- B65D2575/3218—Details with special means for gaining access to the contents
- B65D2575/3245—Details with special means for gaining access to the contents by peeling off the non-rigid sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
- Y10T428/2826—Synthetic resin or polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Medicinal Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Composite Materials (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Packages (AREA)
- Laminated Bodies (AREA)
- Wrappers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Packaging Frangible Articles (AREA)
Abstract
FILM AND PACKAGING BODYAn object of the present invention is to provide a film that is resistant to the effects of the surface condition of an adherend such as a carrier tape and demonstrates only small fluctuations in peel strength. The film according to thepresent invention is provided with a surface layer. The surface layer is formed by using a polymer blend as the main component thereof. The polymer blend comprises at least two types of single segment polymers, at least two types of multi-segment polymers, or at least one type of single segment polymer and at least one type of multi-segment polymer. In the filmaccording to the present invention, the maximum value of the absolute value of the difference in solubility parameter values among all segments in the polymer blend is 0.40 to 1.40.Figure 4
Description
FILM AND PACKAGING BODY
[0001]
The present invention relates toc a film that can be used for, for example, food packaging or electronic component { packaging. In addition, the present invention relates to a packaging body provided with that film.
The present application claims priority on the basis of
Japanese Patent Application No. 2011-074178, filed in Japan on
March 30, 2011, the contents of which are incorporated herein by reference.
[0002]
C.
A cover tape that undergoes interfacial peeling when peeled from a carrier tape has been previously proposed (see, for example, Patent Document 1).
Prior Art Documents
Patent Documents [00031
Patent Document 1: Japanese Unexamined Patent Application,
First Publication No. 2010-173673
Problems to be Solved by the Invention
[0004]
However, in the case of the cover tape as described above, there are considerable fluctuations in peel strength as a result of being easily affected by the surface condition of the carrier 3 tape. Thus, when this interfacial peeling-type cover tape is peeled from the carrier tape, the carrier tape frequently vibrates. When the carrier tape vibrates in this manner, there is the problem of an electronic component jumping out of the carrier tape.
[0005]
An object of the present invention is to provide a film that is resistant to the effects of the surface condition of
B an adherend such as a carrier tape and demonstrates only small = fluctuations in peel strength.
Means for Sclving the Problems
[0006] (1) The film according to the present invention is provided with a surface layer (adhesive layer). Furthermore, the film may be formed only from a surface layer (namely, a single-layer film), or may be formed from the surface layer and another layer
(namely, a multi-layer film). The surface layer is formed having a polymer blend as a main component thereof. The polymer blend comprises at least two types of single segment polymers, at least two types of multi-segment polymers, or at least cne type of single segment polymer and at least one type of muliti-segment polymer. Furthermore, in the present application, a "single segment polymer" refers to a polymer that ¢ has only one segment, and is a homopolymer, randomly copolymerized polymer or alternately copolymerized polymer.
In addition, in the present application, a "multi-segment polymer" refers to a polymer having two or more segments, and is either a block copolymerized polymer or graft copolymerized polymer. In addition, in the present application, a segment refers to a portion having 10 or more repeating constituent units. In the film according to the present invention, the r maximum value of the absolute value of the difference in - solubility parameter values among all segments in the polymer blend is 0.40 to 1.40. Furthermore, in the present application, solubility parameter refers to the Hildebrand solubility parameter. Inaddition, themaximum value of the absolute value of the difference in solubility parameter values is preferably 0.90 to 1.30 and more preferably 1.00 to 1.20. [00071
When a film satisfying the aforementioned condition is adhered to an adhered by thermal adhesion or an adhesive through the surface layer, the film can be peeled off while causing cohesive failure of the surface layer when peeling the film from the adherend. In general, peelingwith cohesive failure is less susceptible to the effects of the surface condition of the adherend and there is less fluctuation in peel strength in comparison with interfacial peeling. Consequently, this film £ is resistant to the effects of the surface condition of the . adherend, and in cases it is peeled from an adherend after being adhered thereto, fluctuations in peel strength can be reduced.
[0008] (2) In the film according to (1) above, two segments having solubility parameter values serving as the basis for calculating the maximum value (to be referred to as "specific segments”) are preferably contained at 15 parts by weight to 60 parts by weight based on 100 parts by weight of the polymer
B blend. In addition, the weight ratio of one specific segment to the other specific segment is preferably within the range of 30:70 to 70:30.
[0009]
When a film that satisfies the aforementioned conditions is adhered to an adherend by thermal adhesion or adhesive through the surface layer, the film can be peeled off while causing cohesive failure of the surface layer when the film is peeled from the adherend. In general, peeling with cohesive failure is less susceptible to the effects of the surface condition of the adherend and there is less fluctuation in peel strength in comparison with interfacial peeling. Consequently, this film is resistant to the effects of the surface condition of the adherend, and in cases it is peeled from the adherend after being adhered thereto, fluctuations in peel strength can « be reduced. [0010C] {3) In the film accoxding to (1) or (2) above, at least one type of segment has thermal adhesiveness. In addition, the surface layer functions as a thermal adhesive layer.
[0011]
Consequently, this film can be adhered to an adherend by thermal adhesion. . [0012] { or (4) The packaging body according to the present invention is provided with the film according to (3) above and a packaging container. The opening of the packaging container is covered with the aforementioned film. The absolute value of the difference between the solubility parameter value of the segment having thermal adhesiveness and the solubility parameter value of the main component of the resin composition that forms the surface around the opening cof the packaging container is 1.90 or less. Furthermore, the main component referred to here refers to that which accounts for 50% by weight or more of the resin composition.
[0013]
In a packaging body that satisfies the aforementioned condition, the film is favorably adhered to the packaging container prior to opening, and fluctuations in peel strength of the film during opening can be reduced.
[0014] {5) In the packaging body according to (4) above, the peel strength of the film with respect to the packaging container is preferably 0.1 N to 1.0 N. Furthermore, the aforementioned peel strength is measured in compliance with standards when using a carrier tape having a width of 8 mm as described in JIS
C-0806-3.
Bn [0015] £ oo In a packaging body that satisfies the aforementioned condition, the film is favorably adhered to the packaging container prior to opening, and the film can be easily peeled off during opening.
[0016]
The film according to the present invention is resistant to the effects of the surface condition of an adherend, and in cases it is peeled from an adhered after being adhered thereto, fluctuations in peel strength can be reduced.
[0017]
In addition, as was previously described, this film is peeled off while causing cohesive failure of the surface layer when peeled from an adherend after having been adhered by 7 thermal adhesion or an adhesive through the surface layer.
Consequently, this filmnot cnly undergoes fewer changes in peel strength over time than conventional interfacial adhesion-type film, but also demonstrates less susceptibility to the effects of the materials of the adherend on peel strength, and is also less likely to peel off spontaneously in cases of being transported while adhered to the adherend.
“ [0018]
FIG. 1 is a perspective view of a packaging body according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line A-A of the packaging body shown in FIG, 1.
