201118976 六、發明說明： 【發明所屬之技彳衧销城】 相關申請案之交互參照 對November 26，2009提申之韓國新型申請案 2009-15344號之優先權，其整體揭示内容以參照方式併入 本案。 發明領域 本發明係關於可供應冷卻水之半導體元件切割設備的 真空夾頭座且，更尤其，關於可使用冷卻水來冷卻在半導 體元件模體中使用切割刀片切割該半導體元件^體時所產 生的熱之半導體元件切割設備的真空夾頭座。 I：先前技術3 發明背景 通常’半導體元件模體係藉由以接著劑將半導體晶片 黏附至電路板或引線框安裝板之晶粒接合製程、連接設置 在半導體晶片上的晶片塾與引線框或電路板引線之佈線接 合製程、半導體晶片周圍内部電路與其他構件之模鑄製裎 製得。 製得的半導體元件模體被輸送至半導體元件切割設備 並隨後切割成半導體元件（亦即個別半導體晶片單元）。用於 切割半導體元件的6又備係配有被構形成吸著並支承半導體 元件模體的真空夾頭座，以使用切割刀片將半導體元件模 體切成半導體晶片° 然而，在具有引線形成於其側面上之半導體元件模 201118976 體中’當以切割刀片切割生 …牛導體元件模體時，熱會從半 導體元件模體側面產生。 &有真空夾頭座並無冷卻半導體 元件模體的功能。因此，全 兔屬引線被半導體元件模體產生 的熱熔化，而和其他引線夤 失 惠疊’導致諸如污損或熔化之缺 【明内】 發明概要 因此，本發明已針對I< %則技術所發生的上述問題來進 行’而本發明之-目的係提供半導體元件切割設備的真空 炎頭座纟可使用冷卻水來冷卻在半導體元件模體中使用 切割刀片切割該半導體元件__產生的熱。 為達上述目的，根據本發明，提供有-種真空夾頭座， 其設置在詩_半導體元件模體的設備巾並構形成支承 半導體以帽體。該真空_座包含—㈣底座；支承單 7L ’其附著至㈣底座頂面並構形成支科導體元件模 體’及冷部水供應單元’其構形成供應冷卻水 。複數個真 空孔形成在支承單元内。空氣經由真空孔被吸收，俾使半 導體元件模It吸著至支承單元^冷卻水經由冷卻水供應單 元供應，藉此移除切割半導體元件模體時所產生的熱。 該支承單元可由橡膠製成。 該冷卻水供應單元可包含複數個水平冷卻水管線，其 平行於炎頭底座形成；及複數個垂直冷卻水管線，其分別 以垂直方向形成在水平冷卻水管線上側並構形成供應冷卻 201118976 支承單元溝槽可形成在個別支承單元上側。該支承溝 槽容許用於切割半導體元件之設備的切割刀片進入彼内並 切割半導體元件模體。冷卻水係經由支承溝槽供應，藉此 移除切割半導體元件模體時所產生的熱。 該真空夾頭座可又包含一夾頭底座支承體，其具有形 成於彼中央之真空孔並支承夹頭底座。 該支承單元可具有HslO至Hs55之硬度。 該支承單元可具有Hs60至Hs95之硬度。 為達上述目的，根據本發明，提供有一種真空夾頭座， 其設置在用於切割半導體元件模體的設備中並構形成支承 半導體元件模體。該真空夾頭座包含一夾頭底座；第二支 承單元，其附著至夾頭底座頂面；第一支承單元，其分別 附著至第二支承單元頂面並構形成支承半導體元件模體， 相比於第二支承單元材料，第—支承單㈣由具較低石更度 之材料製成；及冷卻水供應單元，其卿成供應冷卻水。 複數個真空⑽形成在第-與第二支承單元内。空氣經由 真空孔被吸收，俾使半導體元件模體吸著至第一支承單 元。冷卻水經由冷卻水供應單元供應，藉此移除切割半= 體元件模體時所產生的熱。 邊第一支承單7L與第二支承單元可由橡膠材料製成。 該冷卻水供應單元可包含複數個水平冷卻水管線，其 平行於爽頭底座形成；及複數個垂直冷卻水管線，其分別 以垂直方向賴在水平冷卻水H㈣卿成供應冷卻 201118976 支承單元溝槽係形成在個別支承單元上側。該支承溝 槽容許用於切割半導體元件之設備的切割刀片進入彼内並 切割半導體元件模體。冷卻水係經由支承溝槽供應，藉此 移除切割半導體元件模體時所產生的熱。 該真空夾頭座可又包含一夾頭底座支承體，其具有形 成於彼中央之真空孔並支承夾頭底座。 第一支承單元可具有HslO至Hs55之硬度。 第二支承單元可具有Hs60至Hs95之硬度。 圖式簡單說明 本發明的其他目的與優點可由下列詳細說明連同隨附 圖式而更完整地理解，其中： 第1圖為展示根據本發明第一具體例之可供應冷卻水 之半導體元件切割設備的真空夾頭座的透視圖； 第2圖為展示根據本發明第一具體例之半導體元件切 割設備的真空夾頭座的平面圖； 第3圖為沿著第2圖D-D線所取的真空夾頭座截面圖； 第4圖是根據本發明第一具體例之真空夾頭座中的支 承單元的細部頂視圖； 第5圖是沿著第4圖K-K線所取的第一支承單元截面圖； 第6圖展示根據本發明第二具體例之可供應冷卻水之 半導體元件切割設備的真空夾頭座的透視圖； 第7圖是沿著第6圖B-B線所取的真空夾頭座截面圖；及 第8圖為展示使用根據本發明第一具體例之半導體元 件切割設備的真空夾頭座的實施例之圖。 201118976 【實施冷式3 較佳實施例之詳細說明 隨後’將參照所附圖式詳細說明本發明的一些具體例。 第1圖為展示根據本發明第一具體例之可供應冷卻水 之半導體元件切割設備的真空夾頭座的透視圖。第2圖為展 示根據本發明第一具體例之半導體元件切割設備的真空夾 頭座的平面圖。第3圖為沿著第2圖D-D線所取的真空夾頭座 截面圖。 如第1至3圖所示，真空夾頭座2〇〇包括夾頭底座220、 各別置於夾頭底座220頂面並構形成支承半導體元件模體 110的支承單元240、構形成供應冷卻水的冷卻水供應單元 210、和構形成支承夾頭底座22〇並具有大真空孔400形成於 其中央的夾頭底座支承體230。 夾頭底座220構成真空夾頭座200的本體並有複數個真 空孔400形成於其中。真空孔4〇〇係構形成穿透夾頭底座 220。 複數個真空孔4〇〇係形成於支承單元240内。一真空吸 入器（未顯示）經由真空孔400吸取空氣，俾使半導體元件模 體110吸著至支承單元240。 支承單元240提供真空夾頭座穩定性，使得半導體元件 模體不被側向切割壓力推動。 支承單元240各被構形成具有形成於彼内之真空孔400 並和夹頭底座220耦合。支承單元240的真空孔400係對應於 夾頭底座220的個別真空孔400。支承單元溝槽241係形成在 201118976 支承單元240上側《支承溝槽241可使半導體元件切割設備 的切割刀片進入彼内並切割半導體元件模體11〇。再者’冷 卻水係經由支承溝槽241供應’藉此移除切割半導體元件模 體110時所產生的熱^ 夾頭底座220較佳由鐵製成，而支承單元24〇可由橡膠 製成。支承單元240可具有HslO至Hs55或Hs60至Hs95之硬 度。 冷卻水供應單元210包括平行於夾頭底座220形成的複 數個水平冷卻水管線211和垂直於夾頭底座2 2 〇形成的複數 個垂直冷卻水管線212。垂直冷卻水管線212係形成在個別 水平冷卻水管線211的上側並構形成供應冷卻水。垂直冷卻 水管線212係形成在夾頭底座22〇與支承單元24〇内。經由冷 卻水供應單元210供應的冷卻水係用於移除切割半導體元 件模體110時所產生的熱。 第4圖是根據本發明第一具體例之真空夾頭座中的支 承單元的細部頂視圖，第5圖是沿著第4圖K-K線所取的第一 支承單元截面圖。 如第4與5圖所示，冷卻水係經由水平冷卻水管線211供 應並經由垂直冷卻水管線212到達支承單元溝槽241。到達 支承單元溝槽241的冷卻水係用於移除半導體元件切割設 備的切割刀片切割半導體元件模體丨10時所產生的熱。如第 4圖所示，支承單元溝槽241係形成為圍繞各別真空孔4〇〇。 第6圖展示根據本發明第二具體例之可供應冷卻水之 半導體元件切割設備的真空夾頭座的透視圖，第7圖是沿著 8 201118976 第6圖B-B線所取的真空夾頭座戴面圖。 如第6與7圖所示，和第—具體例相比，根據第二具體 例之半導體元件切割設備的真空夾頭座又包括第二支承單 凡250。根據第二具體例的真空夾頭座2〇〇包括夾頭底座 220、耦合至夾頭底座220頂面的第二支承單元25〇、分別附 著至第二支承單元250頂面並構形成支承半導體元件模體 110的第一支承單元240、構形成供應冷卻水的冷卻水供應 單兀210、和構形成具有大真空孔400形成於其中央並支承 夾頭底座220的夾頭底座支承體23〇。在此，構成第一支承 單元240的材料具有比構成第二支承單元25〇的材料較低的 硬度。 夾頭底座220、第一支承單元24〇、冷卻水供應單元 21 〇、及夾頭底座支承體2 3 〇係具有和第一具體例相同的構 形，為簡化省略其說明。複數個真空孔4〇〇係形成在各別第 二支承單兀250内。第二支承單元25〇的真空孔4〇〇係耦合至 第一支承單兀240的個別真空孔4〇〇一真空吸入器（未顯示） 經由真空孔400吸取空氣，俾使半導體元件模體11〇吸著至 第一支承單元240。又，用於供應冷卻水的複數個垂直冷卻 水官線212係形成在各別第二支承單元25〇内。垂直水平冷 卻水管線212係形成在各別第一支承單元24〇内並和個別水 平冷卻水管線211耦合。因此，冷卻水係經由水平冷卻水管 線211與垂直水平冷卻水管線212供應。 第二支承單元250係由具有—較佳—Hs6〇至Hs95硬度 之硬橡膠製成。第二支承單元25〇係分別耦合至第一支承單 201118976 元240的下側以吸著並支承半導體元件模體11〇。