SG171503A1 - Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water - Google Patents

Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water

Info

Publication number
SG171503A1
SG171503A1 SG201001046-0A SG2010010460A SG171503A1 SG 171503 A1 SG171503 A1 SG 171503A1 SG 2010010460 A SG2010010460 A SG 2010010460A SG 171503 A1 SG171503 A1 SG 171503A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
cooling water
chuck table
vacuum chuck
molding body
Prior art date
Application number
SG201001046-0A
Inventor
Back Jong Dae
Hwang Eui Doo
Original Assignee
Secron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Secron Co Ltd filed Critical Secron Co Ltd
Publication of SG171503A1 publication Critical patent/SG171503A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Abstract

A vacuum chuck table is provided in an apparatus for cutting a semiconductor device molding body and configured to support the semiconductor device molding body. The vacuum chuck table comprises a chuck base, support units adhered to a top surface of the chuck base and configured to support the semiconductor device molding body, and cooling water supply units configured to supply cooling water. A plurality of vacuum holes is formed in the support units. Air is adsorbed through the vacuum holes and so the semiconductor device molding body is adsorbed to the support units. The cooling water is supplied through the cooling water supply units, thereby removing heat generated when the semiconductor device molding body is cut.
SG201001046-0A 2009-11-26 2010-02-18 Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water SG171503A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020090015344U KR20110005473U (en) 2009-11-26 2009-11-26 Vacuum chuck table of sawing apparatus of semiconductor device supplying cooling water

Publications (1)

Publication Number Publication Date
SG171503A1 true SG171503A1 (en) 2011-06-29

Family

ID=44368547

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201001046-0A SG171503A1 (en) 2009-11-26 2010-02-18 Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water

Country Status (4)

Country Link
KR (1) KR20110005473U (en)
MY (1) MY159597A (en)
SG (1) SG171503A1 (en)
TW (1) TWI402933B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102364222B1 (en) * 2015-05-01 2022-02-18 삼성디스플레이 주식회사 Worktable
KR101829039B1 (en) * 2017-11-22 2018-03-29 박미경 Vacuum Chuck

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1022779A1 (en) * 1999-01-19 2000-07-26 Meco Equipment Engineers B.V. Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03183151A (en) * 1989-12-12 1991-08-09 Denki Kagaku Kogyo Kk Electrostatic chuck plate
US5192849A (en) * 1990-08-10 1993-03-09 Texas Instruments Incorporated Multipurpose low-thermal-mass chuck for semiconductor processing equipment
KR20060131261A (en) * 2005-06-15 2006-12-20 삼성전자주식회사 Chuck assembly for a semiconuctor fabricating apparatus
KR20080032396A (en) * 2006-10-09 2008-04-15 한미반도체 주식회사 A chuck table
JP2009113145A (en) * 2007-11-06 2009-05-28 Disco Abrasive Syst Ltd Chuck table mechanism of polishing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1022779A1 (en) * 1999-01-19 2000-07-26 Meco Equipment Engineers B.V. Method and device for separating products, mounted on a common substrate, from each other, along (a) cutting line(s)

Also Published As

Publication number Publication date
MY159597A (en) 2017-01-13
KR20110005473U (en) 2011-06-01
TW201118976A (en) 2011-06-01
TWI402933B (en) 2013-07-21

Similar Documents

Publication Publication Date Title
TWI246125B (en) Releasing method and releasing apparatus of work having adhesive tape
ATE439222T1 (en) MACHINE TOOL FOR PROCESSING PLATES
JP2011049398A5 (en) Laser irradiation device
MY148793A (en) Adjustable pillow device
AR078700A1 (en) METHOD OF MANUFACTURING AND MANUFACTURING EQUIPMENT OF ABSORBENT BODY
DE502007006545D1 (en) HOLDER ARRANGEMENT FOR WORKPIECES
MX2010000615A (en) Stone wall grinding and polishing system.
PL2318175T3 (en) Inductive clamping device for clamping and unclamping tools
MY173967A (en) Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism
TW200705515A (en) Plasma treatment device
EP2116325A4 (en) Machine tool
EP2036856A3 (en) Clean bench and method of producing raw material for single crystal silicon
TW200721342A (en) Wafer holder for wafer prober and wafer prober equipped with the same
TW200943468A (en) Plasma processing device
SG171503A1 (en) Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water
TW200743145A (en) Semiconductor apparatus and clean unit thereof
TW200746235A (en) Table for cutting sheet
WO2009001889A1 (en) Chuck table and work inspecting apparatus
MX2014008257A (en) Button mounting device and button mounting method.
ATE536952T1 (en) MACHINE TOOL
TW200724383A (en) Printing device and printing method using the same
SI2353779T1 (en) Cutting tool holder arrangement
MY156751A (en) Cutting and grinding apparatus
ATE473825T1 (en) DEVICE FOR MILLING A PROFILE AND HOLDER AND MILLING TOOL THEREFOR
TH128641B (en) Machine vacuum pads for cutting semiconductor devices which can Can supply coolant