FIG. 3 is an enlarged cross-secticnal view of portion P of FIG. Z.
FIG. 4 is a perspective view showing the state of a cover tape being peeled from a carrier tape.
FIG. 5 is an overhead view showing the state after a cover tape has been peeled from a carrier tape.
[0012]
As shown in FIGS. 1 and 2, a packaging body 100 according ( to an embodiment of the present invention mainly comprises a ) cover tape 200 and a carrier tape (packaging container} 300.
The following provides detailed descriptions of the cover tape 200 and the carrier tape 300, respectively.
[0020] <Cover Tape>
As shown in FIG. 3, the cover tape 200 is a laminated film comprising a base material layer 210, an intermediate layer 220 and an adhesive layer (surface layer) 230. - [0021]
The base material layer 210 is preferably a transparent, highly rigid, biaxially oriented film of a polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), a polyclefin resin such as polyethylene or polypropylene, or a polyamide resin such as Nylon®. The thickness of the base material layer 210 is preferably 6 pm to 100 pm. In addition, the base material layer 210 may be subjected to antistatic treatment on one side thereof. In addition, the base material layer 2i0 may also be subjected to surface treatment such as corona treatment, plasma treatment or sandblasting treatment as necessary on the side on which the intermediate layer 220 or the adhesive layer 230 is formed. In addition, the base material layer 210 may be laminated with the previously mentioned criented film for the purpose of enhancing ( mechanical strength of the cover tape 200.
[0022]
The intermediate layer 220 is formed from, for example, polyethylene, polyethylene-vinyl acetate copolymer, ethylene-acrylic copolymer or polyurethane. Furthermore, low-density polyethylene is preferable for the polyethylene.
In addition, the thickness of the intermediate layer 220 is preferably 10 um to 50 pm. Furthermore, the intermediate layer ¢ 220 may be omitted. o [0023]
Examples of methods used to form the intermediate layer 220 on the base material layer 210, namely a base material film, include dry lamination and extrusion lamination. Furthermore, extrusion lamination is preferable in consideration cof the flexibility of the base material layer 210.
[0024]
The adhesive layer (surface layer) 230 is formed from a polymer blend.
This polymer blend may comprise a plurality of single segment polymers, may comprise a plurality of multi-segment polymers, or may comprise at least one type of single segment polymer and at least one type of multi-segment polymer.
Furthermore, in the present embodiment, a "single segment polymer" refers to a polymer having only one segment, and is a homopolymer, randomly copolymerized polymer or
(" alternately copolymerized polymer.
In addition, a
"multi-segment polymer" refers to a polymer having two or more segments and is a block copolymerized polymer or graft copolymerized polymer.
In the present embodiment, the maximum value of the absolute value of the difference in solubility parameter values among all segments in the polymer blend is 0.40 to 1.40. Furthermore, an electrically conductive substance may be dispersed in this adhesive layer.
In the case the maximum
. value of the absolute value of the difference in solubility
- parameter values among all segments in the polymer blend is less than 0.4, interfacial peeling occurs due to an increase in cohesive force, thereby resulting in increased susceptibility to the effects of the surface condition of the adherend and causing large fluctuations in peel strength, while in the case the maximum value exceeds 1.40, adequate peel strength is unable to be obtained due to a decrease in cohesive force, thereby resulting in the occurrence of the problem of poor film formation and making this undesirable.
[0025]
Furthermere, at least one type of single segment polymer and multi-segment polymer contained in the polymer blend is preferably a thermally adhesive resin, incompatible resin insoluble in a thermally adhesive resin or antistatic resin.
In addition, all of a thermal adhesive resin, incompatible resin — insoluble in a thermal adhesive resin and antistatic resin are - more preferably contained in the polymer blend. Furthermcre, the polymer blend has a phase-separated structure in such case.
[0026]
Examples of thermal adhesive resins include polyolefin-based resins, polystyrene-based resins, polyester-based resins, vinyl acetate-based resins, polyurethane resins and acrylic resins.
Examples of vinyl acetate-based resins and acrylic resins ( include vinyl chloride-vinyl acetate copolymers, ethylene-acrylic acid copolymers, ethylene-methyl acrylate random ccpolymers, ethylene-methyl methacrylate random copolymers, ethylens-ethyl acrylate random copolymers, ethylene-ethyl methacrylate random copolymers, ethylene-butyl acrylate random copolymers and ethylene-vinyl acetate copolymers. {0027]
Examples of polyolefin~based resins include polyethylene, polypropylene and ethylene-o olefin copolymers.
[0028]
Examples of polystyrene-based resins include polystyrene, styrene-butadiene-styrene block copolymers (SBS), styrene-ethylene-butylene-styrene block copolymers (SEBS), styrene-isoprene~-styrene block copolymers (SIS), oc styrene-ethylene-propylene-styrene block copolymers (SEPS)
E and hydrogenated styrene-butadiene random copolymers (HSBR].
[0029]
Examples of polyester-based resins include polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate. [00301
In the case the thermal adhesive resin is an ethylene-methyl acrylate random copolymer or ethylene-methyl methacrylate { random copolymer, examples of incompatible resins include methyl methacrylate-styrene random copolymers and polystyrene resin.
[0031] among the aforementioned thermal adhesive resins, acrylic resins, polyolefin-based resins and vinyl acetate-based resins are preferable, and among these, ethylene-acrylic acid copolymers, ethylene-methyl methacrylate random copolymers and ethylene-vinyl acetate copclymers are particularly preferable, (00327
Examples of antistatic resins include nonionic polyethers such as polyethylene oxide, crosslinked polyethylene oxides, polyethylene oxide copolymers, polyethylene glycol, polyethylene glycol copolymers (such as . polypropylene-polyethylene glyccl block copolymers) or oT - polyethylene glycol-polyolefin copolymers; quaternary ammonium-based resins such as quaternary ammonium base~containing methacrylate copolymers, quaternary ammonium base-containing maleimide copolymers or quaternary ammonium base-containing methacrylic copolymers; sulfonic acid-based resins such as sodium polystyrene sulfonate; ionomers containing monovalent ions such as potassium; polyethers containing Li ions such as Li ion-containing a. polyether-polyolefin copolymers; polyether ester amide-based resins; ethylene oxide-epichlorhydrin-based resins and polyether ester-based resins.
Among the aforementioned antistatic resins, nonionic polyethers and polyethers containing Li ions are preferable, and among these, polyethylene glycol-polyolefin copolymers and
Li ion-containing polyether-polyolefin copolymers are particularly preferable.
[0033]
The two segments having solubility parameter values used as the basis for calculating the aforementioned maximum value (to be referred to as "specific segments") are preferably contained at 15 parts by weight to 60 parts by weight, and more preferably at 20 parts by weight to 50 parts by weight, based on 100 parts by weight of the polymer blend. In the case of pu being contained at less than 15 parts by weight, sealability oo and antistatic properties cannot be realized simultaneously, while in the case of being contained at greater than 60 parts by weight, sealability or antistatic properties decrease, thereby making this undesirable.