因此，第 二支承單元250提供真空夾頭座200穩定性，以防止半導體 元件模體110被側向切割壓力推動。 第一支承單元240係由具有一較佳一HslO至Hs55硬度 之軟橡膠製成。半導體元件模體110係配置座落於第一支承 單元240的頂面。第一支承單元240吸著並支承半導體元件 模體110。由於第一支承單元240係由軟性材料製成，所以 半導體元件模體座落並吸著至第一支承單元240時所生成 的震動可減至最小。 再者，第一支承單元240與第二支承單元250係藉由樹 脂黏著材料附著在一起。因此，第一支承單元240與第二支 承單元250附著在一起時的黏著性可增強，因該等係由相同 橡膠材料製成。 同時，半導體元件模體110係由塑膠等等製成，並可彎 折約1 mm。當如上述般彎折的半導體元件模體11〇吸著至平 坦表面時，彎折的半導體元件模體11〇係恢復至其原始位置 並經受和半導體元件模體11 〇彎折方向呈相反方向的彎折 力。換言之，假設半導體元件模體彎折了約i mm，當其吸 著至平坦表面時，半導體元件模體則恢復至其原始位置約i mm。因此，在恢復過程期間有半導體元件模體11〇被施加 於其的外力損壞的可能性。 然而，在本發明具體例中，當半導體元件模體被吸著 時，由軟性材料製成的第一支承單元24〇承受了半導體元件 模體110的若干彎折現象。因此，可防止外力在吸著時施加 10 201118976 於半導體元件模體110。 更詳細地說，假設半導體元件模體110彎折了 1 mm，因 為第一支承單元240柔軟性的緣故，半導體元件模體110可 以半導體元件模體110彎折約0.5 m m的狀態被吸著至第一 支承單元240的頂面。因此，儘管半導體元件模體110彎折 了 1 mm，假使半導體元件模體110可在被吸著至第一支承單 元240的頂面時以僅約0.5 mm就恢復至其原始位置，半導體 元件模體110不會經受外力。 又，如上述般彎折的半導體元件模體110係配置置放至 平坦表面上。當彎折的半導體元件模體110開始被吸著至第 一支承單元240的頂面時，半導體元件模體110的特定部分 會和該平坦表面接觸。在此狀態下，當半導體元件模體110 恢復至其原始位置時，和平坦表面接觸並對平坦表面具較 少摩擦力的半導體元件模體110局部的一部分可能會滑 動，所以半導體元件模體位置可能改變。假使半導體元件 模體110的配置狀態因為半導體元件模體110位置改變而被 破壞，則在半導體元件模體110吸著至平坦表面後進行的切 割製程時，切割精確度可能降低。 第一支承單元240係如上述般由軟性材料製成。因此， 第一支承單元240在吸著前對半導體元件模體110具有少量 恢復性與高摩擦力。由於可防止半導體元件模體110在吸著 至第一支承單元240時滑動，故可防止半導體元件模體110 位置改變。假使如上述般防止了半導體元件模體110的位置 改變，則切割精確度可改善。 11 201118976 同時，第一支承單元240具有一較佳一0.1 mm至1.〇 mm 之厚度。如上所述’第一支承單元240係由具有HslO至Hs55 硬度之橡膠材料製成。第一支承單元240的厚度係較佳隨著 橡膠材料硬度增加而增加。 然而，假使第一支承單元240具有大於1.0 mm的厚度， 儘管具有Hs55之硬度，但當對被吸著並受支承的半導體元 件模體進行切割製程時，因為第一支承單元240由軟性材料 製成的緣故’半導體元件模體110可能被切割刀片的側向切 割壓力推動。因此，切割精確度可能降低。 又’假使第一支承單元240具有小於〇· 1 mm的厚度，儘 管具有HslO之硬度’但半導體元件模體11〇的灣折不能被充 分承受，半導體元件模體110不能穩定地置放且半導體元件 模體110的吸收震動不能被充分吸收。 複數個真空孔400係形成得穿透夾頭底座22〇與第二支 承單元250的頂面與底面，以吸收並支承座落配置在第一支 承單元240頂面的半導體元件模體丨1〇。複數個真空孔4〇〇係 形成得俾使半導體元件模體110被切割刀片切割且真空孔 400可吸著半導體晶片單元之個別半導體元件。亦即，真空 孔400的位置與數目係對應於半導體晶片單元之個別半導 體元件的位置與數目。 形成在第一支承單元2 4 〇内的複數個真空孔4 〇 〇係和形 成在第二支承單元250内的複數個個別真空孔400相通。由 於形成在第一支承單元240内的真空孔4〇〇和形成在第二支 承單元250内的複數個個別真空孔4〇〇相通，所以形成了從 12 201118976 夾頭底座220底®穿逶至第—支承單元2侧面的複數個空 氣導管。 在本發明較佳具體例中，形成在第二支承單元25 0内的 複數個真空孔4 G G係形成得穿透夾頭底座2 2 Q與第二支承單 元25〇的頂面與底面。形成在夾頭底座支承體2辦央的大 真空孔400係耦合至形成在第二支承單元25〇内的真空孔 _°儘管例# 了真空吸入器（未顯示)耦合至形成在失頭底 座支承體2则的冑空孔_，但本發明不限於真空孔4〇〇麵 合至真空吸入器（未顯示）之例。 第8圖為展不使用根據本發明第一具體例之半導體元 件切割設備的真空夾頭座的實施例之圖。如第8圖所示，半 導體元件模體11G可被半導體元件切割設備的切割刀片3 〇 〇 所切。假使切割製程產生熱，則冷卻水5〇〇喷出，俾使冷卻 文熱半導體兀件模體110與I導體元件切割設備的受熱切 割刀片300。 如上所述，本發明之益處在於可使用冷卻水移除半導 體元件切割設備的切割刀片切割半導體元件模體時所產生 的熱。 由於受熱半導體元件模體被冷卻，所以缺失部位—例 如又熱熔化的金屬引線與其他引線重疊所產生的污損或熔 化一可大幅地減少。 再者，產率可增加，因為缺失部位減少了。 因此，本發明就產業而言係極為有利，因為受熱半導 體7G件模體被冷卻，所以缺失部位—例如受熱熔化的金屬 13 201118976 引線與其他引線重疊所產生的污損或熔化一可大幅地減 少0 儘管已說明本發明某些較佳具體例，但本發明並不限 於該等具體例，而僅限於附加之申請專利範圍。能理解到 的是熟習此藝者可在不逸離本發明範疇與精神之下修改或 更動該等具體例。 I：圖式簡單說明3 第1圖為展示根據本發明第一具體例之可供應冷卻水 之半導體元件切割設備的真空夾頭座的透視圖； 第2圖為展示根據本發明第一具體例之半導體元件切 割設備的真空夾頭座的平面圖； 第3圖為沿著第2圖D-D線所取的真空夾頭座截面圖； 第4圖是根據本發明第一具體例之真空夾頭座中的支 承單元的細部頂視圖； 第5圖是沿著第4圖K-K線所取的第一支承單元截面圖； 第6圖展示根據本發明第二具體例之可供應冷卻水之 半導體元件切割設備的真空夾頭座的透視圖； 第7圖是沿著第6圖B-B線所取的真空夾頭座截面圖；及 第8圖為展示使用根據本發明第一具體例之半導體元 件切割設備的真空夾頭座的實施例之圖。 【主要元件符號說明】 110.. .半導體元件模體 200…真空夾頭座 210…冷卻水供應單元 211...水平冷卻水管線 212.. .垂直冷卻水管線 220...夾頭底座 14 201118976 • 230...夾頭底座支承體 • 241...支承單元溝槽 400...真空孔 240、250...支承單元 300.. .切割刀片 500.. .冷卻水 15201118976 VI. Description of the invention: [Technology sales market to which the invention belongs] The cross-reference of the relevant application is the priority of the Korean New Application No. 2009-15344, which is proposed by November 26, 2009, the entire disclosure of which is incorporated by reference. Into the case. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum chuck holder for a semiconductor element cutting apparatus that can supply cooling water and, more particularly, relates to a cooling water that can be used to cool a semiconductor element body by using a cutting blade to cut the semiconductor element body. A vacuum chuck holder for a hot semiconductor component cutting device. I: Prior Art 3 Background of the Invention Generally, a semiconductor element mold system connects a wafer die and a lead frame or a circuit provided on a semiconductor wafer by a die bonding process of adhering a semiconductor wafer to a circuit board or a lead frame mounting board with an adhesive. The wire bonding process of the board leads, the internal circuit of the semiconductor wafer, and other components are molded and fabricated. The resulting semiconductor element phantom is transferred to a semiconductor element dicing apparatus and then diced into semiconductor elements (i.e., individual semiconductor wafer units). The 6 for cutting the semiconductor element is further provided with a vacuum chuck holder configured to suck and support the semiconductor element mold body to cut the semiconductor element mold body into a semiconductor wafer using a dicing blade. In the semiconductor element mold 201118976 on the side thereof, when the raw body of the beef conductor element is cut by the cutting blade, heat is generated from the side of the semiconductor element mold body. & has a vacuum chuck holder that does not cool the semiconductor component phantom. Therefore, the whole rabbit genus is melted by the heat generated by the semiconductor element phantom, and the other leads are lost. This leads to defects such as staining or melting. [In summary] Therefore, the present invention has been directed to I<% technology The above problem occurs to carry out 'the present invention is to provide a vacuum head holder for a semiconductor element cutting device. Cooling water can be used for cooling to cut the semiconductor element using a cutting blade in the semiconductor element mold body. . In order to achieve the above object, according to the present invention, there is provided a vacuum chuck holder which is disposed in a device towel of a stencil-semiconductor element phantom and which is formed to support a semiconductor to a cap. The vacuum_seat includes a (four) base; the support unit 7L' is attached to the top surface of the (four) base and is configured to form a branch conductor element pattern ' and a cold water supply unit' configured to supply cooling water. A plurality of vacuum holes are formed in the support unit. The air is absorbed through the vacuum hole, so that the semiconductor element mold It is sucked to the support unit, and the cooling water is supplied through the cooling water supply unit, thereby removing heat generated when the semiconductor element body is cut. The support unit can be made of rubber. The cooling water supply unit may include a plurality of horizontal cooling water pipelines formed parallel to the base of the fire head; and a plurality of vertical cooling water pipelines respectively formed in a vertical direction on the horizontal cooling water line side and configured to supply cooling 201118976 supporting unit The grooves may be formed on the upper side of the individual support unit. The support groove allows the cutting blade of the apparatus for cutting the semiconductor element to enter and cut the semiconductor element body. The cooling water is supplied through the support grooves, thereby removing heat generated when the semiconductor element body is cut. The vacuum collet holder can further include a collet base support having a vacuum hole formed in the center and supporting the collet base. The support unit may have a hardness of Hs10 to Hs55. The support unit may have a hardness of Hs60 to Hs95. To achieve the above object, according to the present invention, there is provided a vacuum chuck holder which is provided in an apparatus for cutting a semiconductor element mold body and which is configured to support a semiconductor element mold body. The vacuum chuck holder includes a chuck base; a second supporting unit attached to the top surface of the chuck base; and a first supporting unit attached to the top surface of the second supporting unit and configured to support the semiconductor