MY159597A - Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water - Google Patents

Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water

Info

Publication number
MY159597A
MY159597A MYPI2010001013A MYPI2010001013A MY159597A MY 159597 A MY159597 A MY 159597A MY PI2010001013 A MYPI2010001013 A MY PI2010001013A MY PI2010001013 A MYPI2010001013 A MY PI2010001013A MY 159597 A MY159597 A MY 159597A
Authority
MY
Malaysia
Prior art keywords
semiconductor device
cooling water
chuck table
vacuum chuck
apparatus capable
Prior art date
Application number
MYPI2010001013A
Inventor
Jong Dae Back
Eui Doo Hwang
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of MY159597A publication Critical patent/MY159597A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

A VACUUM CHUCK TABLE IS PROVIDED IN AN APPARATUS FOR CUTTING A SEMICONDUCTOR DEVICE MOLDING BODY AND CONFIGURED TO SUPPORT THE SEMICONDUCTOR DEVICE MOLDING BODY. THE VACUUM CHUCK TABLE (200) COMPRISES A CHUCK BASE (220), SUPPORT UNITS (240) ADHERED TO A TOP SURFACE OF THE CHUCK BASE (220) AND CONFIGURED TO SUPPORT THE SEMICONDUCTOR DEVICE MOLDING BODY (110), AND COOLING WATER SUPPLY UNITS (210) CONFIGURED TO SUPPLY COOLING WATER (500). A PLURALITY OF VACUUM HOLES (400) IS FORMED IN THE SUPPORT UNITS (240). AIR IS ADSORBED THROUGH THE VACUUM HOLES (400) AND SO THE SEMICONDUCTOR DEVICE MOLDING BODY (110) IS ADSORBED TO THE SUPPORT UNITS (240). THE COOLING WATER (500) IS SUPPLIED THROUGH THE COOLING WATER SUPPLY UNITS (210), THEREBY REMOVING HEAT GENERATED WHEN THE SEMICONDUCTOR DEVICE MOLDING BODY (110) IS CUT.
MYPI2010001013A 2009-11-26 2010-03-09 Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water MY159597A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020090015344U KR20110005473U (en) 2009-11-26 2009-11-26 Vacuum chuck table of sawing apparatus of semiconductor device supplying cooling water

Publications (1)

Publication Number Publication Date
MY159597A true MY159597A (en) 2017-01-13

Family

ID=44368547

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010001013A MY159597A (en) 2009-11-26 2010-03-09 Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water

Country Status (4)

Country Link
KR (1) KR20110005473U (en)
MY (1) MY159597A (en)
SG (1) SG171503A1 (en)
TW (1) TWI402933B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102364222B1 (en) * 2015-05-01 2022-02-18 삼성디스플레이 주식회사 Worktable
KR101829039B1 (en) * 2017-11-22 2018-03-29 박미경 Vacuum Chuck

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03183151A (en) * 1989-12-12 1991-08-09 Denki Kagaku Kogyo Kk Electrostatic chuck plate
US5192849A (en) * 1990-08-10 1993-03-09 Texas Instruments Incorporated Multipurpose low-thermal-mass chuck for semiconductor processing equipment
NL1011077C2 (en) * 1999-01-19 2000-07-20 Meco Equip Eng Method and device for separating products formed with a common carrier along a cutting line (s).
KR20060131261A (en) * 2005-06-15 2006-12-20 삼성전자주식회사 Chuck assembly for a semiconuctor fabricating apparatus
KR20080032396A (en) * 2006-10-09 2008-04-15 한미반도체 주식회사 A chuck table
JP2009113145A (en) * 2007-11-06 2009-05-28 Disco Abrasive Syst Ltd Chuck table mechanism of polishing device

Also Published As

Publication number Publication date
SG171503A1 (en) 2011-06-29
KR20110005473U (en) 2011-06-01
TWI402933B (en) 2013-07-21
TW201118976A (en) 2011-06-01

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