JP2011049398A5 - Laser irradiation device - Google Patents
Laser irradiation device Download PDFInfo
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- JP2011049398A5 JP2011049398A5 JP2009197200A JP2009197200A JP2011049398A5 JP 2011049398 A5 JP2011049398 A5 JP 2011049398A5 JP 2009197200 A JP2009197200 A JP 2009197200A JP 2009197200 A JP2009197200 A JP 2009197200A JP 2011049398 A5 JP2011049398 A5 JP 2011049398A5
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- laser
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- irradiation apparatus
- laser irradiation
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Claims (8)
前記レーザ発振器から射出されたレーザ光を線状に成形する光学系と、
前記光学系によって成形された線状のレーザ光が照射される被照射物を載置するステージと、を有し、
前記ステージは、支持台上に、ヒータ、不純物吸着材及び前記被照射物を載置する載置台が順に固定されていることを特徴とするレーザ照射装置。 A laser oscillator;
An optical system for linearly shaping laser light emitted from the laser oscillator;
A stage on which an object to be irradiated with linear laser light molded by the optical system is placed;
The laser irradiation apparatus according to claim 1, wherein the stage has a mounting table on which a heater, an impurity adsorbent, and the irradiation object are mounted in order on a support table.
前記レーザ発振器から射出されたレーザ光を線状に成形する光学系と、
上面に給気経路が、下面に排気経路がそれぞれ設けられたレーザ処理チャンバーと、
前記レーザ処理チャンバー内に配置され、前記光学系によって成形された線状のレーザ光が照射される被照射物を載置するステージと、を有し、
前記レーザ処理チャンバー内の気流は、前記給気経路及び前記排気経路によって下降流に制御され、
前記ステージは、支持台上に、ヒータ、不純物吸着材及び前記被照射物を載置する載置台が順に固定されていることを特徴とするレーザ照射装置。 A laser oscillator;
An optical system for linearly shaping laser light emitted from the laser oscillator;
A laser processing chamber having an air supply path on the upper surface and an exhaust path on the lower surface;
A stage for placing an object to be irradiated with linear laser light that is arranged in the laser processing chamber and shaped by the optical system;
The air flow in the laser processing chamber is controlled to a downward flow by the air supply path and the exhaust path,
The laser irradiation apparatus according to claim 1, wherein the stage has a mounting table on which a heater , an impurity adsorbent, and the irradiation object are mounted in order on a support table.
前記下降流は、前記被照射物表面と垂直な方向の層流であることを特徴とするレーザ照射装置。 In claim 2,
The laser irradiation apparatus according to claim 1, wherein the downward flow is a laminar flow in a direction perpendicular to the surface of the irradiation object.
前記ヒータと前記不純物吸着材との距離は、1mm以上10mm以下であることを特徴とするレーザ照射装置。 In any one of Claims 1 thru | or 3 ,
The laser irradiation apparatus characterized in that a distance between the heater and the impurity adsorbent is 1 mm or more and 10 mm or less.
前記不純物吸着材として、シリコン純度が98%乃至99%の低純度シリコンからなるシリコン基板を用いることを特徴とするレーザ照射装置。 In any one of Claims 1 thru | or 4 ,
A laser irradiation apparatus using a silicon substrate made of low-purity silicon having a silicon purity of 98% to 99% as the impurity adsorbing material.
前記不純物吸着材として、支持基板の表面を覆うようにシリコン層を設けた基板を用いることを特徴とするレーザ照射装置。A laser irradiation apparatus using a substrate provided with a silicon layer so as to cover a surface of a support substrate as the impurity adsorbing material.
前記ヒータとして、グラファイトヒータを用いることを特徴とするレーザ照射装置。 In any one of Claims 1 thru | or 6,
A laser irradiation apparatus using a graphite heater as the heater.
前記不純物吸着材の前記ヒータに対向する側の面積は、前記ヒータの前記不純物吸着材に対向する側の面積より大きいことを特徴とするレーザ照射装置。The laser irradiation apparatus according to claim 1, wherein an area of the impurity adsorbing material facing the heater is larger than an area of the heater facing the impurity adsorbing material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009197200A JP5500914B2 (en) | 2009-08-27 | 2009-08-27 | Laser irradiation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009197200A JP5500914B2 (en) | 2009-08-27 | 2009-08-27 | Laser irradiation device |
Publications (3)
Publication Number | Publication Date |
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JP2011049398A JP2011049398A (en) | 2011-03-10 |
JP2011049398A5 true JP2011049398A5 (en) | 2012-08-30 |
JP5500914B2 JP5500914B2 (en) | 2014-05-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009197200A Expired - Fee Related JP5500914B2 (en) | 2009-08-27 | 2009-08-27 | Laser irradiation device |
Country Status (1)
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JP (1) | JP5500914B2 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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DE102017129479A1 (en) * | 2017-12-11 | 2019-06-13 | Trumpf Laser- Und Systemtechnik Gmbh | Laser processing device for processing workpieces by means of a laser |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
HUE062607T2 (en) * | 2019-09-09 | 2023-11-28 | Sturm Maschinen & Anlagenbau Gmbh | Coating device and method for metallic coating of workpieces |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3249606B2 (en) * | 1992-11-06 | 2002-01-21 | 株式会社半導体エネルギー研究所 | Laser processing method, semiconductor device and method for manufacturing the same |
JPH08191049A (en) * | 1995-01-11 | 1996-07-23 | Hitachi Ltd | Semiconductor manufacturing device |
JP4845146B2 (en) * | 1997-07-31 | 2011-12-28 | コバレントマテリアル株式会社 | Carbon heater |
JP3474406B2 (en) * | 1997-09-30 | 2003-12-08 | 信越化学工業株式会社 | Silicon heating element and semiconductor manufacturing apparatus using the same |
JP2912613B1 (en) * | 1998-06-17 | 1999-06-28 | 助川電気工業株式会社 | Plate heating device |
JP2004039953A (en) * | 2002-07-05 | 2004-02-05 | Renesas Technology Corp | Manufacturing method of semiconductor device |
JP2004172610A (en) * | 2002-11-08 | 2004-06-17 | Semiconductor Energy Lab Co Ltd | Method for producing semiconductor device, semiconductor device, and laser irradiation apparatus |
JP3910151B2 (en) * | 2003-04-01 | 2007-04-25 | 東京エレクトロン株式会社 | Heat treatment method and heat treatment apparatus |
JP4380236B2 (en) * | 2003-06-23 | 2009-12-09 | 東京エレクトロン株式会社 | Mounting table and heat treatment device |
-
2009
- 2009-08-27 JP JP2009197200A patent/JP5500914B2/en not_active Expired - Fee Related
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