[0034]
The weight ratio of one of the specific segments to the other specific segment is preferably within the range of 30:79 to 70:30. In the case the weight ratio of one of the specific % segments to the other specific segment is less than 30 or greater than 70, sealability or antistatic properties decrease, thereby making this undesirable.
[0035]
Although there are no particular limitations thereon, the thickness of the cover tape 200 is preferably 500 um or less, more preferably 200 pum or less and even more preferably 100 pm or less. In addition, the thickness of the cover tape 200 is preferably 10 pm or more, more preferably 20 um or more and even more preferably 30 pum or more.
[0036]
Examples of methods used to form the adhesive layer 230 on the base material film or intermediate layer 220 include dry lamination and extrusion lamination. Furthermore, extrusion lamination is preferable in consideration of the flexibility
Fo of the base material layer 210. .. [0037] <Carrier Tape (Packaging Container)>
As shown in FIGS. 1 and 2, the carrier tape 300 has pockets 310 and sprocket holes 320 formed therein. {0038]
There are no particular limitations on the material of the carrier tape 300, and examples thereof include various types on of resins such as polystyrene-based resins, polyethylene-based \ resins, polypropylene-based resins, polyester-based resins (such as polyethylene terephthalate resin), and polycarbonate-based resins.
[0039]
Furthermore, in the present embodiment, although the absolute value of the difference between the "solubility parameter value of the main component of the carrier tape 300" and the "solubility parameter value of the adhesive resin of the cover tape 200" is preferably as small as possible, it is at least 1.90 or less and preferably 1.85 or less. Furthermore, a main component as referred to here refers to that accounting for 50% by weight or more of the material that composes the carrier tape 300.
[0040]
An electrically conductive filler such as carbon black, on graphite or carbon fiber is preferably dispersed in the material oo of the carrier tape 300. This electrically conductive filler imparts electrical conductivity te the carrier tape 300 and inhibits the carrier tape 300 from becoming electrically charged. Consequently, an electronic component 400 packaged with the packaging body 100 is not damaged casily by static electricity of the carrier tape 300.
[0041]
As shown in FIG. 1, a plurality of the pockets 310 is formed
C at equal intervals along the lengthwise direction of the carrier tape 300 at those portions that house the electronic component 400. These pockets 310 are formed by, for example, hot press molding, hot vacuum molding or hot pressure molding of a material sheet of the carrier tape 300.
[0042]
Ag shown in FIG. 1, the sprocket holes 320 are a plurality of holes formed at equal intervals along the lengthwise direction of the carrier tape 300. These sprocket holes 320 are formed at locations that are not covered by the cover tape 200 when the cover tape 200 is adhered to the carrier tape 300.
The sprocket holes 320 engage with teeth of a sprocket wheel (not shown). The carrier tape 300 is transported when the sprocket wheel rotates while the sprocket wheel is engaged with the sprocket holes 320. — [0043] “ <Adhesion of Cover Tape and Carrier Tape>
The cover tape 200 is heat-sealed to the carrier tape 300.
This heat sealing is carried out using, for example, a sealer.
Heat sealing is normally carried out over a standard width of 0.3 mm to 1.0 mm along the lengthwise direction of the cover tape 200 so as to pass over both edges of the pockets 310 in the direction of width.
[0044]
C <Peeling of Cover Tape>
As shown in FIGS. 4 and 5, when the cover tape 200 according to the present embodiment is peeled from the carrier tape 300, the adhesive layer 230 undergoes cohesive failure. As aresult, a state results in which a portion of the adhesive layer 230 on the cover tape side is peeled off (see reference symbol RC in FIG. 4), while the remainder RS of the adhesive layer 230 on the carrier tape side remains on the carrier tape 300.
The peel strength of the film (in compliance with the standards when using a carrier tape having a width of 8 mm as described in JIS C-0806-3) with respect to the carrier tape (packaging container) is preferably 0.1 N to 1.0 N and more preferably 0.2 N to 0.7 NWN.
In the case the peel strength is less than 0.1 N, spontaneous peeling occurs easily, while in the case the peel strength
In exceeds 1.0 N, there is increased susceptibility to the occurrence of problems such as an electronic component jumping out of the carrier tape due to vibration of the carrier tape, thereby making this undesirable.
[0045] <Characteristics of Cover Tape According to Present
Embodiment> (1) The cover tape 200 according to the present embodiment undergoes cohesive failure when peeled from the carrier tape
C 300. Consequently, this film is resistant to the effects of the surface condition of an adherend, and in cases in which it is peeled from an adherend after being adhered thereto, fluctuations in peel strength can be reduced.
[0046] (2) In the present embodiment, the absolute value of the difference between the "solubility parameter value of the main component of the carrier tape 300" and the "solubility parameter value of the adhesive resin of the cover tape 200" is 1.90 or less. In general, two materials are more favorably adhered the closer their solubility parameter values. Thus, the carrier tape 300 and the cover tape 200 according to the present embodiment are favorably adhered.
[0047] <Variations> a (A) Although the cover tape 200 according to the previous - embodiment was heat-sealed to the carrier tape 300 through the adhesive layer 230, the cover tape 200 may also be adhered to the carrier tape 300 through an adhesive. Furthermore, in such case, a thermal adhesive resin may not be contained in the adhesive layer. However, even in such a case, the adhesive layer is required to undergo cohesive failure.
[0048] ~ (B) Although the intermediate layer 220 was provided in
L the cover tape 200 according to the previous embodiment, the intermediate layer 220 may also be omitted as was previously described.
[0049] (C} Although not specifically mentioned in the previous embodiment, an antistatic layer may also be separately provided in the cover tape 200. Furthermore, the antistatic layer is preferably provided between the base material layer 210 and the intermediate layer 220 (in the case of a three-layer configuration) or between the base material layer 210 and the adhesive layer 230 (in the case of a two-layer configuration).
Furthermore, examples of the antistatic layer include urethane isocyanate in which alkyl quaternary ammonium ethosulfate and propylene carbonate are dispersed.
[0050] pe (D) Although the adhesive resin in the adhesive layer 230 - of the cover tape 200 according to the previous embodiment was a single segment polymer, the adhesive resin may also be a multi-segment polymer, or in other words, a block copolymer or graft copolymer. In such case, the absolute value of the difference between the "sclubility parameter value of the segment that imparts adhesion" and the "solubility parameter value of the main component of the carrier tape 300" is preferably 1.920 or less.
C [0051]
The following provides more detailed explanations of the cover tape and packaging body according to the present invention by indicating examples and comparative examples. Furthermore, these examples and comparative examples do not 1imit the present invention.
Example 1
1. Preparation of Polymer Blend
An ethylene-methyl acrylate random copolymer (to be referred to as an "EMA segment") (trade name: Elvaloy AC 1820,
Du Pont-Mitsui Polychemicals Co., Ltd.) was prepared for use as an adhesive resin, a methyl methacrylate-styrene random copolymer (to be referred to as an "MS segment") (frade name:
Atorete MM70, Nippon A & L, Inc.) was prepared for use as an pe incompatible resin, and a polypropylene-polyethylene glycol hb block copolymer (to be referred to as a "PP-PEG resin") (trade name: Pelestat 212, Sanyo Chemical Industries, Lid.) was prepared for use as an antistatic resin.