component mold body, The first support member (four) is made of a material having a lower stone than the second support unit material; and a cooling water supply unit that supplies cooling water. A plurality of vacuums (10) are formed in the first and second support units. Air is absorbed through the vacuum holes, and the semiconductor element body is attracted to the first support unit. The cooling water is supplied through the cooling water supply unit, thereby removing heat generated when the cutting half body member body is cut. The side first support sheet 7L and the second support unit may be made of a rubber material. The cooling water supply unit may comprise a plurality of horizontal cooling water lines formed parallel to the cooling head base; and a plurality of vertical cooling water lines respectively reliant on the horizontal cooling water H in the vertical direction (four) Qingcheng supply cooling 201118976 support unit groove It is formed on the upper side of the individual support unit. The support groove allows the cutting blade of the apparatus for cutting the semiconductor element to enter and cut the semiconductor element body. The cooling water is supplied through the support grooves, thereby removing heat generated when the semiconductor element body is cut. The vacuum collet holder can further include a collet base support having a vacuum hole formed in the center and supporting the collet base. The first support unit may have a hardness of Hs10 to Hs55. The second support unit may have a hardness of Hs60 to Hs95. BRIEF DESCRIPTION OF THE DRAWINGS Other objects and advantages of the present invention will be more fully understood from the following detailed description taken in conjunction with the accompanying drawings in which: FIG. 1 is a semiconductor element cutting device capable of supplying cooling water according to a first embodiment of the present invention. A perspective view of a vacuum chuck holder; Fig. 2 is a plan view showing a vacuum chuck holder of a semiconductor element cutting apparatus according to a first embodiment of the present invention; and Fig. 3 is a vacuum clamp taken along line DD of Fig. 2; FIG. 4 is a top plan view of a support unit in a vacuum chuck holder according to a first embodiment of the present invention; FIG. 5 is a cross-sectional view of the first support unit taken along line KK of FIG. Fig. 6 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting apparatus which can supply cooling water according to a second embodiment of the present invention; Fig. 7 is a sectional view of the vacuum chuck seat taken along line BB of Fig. 6. Fig. 8 and Fig. 8 are views showing an embodiment of a vacuum chuck holder using a semiconductor element cutting apparatus according to a first specific example of the present invention. 201118976 [Implementation of Cold 3 Detailed Description of Preferred Embodiments Subsequently] Some specific examples of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting apparatus which can supply cooling water according to a first specific example of the present invention. Fig. 2 is a plan view showing a vacuum chuck holder of a semiconductor element cutting apparatus according to a first specific example of the present invention. Fig. 3 is a cross-sectional view of the vacuum chuck seat taken along line D-D of Fig. 2. As shown in FIGS. 1 to 3, the vacuum chuck holder 2 includes a chuck base 220, and a support unit 240 respectively disposed on the top surface of the chuck base 220 and configured to support the semiconductor element mold body 110, and configured to supply cooling. A water cooling water supply unit 210, and a collet base support body 230 formed to support the collet base 22 and having a large vacuum hole 400 formed in the center thereof. The collet base 220 constitutes the body of the vacuum collet holder 200 and has a plurality