SG171503A1 - Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water - Google Patents

Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water

Info

Publication number
SG171503A1
SG171503A1 SG201001046-0A SG2010010460A SG171503A1 SG 171503 A1 SG171503 A1 SG 171503A1 SG 2010010460 A SG2010010460 A SG 2010010460A SG 171503 A1 SG171503 A1 SG 171503A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
cooling water
chuck table
vacuum chuck
molding body
Prior art date
Application number
SG201001046-0A
Other languages
English (en)
Inventor
Back Jong Dae
Hwang Eui Doo
Original Assignee
Secron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Secron Co Ltd filed Critical Secron Co Ltd
Publication of SG171503A1 publication Critical patent/SG171503A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
SG201001046-0A 2009-11-26 2010-02-18 Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water SG171503A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020090015344U KR20110005473U (ko) 2009-11-26 2009-11-26 냉각용수 공급이 가능한 반도체소자 절단장치의 진공척테이블

Publications (1)

Publication Number Publication Date
SG171503A1 true SG171503A1 (en) 2011-06-29

Family

ID=44368547

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201001046-0A SG171503A1 (en) 2009-11-26 2010-02-18 Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water

Country Status (4)

Country Link
KR (1) KR20110005473U (ko)
MY (1) MY159597A (ko)
SG (1) SG171503A1 (ko)
TW (1) TWI402933B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102364222B1 (ko) * 2015-05-01 2022-02-18 삼성디스플레이 주식회사 작업 테이블
KR101829039B1 (ko) * 2017-11-22 2018-03-29 박미경 베큠척

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1022779A1 (en) * 1999-01-19 2000-07-26 Meco Equipment Engineers B.V. Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03183151A (ja) * 1989-12-12 1991-08-09 Denki Kagaku Kogyo Kk 静電チャック板
US5192849A (en) * 1990-08-10 1993-03-09 Texas Instruments Incorporated Multipurpose low-thermal-mass chuck for semiconductor processing equipment
KR20060131261A (ko) * 2005-06-15 2006-12-20 삼성전자주식회사 반도체 제조장치의 척 어셈블리
KR20080032396A (ko) * 2006-10-09 2008-04-15 한미반도체 주식회사 척테이블
JP2009113145A (ja) * 2007-11-06 2009-05-28 Disco Abrasive Syst Ltd 研磨装置のチャックテーブル機構

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1022779A1 (en) * 1999-01-19 2000-07-26 Meco Equipment Engineers B.V. Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s)

Also Published As

Publication number Publication date
MY159597A (en) 2017-01-13
KR20110005473U (ko) 2011-06-01
TW201118976A (en) 2011-06-01
TWI402933B (zh) 2013-07-21

Similar Documents

Publication Publication Date Title
TWI246125B (en) Releasing method and releasing apparatus of work having adhesive tape
ATE439222T1 (de) Werkzeugmaschine zur bearbeitung von platten
JP2011049398A5 (ja) レーザ照射装置
MY148793A (en) Adjustable pillow device
AR078700A1 (es) Metodo de fabricacion y aparato de fabricacion de cuerpo absorbente
DE502007006545D1 (de) Halteanordnung für werkstücke
MX2010000615A (es) Sistema de esmerilado y pulido para paredes de piedra.
PL2318175T3 (pl) Indukcyjne urządzenie mocujące do mocowania i odłączania narzędzi
MY173967A (en) Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism
TW200705515A (en) Plasma treatment device
EP2116325A4 (en) MACHINE TOOL
EP2036856A3 (en) Clean bench and method of producing raw material for single crystal silicon
TW200721342A (en) Wafer holder for wafer prober and wafer prober equipped with the same
TW200943468A (en) Plasma processing device
SG171503A1 (en) Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water
TW200743145A (en) Semiconductor apparatus and clean unit thereof
TW200746235A (en) Table for cutting sheet
WO2009001889A1 (ja) チャックテーブルおよび被加工物検査装置
MX2014008257A (es) Dispositivo de montaje de boton y metodo de montaje del boton.
ATE536952T1 (de) Werkzeugmaschine
TW200724383A (en) Printing device and printing method using the same
SI2353779T1 (sl) Razmestitev držala rezalnega orodja
MY156751A (en) Cutting and grinding apparatus
ATE473825T1 (de) Vorrichtung zum fräsen eines profils sowie halter und fräswerkzeug dafür
TH128641B (th) แผ่นหมอนรองสุญญากาศของเครื่องสำหรับตัดอุปกรณ์สารกึ่งตัวนำซึ่งสามารถ จ่ายน้ำหล่อเย็นได้