[0053]
Furthermore, the PP-PEG resin comprises a polypropylene segment (to be referred to as a "PP segment") and a polyethylene glycol segment (to be referred to as a "PEG segment”). The copolymerization ratio of the PP-PEG resin (weight ratio) was
C such that the ratio of the PP segment to the PEG segment was 50:50.
[0054] 0 parts by weight of the EMA segment, 10 parts by weight of the MS segment and 30 parts by weight of the PP-PEG segment were mixed, and the mixture thereof was melted and blended using a twin-screw extruder under conditions of a cylinder temperature of 180°C to prepare pellets. Furthermore, in the case of considering the mixing ratio in segment units, the mixed weight ratio of the EMA segment, MS segment, PP segment and PEG segment was 60:10:15:15.
[0055] (1) Details of each Segment
The following describes details of each segment. a) EMA Segment ~ Copolymerization ratic (weight ratio): ethylene:methyl - acrylate = 80:20
Solubility parameter value: §.34-8.51 b) MS Segment
Copolymerization ratio (weight ratic): Methyl methacrylate:styrene = 70:30
Solubility parameter value: 8.95-9.38 c) PP Segment
Solubility parameter value: 8.10
C d) PEG Segment
Solubility parameter value: 8.63
[0056] (2) Absolute Values of Difference in Solubility Parameter
Values between each Segment
The absolute values of the difference in solubility parameter values among all segments in the aforementioned polymer blend were as indicated below.
EMA segment - MS segment: 0.44 (min.), 1.04 {max.)
EMA segment - PP segment: 0.24 (min.), 0.41 (max.)
EMA segment —- PEG segment: 0.12 (min.), 0.29 (max.)
MS segment - PP segment: 0.85 (min.), 1.28 (max.)
MS segment - PEG segment: 0.32 {(min.), 0.75 (max.)
PP segment - PEG segment: 0.53 (min.)
[0057] eo (3) Maximum Value of Absolute Values of Difference in oo Solubility Parameter Values among Segments
The maximum value of the absolute values of the difference in solubility parameter values among the segments was within the range of 0.40 to 1.40 based on a minimum value of 0.85 and amaximum value of 1.28 as indicated above. Furthermore, those segments having solubility parameter values used as the basis for calculating the maximum value were the MS segment and PP segment. The MS segment and PP segment are contained in the
C : polymer blend at 25 parts by weight based on 100 parts by weight of the polymer blend.
[0058] 2. Production of Cover Tape
A hot melt of the aforementioned pellets was extruded onto a polyethylene terephthalate biaxially oriented film (Toyo
Boseki Co., Ltd.) by extrusion lamination to produce a cover tape having a two-layer structure.
[0059] 3. Peel Test (1) Carrier Tape
A carrier tape (A) comprising amixture of 80 parts by weight of impact-resistant polystyrene (trade name: HT516, A & M
Styrene Co., Ltd.}, 5 parts by weight of ethylene-vinyl alcohol copolymer (trade name: Evaflex P2505, Du Pont-Mitsui
Co Polychemicals Co., Ltd.) and 15 parts by weight of carbon black (trade name: Denka Black Particles, Denki Kagaku Kogyo
Kabushiki Kaisha) (to be referred to as "PS carrier tape"), and a carrier tape (B} comprising a mixture of 67 parts by weight of polycarbonate, 22 parts by weight of PCTG (trade name:
SKYGREEN J2003, SK Chemicals Co., Ltd.) and 11 parts by weight of carbon black (trade name: Ketjen Black EC, Ketjen Black
International Co.) (to be referred to as "PC carrier tape") were prepared for use as carrier tape.
C [0060]
Furthermore, the main component of the PS carrier tape is impact-resistant polystyrene, and the solubility parameter value thereof is 8.60 to 9.10. In addition, the main component of the PC carrier tape is polycarbonate, and the solubility parameter value thereof 1s 9.80 to 10.00.
[0061]
Thus, the absolute values of the difference between the
"solubility parameter value of the main component of PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 0.0% and a maximum value of 0.76.
[0062]
In addition, the absolute values of the difference between pu the "solubility parameter value of the main component of the - EC carrier tape” and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 1.29 and maximum value of 1.66.
[0063] {2) Rdhesion of Cover Tape to Carrier Tape
The aforementioned cover tape was heat-sealed to the PS carrier tape and PC carrier tape, respectively. Furthermore, { heat sealing was carried out using a sealer (trade name:
MBM=-4000, Ismeca) under conditions of a sealing temperature of 180°C, sealing time of 0.3 seconds and sealing pressure of 9.8
N.
[0064] {3) Peel Test
Peel strength was taken to be the average load value when the cover tape was peeled from the PC carrier tape at a peeling angle of 165° to 180° in compliance with standards when using a carrier tape having a width of 8 mm as described in JIS C-0806-3.
Furthermore, the peel strength of the cover tape with respect to the PC carrier tape according to the present example was 0.55
N (see Table 1).
In addition, the adhesive layer underwent cohesive failure when the cover tape according to the present example was peeled er from the PC carrier tape and PS carrier tape (see Table 1). - Example 2
[0065]
A cover tape was prepared and a peel test was carried out in the same manner as Example 1 with the exception of using 65 parts by weight of the EMA segment, 5 parts by weight of the
MS segment and 30 parts by weight of the PP-PEG resin.
Furthermore, the MS segment and PP segment were contained at
N 20 parts by weight in the polymer blend based on 100 parts by . weight of the polymer blend.
[0066] {4) Results of Peel Test
The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.53 N.
In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1).
[0067]
Furthermore, the absolute values of the difference between the "solubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum vaiue of 0.09 and maximum value of 0.76. {" [0068]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 1.29 and maximum value of 1.66.
Example 3
[0069] ’ A cover tape was prepared and a peel test was carried out in the same manner as Example 1 with the exception of using a methyl methacrylate-styrene random copolymer (to be referred to as an "MS segment”} (trade name: Estyrene MS600NT, Nippon
Steel Chemical Co., Ltd.) instead of the methyl methacrylate-styrene random copolymer used in Example 1 (trade name: Atorete MM70, Nippon A & L, Inc.). Furthermore, the copclymerization ratio and solubility parameter value of the
MS segment according to the present example were as indicated below.
[0070] (1) Details of MS Segment
Copolymerization ratio (weight ratio): Methyl methacrylate:styrene = 60:40
Solubility parameter value: 8.20-9.34 { [0071] (2) Absolute Values of Difference in Solubility Parameter
Values between each Segment
The absolute values of the difference in solubility parameter values among all segments in the aforementioned polymer blend were as indicated below.
EMA segment - MS segment: 0.39 (min.), 1.00 {(max.)