of vacuum holes 400 formed therein. The vacuum holes 4 are configured to penetrate the collet base 220. A plurality of vacuum holes 4 are formed in the support unit 240. A vacuum suction device (not shown) draws air through the vacuum hole 400 to cause the semiconductor element mold 110 to be sucked to the support unit 240. The support unit 240 provides vacuum chuck seat stability such that the semiconductor element body is not pushed by the lateral cutting pressure. The support units 240 are each configured to have a vacuum hole 400 formed therein and coupled to the chuck base 220. The vacuum holes 400 of the support unit 240 correspond to the individual vacuum holes 400 of the chuck base 220. The support unit groove 241 is formed on the upper side of the support unit 240 of 201118976. "The support groove 241 allows the cutting blade of the semiconductor element cutting device to enter and cut the semiconductor element mold body 11'. Further, the 'cooling water is supplied through the support groove 241'. The heat chuck base 220 which is produced when the semiconductor element mold 110 is cut is preferably made of iron, and the support unit 24 is made of rubber. The support unit 240 may have a hardness of Hs10 to Hs55 or Hs60 to Hs95. The cooling water supply unit 210 includes a plurality of horizontal cooling water lines 211 formed parallel to the collet base 220 and a plurality of vertical cooling water lines 212 formed perpendicular to the collet base 2 2 . A vertical cooling water line 212 is formed on the upper side of the individual horizontal cooling water line 211 and configured to supply cooling water. A vertical cooling water line 212 is formed in the collet base 22 and the support unit 24A. The cooling water supplied through the cooling water supply unit 210 is for removing heat generated when the semiconductor element body 110 is cut. Fig. 4 is a top plan view of the support unit in the vacuum chuck holder according to the first embodiment of the present invention, and Fig. 5 is a cross-sectional view of the first support unit taken along line K-K of Fig. 4. As shown in Figs. 4 and 5, the cooling water is supplied via the horizontal cooling water line 211 and reaches the support unit groove 241 via the vertical cooling water line 212. The cooling water reaching the support unit groove 241 is for removing heat generated when the cutting blade of the semiconductor element cutting device cuts the semiconductor element mold body 10. As shown in Fig. 4, the support unit grooves 241 are formed to surround the respective vacuum holes 4''. Figure 6 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting device capable of supplying cooling water according to a second embodiment of the present invention, and Figure 7 is a vacuum chuck holder taken along line BB of Figure 8 201118976. Wear a face picture. As shown in Figs. 6 and 7, the vacuum chuck holder of the semiconductor element cutting apparatus according to the second embodiment further includes a second support member 250 as compared with the first embodiment. The vacuum collet holder 2 according to the second embodiment includes a collet base 220, a second supporting unit 25〇 coupled to the top surface of the collet base 220, respectively attached to the top surface of the second supporting unit 250 and configured to support the semiconductor The first supporting unit 240 of the element mold body 110, the cooling water supply unit 210 configured to supply cooling water, and the chuck base support body 23 formed to have a large vacuum hole 400 formed in the center thereof and supporting the chuck base 220〇 . Here, the material constituting the first supporting unit 240 has a lower hardness than the material constituting the second supporting unit 25A. The chuck base 220, the first supporting unit 24, the cooling water supply unit 21, and the collet base supporting