WO2009001889A1 - チャックテーブルおよび被加工物検査装置 - Google Patents

チャックテーブルおよび被加工物検査装置 Download PDF

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Publication number
WO2009001889A1
WO2009001889A1 PCT/JP2008/061624 JP2008061624W WO2009001889A1 WO 2009001889 A1 WO2009001889 A1 WO 2009001889A1 JP 2008061624 W JP2008061624 W JP 2008061624W WO 2009001889 A1 WO2009001889 A1 WO 2009001889A1
Authority
WO
WIPO (PCT)
Prior art keywords
chuck table
negative pressure
battery
forming device
inspecting apparatus
Prior art date
Application number
PCT/JP2008/061624
Other languages
English (en)
French (fr)
Inventor
Seiji Kato
Original Assignee
Yoshioka Seiko Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yoshioka Seiko Co., Ltd. filed Critical Yoshioka Seiko Co., Ltd.
Priority to JP2009520632A priority Critical patent/JP5011386B2/ja
Publication of WO2009001889A1 publication Critical patent/WO2009001889A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Examining Or Testing Airtightness (AREA)

Abstract

　電源や負圧源から独立させることによって、自由に移動可能なチャックテーブルを提供する。 　前記基台(C)には、前記空気通路に接続されて負圧を形成するための負圧形成装置(C1)と、その負圧形成装置(C1)に電気エネルギを供給するためのバッテリ(C2)と、を内蔵する。負圧形成装置(C1)の可動および停止を操作する操作スイッチ(C6)を備える。バッテリは二次電池とし、前記基台(C)には、前記バッテリ(C2)に充電するための充電端子(電源ポートC5)を備える。
PCT/JP2008/061624 2007-06-26 2008-06-26 チャックテーブルおよび被加工物検査装置 WO2009001889A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009520632A JP5011386B2 (ja) 2007-06-26 2008-06-26 チャックテーブルおよび被加工物検査装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007167862 2007-06-26
JP2007-167862 2007-06-26

Publications (1)

Publication Number Publication Date
WO2009001889A1 true WO2009001889A1 (ja) 2008-12-31

Family

ID=40185701

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061624 WO2009001889A1 (ja) 2007-06-26 2008-06-26 チャックテーブルおよび被加工物検査装置

Country Status (2)

Country Link
JP (1) JP5011386B2 (ja)
WO (1) WO2009001889A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2182549A1 (en) * 2008-11-03 2010-05-05 Eurotron B.V. Mobile table and lamination system comprising such table
JP2015018974A (ja) * 2013-07-11 2015-01-29 東京応化工業株式会社 支持体分離装置
JP2016009752A (ja) * 2014-06-24 2016-01-18 株式会社吉岡精工 面発光チャックテーブル
WO2021161740A1 (ja) * 2020-02-10 2021-08-19 Ｔｏｗａ株式会社 加工装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101036797B1 (ko) * 2011-03-31 2011-05-25 한국뉴매틱(주) 진공 그리퍼 장치
DE102019107257A1 (de) * 2019-03-21 2020-09-24 Homag Bohrsysteme Gmbh Konsole mit Unterdruckerzeugungsvorrichtung, Festhaltemittel mit Unterdruckerzeugungsvorrichtung sowie Bearbeitungsmaschine mit diesen
CN114597155B (zh) * 2022-05-10 2022-09-16 上海隐冠半导体技术有限公司 吸附装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05344284A (ja) * 1992-06-04 1993-12-24 Asahi Optical Co Ltd 画像読取装置
JPH0724537U (ja) * 1993-10-01 1995-05-09 ローランドディー．ジー．株式会社 バキュームテーブル
JPH1126553A (ja) * 1997-07-09 1999-01-29 Fujitsu Ltd 吸着コレット
JP2005059173A (ja) * 2003-08-18 2005-03-10 Yoshioka Seiko:Kk 吸着装置及びチャックテーブル
JP2005288591A (ja) * 2004-03-31 2005-10-20 Michihiro Horii 移動用冷却装置及びこれを用いたワーク固定装置
JP2007083354A (ja) * 2005-09-22 2007-04-05 Seiwa Seiki:Kk ワーク吸着保持装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270535A (ja) * 1997-03-25 1998-10-09 Nikon Corp 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法
JPH11177286A (ja) * 1997-12-09 1999-07-02 Sharp Corp 基板搬送プレート及びその処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05344284A (ja) * 1992-06-04 1993-12-24 Asahi Optical Co Ltd 画像読取装置
JPH0724537U (ja) * 1993-10-01 1995-05-09 ローランドディー．ジー．株式会社 バキュームテーブル
JPH1126553A (ja) * 1997-07-09 1999-01-29 Fujitsu Ltd 吸着コレット
JP2005059173A (ja) * 2003-08-18 2005-03-10 Yoshioka Seiko:Kk 吸着装置及びチャックテーブル
JP2005288591A (ja) * 2004-03-31 2005-10-20 Michihiro Horii 移動用冷却装置及びこれを用いたワーク固定装置
JP2007083354A (ja) * 2005-09-22 2007-04-05 Seiwa Seiki:Kk ワーク吸着保持装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2182549A1 (en) * 2008-11-03 2010-05-05 Eurotron B.V. Mobile table and lamination system comprising such table
JP2015018974A (ja) * 2013-07-11 2015-01-29 東京応化工業株式会社 支持体分離装置
JP2016009752A (ja) * 2014-06-24 2016-01-18 株式会社吉岡精工 面発光チャックテーブル
WO2021161740A1 (ja) * 2020-02-10 2021-08-19 Ｔｏｗａ株式会社 加工装置
JP2021122932A (ja) * 2020-02-10 2021-08-30 Ｔｏｗａ株式会社 加工装置

Also Published As

Publication number Publication date
JP5011386B2 (ja) 2012-08-29
JPWO2009001889A1 (ja) 2010-08-26

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