EMA segment - PP segment: 0.24 (min.), 0.41 {(max.) ~ EMA segment - PEG segment: 0.12 {(minrn.), 0.29 (max.)
MS segment - PP segment: 0.80 (min.), 1.24 (max.)
MS segment - PEG segment: 0.27 (min.), C.71 (max.)
PP segment - PEG segment: 0.53 (min.)
[0072] (3) Maximum Value of Absolute Values of Difference in
Solubility Parameter Values among Segments
The maximum value of the absolute values of the difference in solubility parameter values among the segments was within the range of 0.40 to 1.40 based on a minimum value of 0.80 and a maximum value of 1.24 as indicated above. Furthermore, those segments having solubility parameter values used as the basis for calculating the maximum value were the MS segment and PP segment. The MS segment and PP segment are contained in the polymer blend at 25 parts by welght based on 100 parts by weight cof the polymer blend.
[0073] {4) Results of Peel Test
The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.28 N.
In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1).
[0074]
B Furthermore, the absolute values of the difference between - the "solubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.20 or less based on a minimum vaiue of 0.09 and maximum value of 0.76.
[0075]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.50 or less based on a minimum value of 1.29 and maximum value of 1.66.
Example 4
[0076]
A cover tape was prepared and a peel test was carried out ¢ in the same manner as Example 1 with the exception of using a ) methyl methacrylate-styrene random copolymer (to be referred to as an "MS segment") (trade name: Estyrene MS300, Nippon Steel
Chemical Co., Ltd.) instead of the methyl methacrylate-styrene random copolymer used in Example 1 (trade name: Atorete MM7Q,
Nippon A & L, Inc.). Furthermore, the copolymerization ratio and solubility parameter value of the MS segment according to the present example were as indicated below. . [0077] - } (1) Details of MS Segment
Copolymerization ratio (weight ratio): Methyl methacrylate:styrene = 30:70
Solubility parameter value: 8.75-9.22
[0078] (2) Absolute Values of Difference in Solubility Parameter
Values between each Segment
The absclute values of the difference in solubility parameter values among all segments in the aforementioned polymer blend were as indicated below.
EMA segment - MS segment: 0.24 (min.), 0.88 {(max.)
EMA segment - PP segment: 0.24 (min.), 0.41 {(max.)
EMA segment - PEG segment: 0.12 (min.}, 0.2% {(max.)
MS segment - PP segment: 0.65 (min.), 1.12 (max.)
MS segment - PEG segment: 0.12 (min.}, 0.59 {(max.) 7 PP segment - PEG segment: 0.53 (min.)
[0079] (3) Maximum Value of Absolute Values of Difference in
Solubility Parameifer Values among Segments
The maximum value of the absolute values of the difference in solubility parameter values among the segments was within the range of 0.40 to 1.40 based on a minimum value of 0.65 and a maximum value of 1.12 as indicated above. Furthermore, those
B segments having the solubility parameter values used as the basis for calculating the maximum value were the MS segment and
PP segment. The MS segment and PP segment are contained in the polymer blend at 25 parts by weight based on 100 parts by weight of the polymer blend.
[0080] (4) Results of Peel Test
The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.59 N.
In additicn, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1).
[0081]
Furthermore, the absolute values of the difference between the "solubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA a segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 0.09 and maximum value of 0.76.
[0082]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were » all 1.90 or less based on a minimum value of 1.29 and maximum ~ value of 1.66.
Example 5
[0083]
A cover tape was prepared in the same manner as Example 4 with the exception of using 45 parts by weight of the EMA segment, 25 parts by weight of the MS segment and 30 parts by weight of the PP-PEG resin, and a peel test was carried out in the same manner as Example 1. Furthermore, the MS segment and
PP segment were contained at 40 parts by weight in the polymer blend based on 100 parts by weight of the polymer blend.
[0084] (4) Results of Peel Test
The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.28 N.
In addition, the adhesive layer of the cover tape according to £7 the present example underwent cohesive failure when peeled from } the PC carrier tape and PS carrier tape (see Table 1).
[0085]
Furthermore, the absolute values of the difference between the "sclubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 0.09 and maximum } value cf 0.76. ; - [0086]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 1.29% and maximum value of 1.66.
Example 6
[0087]
A cover tape was prepared in the same manner as Example 4 with the exception of using 35 parts by weight of the EMA segment, 35 parts by weight of the MS segment and 30 parts by weight of the PP-PEG resin, and a peel test was carried out in the same manner as Example 1. Furthermore, the MS segment and
PP segment were contained at 50 parts by weight in the polymer yo blend based on 100 parts by weight of the polymer blend.
B [0088] {4) Results of Peel Test
The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.14 N.
In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1). . [0082] “. Furthermore, the absolute values of the difference between the "solubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 0.09 and maximum value of 0.76.
[0090]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.20 or less based on a minimum value of 1.29 and maximum value of 1.66.
Example 7
[0081]
C: A cover tape was prepared and a peel test was carried out - in the same manner as Example 1 with the exception of using a methyl methacrylate-styrene random copolymer (to be referred to as an "MS segment") (trade name: Estyrene MS200NT, Nippon
Steel Chemical Co., Ltd.) instead of the methyl methacrylate-styrene random copolymer used in Example 1 (trade name: Atorete MM70, Nippon A & IL, Inc.). Furthermore, the copolymerization ratio and solubility parameter value of the
MS segment according to the present example were as indicated = below,
[0092] (1) Details of MS Segment
Copolymerization ratio (weight ratio): Methyl methacrylate:styrene = 20:80
Solubility parameter value: 8.70-9.18
[0093] (2) Absolute Values of Difference in Solubility Parameter
Values between each Segment
The absolute values of the difference in solubility parameter values among all segments in the aforementioned polymer blend were as indicated below.
EMA segment - MS segment: 0.19 (min.), 0.84 (max.)
EMA segment = PP segment: 0.24 {(min.), 0.41 (max.)
EMA segment - PEG segment: 0.12 (min.), 0.29 (max.) — MS segment - PP segment: 0.60 (min.}, 1.08 {max.) ~ MS segment - PEG segment: 0.07 {(min.), 0.55 {(max.)
PP segment - PEG segment: 0.53 {(min.)
[0094] (3) Maximum Value of Absolute Values of Difference in
Solubility Parameter Values among Segments
The maximum value of the absolute values of the difference in solubility parameter values among the segments was within the range of 0.40 to 1.40 based on a minimum value of 0.50 and a a maximum value of 1.08 as indicated above. Furthermore, those segments having solubility parameter values used as the basis for calculating the maximum value were the MS segment and PP segment. The MS segment and PP segment are contained in the polymer blend at 25 parts by weight based on 100 parts by weight of the polymer blend.
[0095] (4) Results of Peel Test
The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.52 N.
In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1). [009¢€]
Furthermore, the absolute values of the difference between , the "solubility parameter value of the main component of the oo PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum vaiue of 0.02 and maximum value of 0.76.
[0097]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape” and the "solubility parameter value of the EMA
C segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 1.29 and maximum value of 1.66.
