SG170108A1 - Composition and method to polish silicon nitride - Google Patents

Composition and method to polish silicon nitride

Info

Publication number
SG170108A1
SG170108A1 SG201101794-4A SG2011017944A SG170108A1 SG 170108 A1 SG170108 A1 SG 170108A1 SG 2011017944 A SG2011017944 A SG 2011017944A SG 170108 A1 SG170108 A1 SG 170108A1
Authority
SG
Singapore
Prior art keywords
silicon nitride
composition
polishing
polish silicon
polishing composition
Prior art date
Application number
SG201101794-4A
Other languages
English (en)
Inventor
Zhan Chen
Robert Vacassy
Phillip Carter
Jeffrey Dysard
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of SG170108A1 publication Critical patent/SG170108A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG201101794-4A 2006-03-13 2007-03-06 Composition and method to polish silicon nitride SG170108A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/374,238 US20070209287A1 (en) 2006-03-13 2006-03-13 Composition and method to polish silicon nitride

Publications (1)

Publication Number Publication Date
SG170108A1 true SG170108A1 (en) 2011-04-29

Family

ID=38436739

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201101794-4A SG170108A1 (en) 2006-03-13 2007-03-06 Composition and method to polish silicon nitride

Country Status (10)

Country Link
US (1) US20070209287A1 (enExample)
EP (1) EP1994107A2 (enExample)
JP (1) JP5524607B2 (enExample)
KR (1) KR101371939B1 (enExample)
CN (2) CN101389722B (enExample)
IL (1) IL192527A (enExample)
MY (1) MY153685A (enExample)
SG (1) SG170108A1 (enExample)
TW (1) TWI363797B (enExample)
WO (1) WO2007108926A2 (enExample)

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CN101747841A (zh) * 2008-12-05 2010-06-23 安集微电子（上海）有限公司 一种化学机械抛光液
SG177327A1 (en) 2009-06-22 2012-02-28 Cabot Microelectronics Corp Cmp compositions and methods for suppressing polysilicon removal rates
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US20140197356A1 (en) * 2011-12-21 2014-07-17 Cabot Microelectronics Corporation Cmp compositions and methods for suppressing polysilicon removal rates
CN103387796B (zh) 2012-05-10 2015-08-12 气体产品与化学公司 具有化学添加剂的化学机械抛光组合物及其使用方法
US8999193B2 (en) 2012-05-10 2015-04-07 Air Products And Chemicals, Inc. Chemical mechanical polishing composition having chemical additives and methods for using same
US9633863B2 (en) 2012-07-11 2017-04-25 Cabot Microelectronics Corporation Compositions and methods for selective polishing of silicon nitride materials
WO2015146468A1 (ja) 2014-03-28 2015-10-01 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
US9583359B2 (en) 2014-04-04 2017-02-28 Fujifilm Planar Solutions, LLC Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films
CN105802511A (zh) * 2014-12-29 2016-07-27 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
CN108117838B (zh) * 2016-11-29 2021-09-17 安集微电子科技（上海）股份有限公司 一种氮化硅化学机械抛光液
CN113632205B (zh) * 2019-06-06 2024-12-20 株式会社力森诺科 研磨液及研磨方法

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Also Published As

Publication number Publication date
TW200740970A (en) 2007-11-01
KR101371939B1 (ko) 2014-03-07
IL192527A0 (en) 2009-02-11
CN102604541A (zh) 2012-07-25
US20070209287A1 (en) 2007-09-13
EP1994107A2 (en) 2008-11-26
KR20080106575A (ko) 2008-12-08
CN102604541B (zh) 2015-05-20
CN101389722A (zh) 2009-03-18
IL192527A (en) 2013-08-29
WO2007108926A3 (en) 2008-03-20
TWI363797B (en) 2012-05-11
MY153685A (en) 2015-03-13
JP5524607B2 (ja) 2014-06-18
CN101389722B (zh) 2012-09-05
WO2007108926A2 (en) 2007-09-27
JP2009530811A (ja) 2009-08-27

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