MY159597A - Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water - Google Patents
Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling waterInfo
- Publication number
- MY159597A MY159597A MYPI2010001013A MYPI2010001013A MY159597A MY 159597 A MY159597 A MY 159597A MY PI2010001013 A MYPI2010001013 A MY PI2010001013A MY PI2010001013 A MYPI2010001013 A MY PI2010001013A MY 159597 A MY159597 A MY 159597A
- Authority
- MY
- Malaysia
- Prior art keywords
- semiconductor device
- cooling water
- chuck table
- vacuum chuck
- apparatus capable
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 239000000498 cooling water Substances 0.000 title abstract 5
- 238000000465 moulding Methods 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
A VACUUM CHUCK TABLE IS PROVIDED IN AN APPARATUS FOR CUTTING A SEMICONDUCTOR DEVICE MOLDING BODY AND CONFIGURED TO SUPPORT THE SEMICONDUCTOR DEVICE MOLDING BODY. THE VACUUM CHUCK TABLE (200) COMPRISES A CHUCK BASE (220), SUPPORT UNITS (240) ADHERED TO A TOP SURFACE OF THE CHUCK BASE (220) AND CONFIGURED TO SUPPORT THE SEMICONDUCTOR DEVICE MOLDING BODY (110), AND COOLING WATER SUPPLY UNITS (210) CONFIGURED TO SUPPLY COOLING WATER (500). A PLURALITY OF VACUUM HOLES (400) IS FORMED IN THE SUPPORT UNITS (240). AIR IS ADSORBED THROUGH THE VACUUM HOLES (400) AND SO THE SEMICONDUCTOR DEVICE MOLDING BODY (110) IS ADSORBED TO THE SUPPORT UNITS (240). THE COOLING WATER (500) IS SUPPLIED THROUGH THE COOLING WATER SUPPLY UNITS (210), THEREBY REMOVING HEAT GENERATED WHEN THE SEMICONDUCTOR DEVICE MOLDING BODY (110) IS CUT.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020090015344U KR20110005473U (en) | 2009-11-26 | 2009-11-26 | Vacuum chuck table of sawing apparatus of semiconductor device supplying cooling water |
Publications (1)
Publication Number | Publication Date |
---|---|
MY159597A true MY159597A (en) | 2017-01-13 |
Family
ID=44368547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2010001013A MY159597A (en) | 2009-11-26 | 2010-03-09 | Vacuum chuck table of semiconductor device cutting apparatus capable of supplying cooling water |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR20110005473U (en) |
MY (1) | MY159597A (en) |
SG (1) | SG171503A1 (en) |
TW (1) | TWI402933B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102364222B1 (en) * | 2015-05-01 | 2022-02-18 | 삼성디스플레이 주식회사 | Worktable |
KR101829039B1 (en) * | 2017-11-22 | 2018-03-29 | 박미경 | Vacuum Chuck |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03183151A (en) * | 1989-12-12 | 1991-08-09 | Denki Kagaku Kogyo Kk | Electrostatic chuck plate |
US5192849A (en) * | 1990-08-10 | 1993-03-09 | Texas Instruments Incorporated | Multipurpose low-thermal-mass chuck for semiconductor processing equipment |
NL1011077C2 (en) * | 1999-01-19 | 2000-07-20 | Meco Equip Eng | Method and device for separating products formed with a common carrier along a cutting line (s). |
KR20060131261A (en) * | 2005-06-15 | 2006-12-20 | 삼성전자주식회사 | Chuck assembly for a semiconuctor fabricating apparatus |
KR20080032396A (en) * | 2006-10-09 | 2008-04-15 | 한미반도체 주식회사 | A chuck table |
JP2009113145A (en) * | 2007-11-06 | 2009-05-28 | Disco Abrasive Syst Ltd | Chuck table mechanism of polishing device |
-
2009
- 2009-11-26 KR KR2020090015344U patent/KR20110005473U/en not_active Application Discontinuation
-
2010
- 2010-02-11 TW TW099104394A patent/TWI402933B/en active
- 2010-02-18 SG SG201001046-0A patent/SG171503A1/en unknown
- 2010-03-09 MY MYPI2010001013A patent/MY159597A/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG171503A1 (en) | 2011-06-29 |
KR20110005473U (en) | 2011-06-01 |
TWI402933B (en) | 2013-07-21 |
TW201118976A (en) | 2011-06-01 |
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