body 2 have the same configuration as the first specific example, and the description thereof is omitted for simplicity. A plurality of vacuum holes 4 are formed in the respective second support cells 250. The vacuum hole 4 of the second supporting unit 25 is coupled to the individual vacuum hole 4 of the first supporting unit 240. A vacuum inhaler (not shown) draws air through the vacuum hole 400 to cause the semiconductor element mold body 11 The suction is sucked to the first support unit 240. Further, a plurality of vertical cooling water official lines 212 for supplying cooling water are formed in the respective second supporting units 25A. Vertical horizontal cooling water lines 212 are formed in respective first support units 24A and coupled to individual horizontal cooling water lines 211. Therefore, the cooling water is supplied via the horizontal cooling water line 211 and the vertical horizontal cooling water line 212. The second support unit 250 is made of a hard rubber having - preferably - Hs6 〇 to Hs95 hardness. The second support unit 25 is coupled to the lower side of the first support unit 201118976 element 240 to attract and support the semiconductor element mold body 11''. Therefore, the second supporting unit 250 provides the stability of the vacuum chuck holder 200 to prevent the semiconductor element mold body 110 from being pushed by the lateral cutting pressure. The first support unit 240 is made of a soft rubber having a hardness of preferably Hs10 to Hs55. The semiconductor element mold body 110 is disposed on the top surface of the first support unit 240. The first supporting unit 240 sucks and supports the semiconductor element mold body 110. Since the first supporting unit 240 is made of a soft material, the vibration generated when the semiconductor element body is seated and sucked to the first supporting unit 240 can be minimized. Furthermore, the first support unit 240 and the second support unit 250 are attached by a resin adhesive material. Therefore, the adhesion when the first supporting unit 240 and the second supporting unit 250 are attached together can be enhanced because the same is made of the same rubber material. At the same time, the semiconductor element mold body 110 is made of plastic or the like and can be bent by about 1 mm. When the semiconductor element phantom 11 bent as described above is sucked to a flat surface, the bent semiconductor element phantom 11 is restored to its original position and is subjected to the opposite direction to the bending direction of the semiconductor element phantom 11 The bending force. In other words, assuming that the semiconductor element body is bent by about i mm, when it is attracted to the flat surface, the semiconductor element body returns to its original position by about i mm. Therefore, there is a possibility that the external force applied to the semiconductor element mold body 11 is damaged during the recovery process. However, in the specific example of the present invention, when the semiconductor element phantom is sucked, the first supporting unit 24 made of a soft material is subjected to a plurality of bending phenomena of the semiconductor element phantom 110. Therefore, it is possible to prevent the external force from being applied to the semiconductor element mold body 110 at the time of absorbing. In more detail, assuming that the semiconductor element mold body 110 is bent by 1 mm, the semiconductor element mold body 110 can be slid to a state in which the semiconductor element mold body 110 is bent by about 0.5 mm because of the flexibility of the first support unit 240. The top surface of the first support unit 240. Therefore, although the semiconductor element mold body 110 is bent by 1 mm, if the semiconductor element mold body 110 can be restored to its original position with only about 0.5 mm when being attracted to