Example 8
[0098]
A cover tape was prepared in the same manner as Example 7 with the exception of using 35 parts by weight of the EMA segment, 35 parts by weight of the MS segment and 30 parts by weight of the PP-PEG resin, and a peel test was carried out in the same manner as Example 1. Furthermore, the MS segment and
PP segment were contained at 50 parts by weight in the polymer blend based on 100 parts by weight of the polymer blend.
[0099] (4) Results of Peel Test
The peel strength of the cover tape with respect to the = PC carrier tape according to the present example was 0.34 N. - In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1).
[0100])
Furthermore, the absolute values of the difference between the "solubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were
C all 1.50 or less based on a minimum value of 0.09 and maximum value of 0.76.
[0101]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 1.29 and maximum value of 1.66.
Example 9
[0102]
A cover tape was prepared and a peel test was carried out in the same manner as Example 1 with the exception of using polystyrene (to be referred to as an "PS segment”) {trade name:
Toyo Styrol G210C, Toyo Styrene Co., Ltd.) instead of the methyl ro methacrylate-styrene random copolymer used in Example 1 (trade - name: Atcrete MM70, Nippon ZA & IL, Inc.). Furthermore, the solubility parameter value of the PS segment according to the present example was as indicated below.
[0103] (1) Details of PS Segment
Solubility parameter value: 8.60-9.10
[0104] (2) Absolute Values of Difference in Solubility Parameter
C. Values between each Segment
The absolute values of the difference in solubility parameter values among all segments in the aforementioned polymer blend were as indicated below.
EMA segment - PS segment: C.09 (min.), 0.76 (max.)
EMA segment - PP segment: 0.24 (min.), 0.41 (max.)
EMA segment - PEG segment: 0.12 (min.), 0.29 (max.)
PS segment - PP segment: 0.50 (min.), 1.00 (max.)
PS segment — PEG segment: CG.C3 (min.), 0.47 (max.)
PP segment —- PEG segment: 0.53 (min.)
[0105] (3) Maximum Value of Absolute Values of Difference in
Solubility Parameter Values among Segments
The maximum value of the absolute values of the difference in solubility parameter values among the segments was within ~~ the range of 0.40 to 1.40 based on a minimum value of 0.50 and - a maximum value of 1.00 as indicated above. Furthermore, those segments having sclubility parameter values used as the basis for calculating the maximum value were the PS segment and PP segment. The PS segment and PP segment are contained in the polymer blend at 25 parts by weight based on 100 parts by weight of the polymer blend.
[0106] (4) Results of Peel Test
C. The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.57 N.
In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1).
[0107]
Furthermore, the absolute values of the difference between the "solubility parameter value of the main component of the
PS carrier tape™ and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.20 or less based on a minimum value of 0.09 and maximum value of 0.76.
[0108]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the oo PC carrier tape" and the "solubility parameter value of the EMA - segment serving as the adhesive resin of the cover tape" were all 1.50 or less based on a minimum value of 1.29 and maximum value of 1.66.
Example 10
[0109]
A cover tape was prepared and a peel test was carried out in the same manner as Example 1 with the exception of using an ethylene-methyl acrylate random copolymer (to be referred to
C as an "EMA segment") (trade name: Elvaloy AC 1913, Du
Pont-Mitsui Polychemicals Co., Ltd.) instead of the ethylene-methyl acrylate random copolymer (trade name: Elvaloy
AC 1820, Du Pont-Mitsui Polychemicals Co., Ltd.) used in Example 1. Furthermore, the copolymerization ratio and solubility parameter value of the EMA segment according tc the present example were as indicated below.
[0110]
(1) Details of EMA Segment
Copolymerization ratio (weight ratio):
Ethylene:methyl acrylate = 87:13
Solubility parameter value: 8.19-8.37 0111] (2) Absolute Values of Difference in Solubility Parameter
Values between each Segment pe. The absolute values of the difference in solubility - parameter values among all segments in the aforementioned polymer blend were as indicated below.
EMA segment - MS segment: 0.58 {(min.), 1.19 (max.)
EMA segment - PP segment: 0.0% (min.), 0.27 (max.)
EMA segment - PEG segment: 0.26 (min.), 0.44 {(max.)
MS segment - PP segment: 0.85 (min.), 1.28 (max.)
MS segment - PEG segment: 0.32 (min.), 0.75 {max.)
PP segment - PEG segment: 0.53 (min.) { [0112] (3) Maximum Value of Absolute Values of Difference in
Solubility Parameter Values among Segments
The maximum value of the absolute values of the difference in solubility parameter values among the segments was within the range of 0.40 to 1.40 based on a minimum value of 0.85 and a maximum value of 1.28 as indicated above. Furthermore, those segments having solubility parameter values used as the basis for calculating the maximum value were the MS segment and PP segment. The MS segment and PP segment are contained in the polymer blend at 25 parts by weight based on 100 parts by weight of the polymer blend.
[0113] (4) Results of Peel Test
The peel strength of the cover tape with respect to the
Se PC carrier tape according to the present example was 0.26 N. - In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1).
[0114]
Furthermore, the absolute values of the difference between the "solubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were { all 1.90 or less based con a minimum value of 0.23 and maximum value of 0.91.
[0115]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 1.43 and maximum value of 1.81.
Example 11
[0116]
A cover tape was prepared and a peel test was carried out in the same manner as Example 1 with the exception of using an ethylene-methyl methacrylate random copolymer (to be referred to as an "EMMA segment") (trade name: Acryft WH303F, Sumitomo ¢ Chemical Co., Ltd.) instead of the ethylene-methyl acrylate random copolymer (trade name: Elvaloy AC 1820, Du Pont-Mitsuil
Polychemicals Co., Ltd.} used in Example 1. Furthermore, the copolymerization ratio and solubility parameter value of the
EMMA segment according to the present example were as indicated below.
[0117] (1) Details of EMMA Segment , Copolymerization ratio {weight ratio}: Ethylene:methyl ~~ methacrylate = 82:18
Solubility parameter value: 8.12-8.35
[0118] (2) Absolute Values of Difference in Solubility Parameter
Values between each Segment
The absolute values of the difference in solubility parameter values among all segments in the aforementioned polymer blend were as indicated below.
EMMA segment - MS segment: 0.60 {(min.), 1.26 (max.)
EMMA segment - PP segment: 0.02 (min.), 0.25 {(max.)
EMMA segment - PEG segment: 0.28 (min.), 0.51 {(max.)
MS segment = PP segment: 0.85 (min.), 1.28 (max.)
MS segment - PEG segment: 0.32 (min.), 0.75 (max.)
PP segment - PEG segment: 0.53 {(min.)
[0119] ( (3) Maximum Value of Absolute Values of Difference in
Solubility Parameter Values among Segments
The maximum value of the absolute values of the difference in solubility parameter values among the segments was within the range of 0.40 to 1.40 based on a minimum value of 0.85 and a maximum value of 1.28 as indicated above. Furthermore, those segments having solubility parameter values used as the basis for calculating the maximum value were the MS segment and PP segment. The MS segment and PP segment are contained in the
Fo ~- polymer blend at 25 parts by weight based on 100 parts by weight of the polymer blend.
[0120] (4) Results of Peel Test
The peel strength of the cover tape with respect to the
PC carrier tape according to the present example was 0.21 N.
In addition, the adhesive layer of the cover tape according to the present example underwent cohesive failure when peeled from the PC carrier tape and PS carrier tape (see Table 1).
[0121]
Furthermore, the absolute values of the difference between the "solubility parameter value of the main component of the
PS carrier tape" and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 0.25 and maximum
O value of 0.98.
[0122]
In addition, the absolute values of the difference between the "solubility parameter value of the main component of the
PC carrier tape” and the "solubility parameter value of the EMA segment serving as the adhesive resin of the cover tape" were all 1.90 or less based on a minimum value of 1.45 and maximum value of 1.88.
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Ew a on a = ® » a on a oa *» : | | | I 1 3 | | 1
HP wn wn o © Ww Io o I) o = wn © on on [=a] ~~ ~~ r- ~~ ~~ 0 on on
Hw @ © oo @ a @ @ w w © w o 0 =
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Bm = = aw [| i [| — Lal — — ot — ™~ ua gle w wn i) 0 0 0 wn in 10) © = oo © @ @ © w w w @ w wo ©
V | | i | 1 | | i 2 <r = <t <p < < << = x FN © [10 ™ oy oy beard [a2] =) ™ ™ ~~ —t ni a » . . * . . » . - . . gw xa oO ox oD ox wm ow 0 ww «<0 &£
T
— & — w ec | 18 |g |g |£ | |¢ |g |g |g |§ i id = & fz =] i ta & fa a — 0 mw
H
— ot ~ ™ < wn Ww =~ © o 3 = * 5 " x % % % ® 3 i" 54 rd A [4] td 4] 5 od wl 5 Fx)
(Comparative Example 1)
[0123] 1. Production of Cover Tape
A hot melt of an ethylene-methyl acrylate random copolymer (trade name: Elvaloy AC 1820, Du Pont-Mitsui Polychemicals Co.,
Ltd.) was extruded onto a polyethylene terephthalate biaxially oriented film (Toyo Boseki Co., Lid.) by extrusion lamination oT to produce a cover tape. } [0124] 2. Pesl Test
A peel test was carried out in the same manner as the peel test of Example 1.
The adhesive layer of the cover tape according to the present comparative example underwent interfacial peeling when peeled from a carrier tape (see Table 2). ) {Comparative Example 2) he [0125]
A cover tape was prepared and a peel test was carried out in the same manner as Comparative Example 1 with the exception of using an ethylene-methyl acrylate random copolymer (trade name: Elvaloy AC 1913, Du Pont-Mitsui Polychemicals Co., Ltd.) instead of the ethylene-methyl acrylate random copolymer (trade name: Elvaloy AC 1820, Du Pont-Mitsui Polychemicals Co., Ltd.) used in Comparative Example 1.
[0126]
The adhesive layer of the cover tape according to the present comparative example underwent interfacial peeling when peeled from a carrier tape (see Table 2). [Comparative Example 3]
[0127]
A cover tape was prepared and a peel test was carried out ¢" in the same manner as Comparative Example 1 with the exception ) of using an ethylene-methyl methacrylate random copolymer (trade name: Acryft WH303F, Sumitomo Chemical Co., Ltd.) instead of the ethylene-methyl acrylate random copolymer {trade name: Elvaloy AC 1820, Du Pont-Mitsui Polychemicals Co., Ltd.) used in Comparative Example 1.
[0128]
The adhesive layer of the cover tape according to the } present comparative example underwent interfacial peeling when peeled from a carrier tape (see Table 2). [Comparative Example 4]
[0129]
A cover tape was prepared and a peel test was carried out in the same manner as Comparative Example 1 with the exception of using an ethylene-methyl methacrylate random copolymer (trade name: Acryft WK402, Sumitomo Chemical Co., Ltd.) instead of the ethylene-methyl acrylate random copolymer (trade name:
Elvaloy AC 1820, Du Pont-Mitsui Polychemicals Co., Ltd.) used in Comparative Example 1.
[0130]
The adhesive layer of the cover tape according to the present comparative example underwent interfacial peeling when peeled from a carrier tape (see Table 2}. [Comparative Example 5]
Fo [0131] i. 1. Preparation of Polymer Blend
An ethylene-methyl methacrylate random copolymer (to be referred to as an "EMMA segment") (trade name: Acryft WK402Z,
Sumitomo Chemical Co., Ltd.) was prepared for use as an adhesive resin, and polypropylene (to be referred to as a "PP segment") (trade name: J1C6, Grand Polymer Co.) was prepared for use as an incompatible resin. j [0132] - 70 parts by weight of the EMMA segment and 30 parts by weight of the PP segment were mixed, and the mixture thereof was melted and blended using a twin-screw extruder under conditions of a cylinder temperature of 180°C to prepare pellets.
[0133] (1) Details of each Segment
The following describes details of each segment. a} EMMA Segment
Copolymerization ratio (weight ratio): ethylene:methyl methacrylate = 75:25
Solubility parameter value: 8.20-8.45 b) PP Segment
Solubility parameter value: 8.10
[0134] (2) Absolute Value of Difference in Solubility Parameter 7 Values between each Segment
Sn
The absolute value of the difference in solubility parameter values between segments in the aforementioned polymer blend was as indicated below.
EMMA segment —- PP segment: 0.10 (min.}, 0.35 (max.)
[0135] (3) Maximum Value of Absolute Value of Difference in
Solubility Parameter Values between Segments oo The maximum value of the absolute value of the difference ~ in solubility parameter values between the segments was outside the range of 0.40 to 1.40 based on a minimum value of 0.10 and a maximum value of 0.35 as indicated above.
[0136] 2. Production of Cover Tape
A hot melt of the aforementioned pellets was extruded onto a polyethylene terephthalate biaxially oriented film (Toyo
Boseki Co., Ltd.) by extrusion lamination to produce a cover tape having a two-layer structure.
[0137] 3. Peel Test
A peel test was carried out in the same manner as the peel test of Example 1.
The adhesive layer of the cover tape according to the present comparative example underwent interfacial peeling when £ peeled from a carrier tape (see Table 2}.
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[01383
The film according to the present invention is characterized by being resistant to the effects of the surface condition of an adherend and demonstrating only small fluctuations in peel strength in the case of being peeled from the adherend, and is useful, for example, as a cover tape or a covering material for a food package.
[0139] 100 Packaging body 200 Cover tape 230 Adhesive layer (surface layer, thermal adhesive layer) 300 Carrier tape
Claims (5)
1. A film provided with a surface layer having as a main component thereof a polymer blend comprising at least two types of single segment polymers, at least two types of multi-segment polymers, or at least one type of single segment polymer and at least one type of multi-segment polymer, wherein a maximum value of an absolute value of a difference ¢ in solubility parameter values among all segments in the polymer ” blend is 0.40 to 1.40.