the top surface of the first support unit 240, the semiconductor element mold The body 110 does not experience external forces. Further, the semiconductor element mold body 110 which is bent as described above is placed on a flat surface. When the bent semiconductor element mold body 110 starts to be attracted to the top surface of the first support unit 240, a specific portion of the semiconductor element mold body 110 comes into contact with the flat surface. In this state, when the semiconductor element mold body 110 is restored to its original position, a part of the semiconductor element mold body 110 which is in contact with the flat surface and has less friction with the flat surface may slide, so that the semiconductor element mold body position May change. If the arrangement state of the semiconductor element phantom 110 is broken due to the change in the position of the semiconductor element phantom 110, the cutting accuracy may be lowered at the cutting process performed after the semiconductor element phantom 110 is sorbed to the flat surface. The first support unit 240 is made of a soft material as described above. Therefore, the first supporting unit 240 has a small amount of recovery and high friction to the semiconductor element body 110 before absorbing. Since the semiconductor element mold body 110 can be prevented from sliding while being sucked to the first supporting unit 240, the positional change of the semiconductor element mold body 110 can be prevented. If the positional change of the semiconductor element phantom 110 is prevented as described above, the cutting accuracy can be improved. 11 201118976 At the same time, the first support unit 240 has a thickness of preferably 0.1 mm to 1.〇 mm. As described above, the first supporting unit 240 is made of a rubber material having a hardness of Hs10 to Hs55. The thickness of the first support unit 240 preferably increases as the hardness of the rubber material increases. However, if the first supporting unit 240 has a thickness of more than 1.0 mm, although having a hardness of Hs55, when the dicing and supporting semiconductor element phantom is subjected to a cutting process, since the first supporting unit 240 is made of a soft material For the sake of this, the semiconductor component phantom 110 may be pushed by the lateral cutting pressure of the cutting blade. Therefore, the cutting accuracy may be lowered. Further, if the first supporting unit 240 has a thickness smaller than 〇·1 mm, although the hardness of Hs10 is 'but the folding of the semiconductor element phantom 11〇 cannot be sufficiently withstood, the semiconductor element phantom 110 cannot be stably placed and the semiconductor The absorption shock of the element body 110 cannot be sufficiently absorbed. The plurality of vacuum holes 400 are formed to penetrate the top surface and the bottom surface of the chuck base 22 and the second support unit 250 to absorb and support the semiconductor component mold body disposed on the top surface of the first support unit 240. . A plurality of vacuum holes 4 are formed so that the semiconductor element mold body 110 is cut by the dicing blade and the vacuum holes 400 can smother individual semiconductor elements of the semiconductor wafer unit. That is, the position and number of vacuum holes 400 correspond to the position and number of individual semiconductor elements of the semiconductor wafer unit. A plurality of vacuum holes 4 形成 formed in the first support unit 24 are connected to a plurality of individual vacuum holes 400 formed in the second support unit 250. Since the vacuum hole 4 形成 formed in the first supporting unit 240 and the plurality of individual vacuum holes 4 形成 formed in the second supporting unit 250 are connected, the bottom of the chuck base 220 is penetrated from 12 201118976 to The first plurality of air ducts on the side of the support unit 2. In a preferred embodiment of the present invention, the plurality of vacuum holes 4 G G formed in the second support unit 25 0 are formed to penetrate the top surface and the bottom surface of the chuck base 2 2 Q and the second support unit 25A. The large vacuum hole 400 formed at the center of the chuck base support 2 is coupled to the vacuum hole formed in the second support unit 25A. Although a vacuum inhaler (not shown) is coupled to the base formed in the lost head The support body 2 has a hollow hole _, but the present invention is not limited to the case where the vacuum hole 4 is joined to a vacuum inhaler (not shown). Fig. 8 is a view showing an embodiment of a vacuum chuck holder which does not use the semiconductor element cutting apparatus according to the first specific example of the present invention. As shown in Fig. 8, the semiconductor element pattern body 11G can be cut by the cutting blade 3 〇 半导体 of the semiconductor element cutting device. If the cutting process generates heat, the cooling water 5 is ejected to cool the heated semiconductor wafer mold body 110 and the heated cutting blade 300 of the I conductor element cutting device. As described above, the present invention is advantageous in that the heat generated when the cutting blade of the semiconductor element cutting device cuts the semiconductor element mold body can be removed using the cooling water. Since the heated semiconductor element body is cooled, the fouling or melting caused by the missing portion, e.g., the thermally melted metal lead, overlaps with other leads can be greatly reduced. Furthermore, the yield can be increased because the number of missing sites is reduced. Therefore, the present invention is extremely advantageous in the industry because the 7G piece of the heated semiconductor is cooled, so that the missing portion, such as the molten metal 13 201118976, the lead or other lead is overlapped, and the fouling or melting can be greatly reduced. Although certain preferred embodiments of the invention have been described, the invention is not limited to the specific examples, but is limited to the scope of the appended claims. It will be appreciated that those skilled in the art can modify or modify the specific embodiments without departing from the scope and spirit of the invention. I: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a vacuum chuck holder of a semiconductor element cutting apparatus capable of supplying cooling water according to a first specific example of the present invention; FIG. 2 is a view showing a first specific example according to the present invention. A plan view of a vacuum chuck holder of a semiconductor component cutting apparatus; FIG. 3 is a cross-sectional view of the vacuum chuck holder taken along line DD of FIG. 2; and FIG. 4 is a vacuum chuck holder according to a first embodiment of the present invention; FIG. 5 is a cross-sectional view of the first supporting unit taken along the line KK of FIG. 4; FIG. 6 is a view showing the cutting of the semiconductor element which can supply cooling water according to the second embodiment of the present invention. A perspective view of a vacuum chuck seat of the apparatus; FIG. 7 is a cross-sectional view of the vacuum chuck seat taken along line BB of FIG. 6; and FIG. 8 is a view showing a semiconductor element cutting apparatus using the first specific example of the present invention. A diagram of an embodiment of a vacuum chuck holder. [Description of main component symbols] 110.. Semiconductor component mold body 200... Vacuum chuck holder 210... Cooling water supply unit 211... Horizontal cooling water line 212.. Vertical cooling water line 220... Chuck base 14 201118976 • 230... Chuck base support • 241... Support unit groove 400... Vacuum holes 240, 250... Support unit 300.. Cutting blade 500.. Cooling water 15