2. The filmaccerding to claim l, wherein two specific segments having solubility parameter values serving as a basis for calculating the maximum value are contained at 15 parts by weight to 60 parts by weight based on 100 parts by weight of the polymer blend, and a weight ratio of one specific segment to the other specific segment iswithin a range of 30:70 to 70:30.
) 3. The film according tc claim 1 or 2, wherein at least one type of the segments has thermal adhesiveness, and the surface layer functions as a thermal adhesive layer.
4. A packaging body provided with the film according to claim 3 and a packaging container, an opening of which is covered by the film, wherein the absolute value of the difference between the solubility parameter value of the segment having thermal adhesiveness and the solubility parameter value of the main component of a resin composition that forms a surface around the opening of the packaging container is 1.90 or less.
5. The packaging body according to claim 4, wherein peel strength of the film with respect to the packaging container (as measured in compliance with standards when using a carrier tape having a width of 8 mm as described in JIS C-0806-3) is
0.1 N to 1.0 N. C o % “a
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JPWO2015005330A1 (en) * | 2013-07-09 | 2017-03-02 | 住友ベークライト株式会社 | Cover tape for packaging electronic parts |
JP6201751B2 (en) * | 2013-12-27 | 2017-09-27 | 住友ベークライト株式会社 | Covering tape for packaging |
JP6901712B2 (en) * | 2016-03-16 | 2021-07-14 | 国立研究開発法人産業技術総合研究所 | Packaging material |
CN109790345B (en) * | 2016-09-28 | 2021-02-12 | 住友电木株式会社 | Resin composition, outer sealing tape, and package for electronic component |
CN110770144B (en) * | 2017-06-22 | 2021-10-26 | 住友电木株式会社 | Cover tape and electronic component package |
JP2019204933A (en) * | 2018-05-25 | 2019-11-28 | デクセリアルズ株式会社 | Electronic component supply body and electronic component supply reel |
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US3446269A (en) * | 1966-08-08 | 1969-05-27 | Schloemann Ag | Apparatus for the transporting of the intermediate container of continuous casting machines |
US3953660A (en) * | 1974-03-29 | 1976-04-27 | Tamapoly Co., Ltd. | Surface protective film for plasticized polyvinyl chloride substrates |
US5312862A (en) * | 1992-12-18 | 1994-05-17 | Union Carbide Chemicals & Plastics Technology Corporation | Methods for admixing compressed fluids with solvent-borne compositions comprising solid polymers |
JP3449424B2 (en) * | 1993-02-23 | 2003-09-22 | 電気化学工業株式会社 | Heat sealing film |
JP3449747B2 (en) * | 1993-06-02 | 2003-09-22 | 株式会社クラレ | Resin composition and multilayer structure |
WO1996010056A1 (en) * | 1994-09-26 | 1996-04-04 | Sumitomo Chemical Company, Limited | Rubber-modified styrene resin composition and product of molding thereof |
JPH10249945A (en) * | 1997-03-13 | 1998-09-22 | Asahi Chem Ind Co Ltd | Manufacture of finely porous film and multilayer film |
JPH1192605A (en) * | 1997-09-24 | 1999-04-06 | Sumitomo Chem Co Ltd | Sealant film, lid material and vessel comprising styrene resin composition |
JP2000072884A (en) * | 1998-09-02 | 2000-03-07 | Amino Kagaku Kogyo Kk | Gel elastomer |
JP2002146138A (en) * | 2000-11-15 | 2002-05-22 | Denki Kagaku Kogyo Kk | Electroconductive resin composition |
US7271219B2 (en) * | 2001-01-25 | 2007-09-18 | Sanyo Chemical Industries, Ltd. | Curable resin, curable resin material, curable film, and insulator |
JP2003200990A (en) * | 2002-01-09 | 2003-07-15 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
JP4307302B2 (en) | 2004-03-18 | 2009-08-05 | 電気化学工業株式会社 | Cover tape and carrier tape system |
US20060011509A1 (en) * | 2004-07-14 | 2006-01-19 | White Robert J Jr | Packaging system and method for storing electronic components |
US20090143031A1 (en) * | 2005-03-11 | 2009-06-04 | Peter Shah | Harmonic suppression mixer and tuner |
CN101142082B (en) * | 2005-03-19 | 2010-10-06 | 特里奥凡德国有限公司及两合公司 | Label film for a blow moulding method |
KR100964050B1 (en) * | 2005-05-19 | 2010-06-16 | 닛토덴코 가부시키가이샤 | Laminated tape for packaging material |
US9364215B2 (en) * | 2006-01-26 | 2016-06-14 | Covidien Lp | Medical device package |
KR20070094330A (en) * | 2006-03-17 | 2007-09-20 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Easy releasable carrier tape with high impact strength |
JP5863157B2 (en) * | 2006-12-18 | 2016-02-16 | 日東電工株式会社 | Adhesive sheet |
JP4951484B2 (en) * | 2007-12-12 | 2012-06-13 | ダイセルパックシステムズ株式会社 | Antistatic sheet and molded product for packaging |
JP5208648B2 (en) * | 2008-09-29 | 2013-06-12 | 電気化学工業株式会社 | Cover tape |
JP5296564B2 (en) | 2009-01-28 | 2013-09-25 | 電気化学工業株式会社 | Cover film |
JP2012214252A (en) * | 2010-09-30 | 2012-11-08 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
-
2012
- 2012-03-23 TW TW101110077A patent/TWI564151B/en active
- 2012-03-26 SG SG10201602006VA patent/SG10201602006VA/en unknown
- 2012-03-26 SG SG2013062559A patent/SG193234A1/en unknown
- 2012-03-26 KR KR1020137022285A patent/KR101839175B1/en active IP Right Grant
- 2012-03-26 US US14/000,911 patent/US20140010978A1/en not_active Abandoned
- 2012-03-26 CN CN201280015091.5A patent/CN103459474B/en not_active Expired - Fee Related
- 2012-03-26 WO PCT/JP2012/057715 patent/WO2012133284A1/en active Application Filing
- 2012-03-26 EP EP12765130.5A patent/EP2676992A4/en not_active Withdrawn
- 2012-03-29 JP JP2012078312A patent/JP5884600B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
SG10201602006VA (en) | 2016-04-28 |
KR101839175B1 (en) | 2018-03-15 |
CN103459474B (en) | 2016-02-24 |
KR20140005995A (en) | 2014-01-15 |
EP2676992A1 (en) | 2013-12-25 |
US20140010978A1 (en) | 2014-01-09 |
WO2012133284A1 (en) | 2012-10-04 |
TWI564151B (en) | 2017-01-01 |
JP2012214783A (en) | 2012-11-08 |
CN103459474A (en) | 2013-12-18 |
JP5884600B2 (en) | 2016-03-15 |
TW201240809A (en) | 2012-10-16 |
EP2676992A4 (en) | 2014-09-03 |
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