MY153685A - Composition and method to polish silicon nitride - Google Patents

Composition and method to polish silicon nitride

Info

Publication number
MY153685A
MY153685A MYPI20083545A MYPI20083545A MY153685A MY 153685 A MY153685 A MY 153685A MY PI20083545 A MYPI20083545 A MY PI20083545A MY PI20083545 A MYPI20083545 A MY PI20083545A MY 153685 A MY153685 A MY 153685A
Authority
MY
Malaysia
Prior art keywords
silicon nitride
composition
polish silicon
polishing
polish
Prior art date
Application number
MYPI20083545A
Other languages
English (en)
Inventor
Chen Zhan
Vacassy Robert
Carter Phillip
Dysard Jeffrey
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY153685A publication Critical patent/MY153685A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI20083545A 2006-03-13 2007-03-06 Composition and method to polish silicon nitride MY153685A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/374,238 US20070209287A1 (en) 2006-03-13 2006-03-13 Composition and method to polish silicon nitride

Publications (1)

Publication Number Publication Date
MY153685A true MY153685A (en) 2015-03-13

Family

ID=38436739

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20083545A MY153685A (en) 2006-03-13 2007-03-06 Composition and method to polish silicon nitride

Country Status (10)

Country Link
US (1) US20070209287A1 (enExample)
EP (1) EP1994107A2 (enExample)
JP (1) JP5524607B2 (enExample)
KR (1) KR101371939B1 (enExample)
CN (2) CN101389722B (enExample)
IL (1) IL192527A (enExample)
MY (1) MY153685A (enExample)
SG (1) SG170108A1 (enExample)
TW (1) TWI363797B (enExample)
WO (1) WO2007108926A2 (enExample)

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* Cited by examiner, † Cited by third party
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US8759216B2 (en) * 2006-06-07 2014-06-24 Cabot Microelectronics Corporation Compositions and methods for polishing silicon nitride materials
EP2237311A4 (en) * 2008-02-01 2011-11-30 Fujimi Inc POLISHING COMPOSITION AND POLISHING METHOD THEREFOR
JP5441362B2 (ja) * 2008-05-30 2014-03-12 富士フイルム株式会社 研磨液及び研磨方法
CN101747841A (zh) * 2008-12-05 2010-06-23 安集微电子（上海）有限公司 一种化学机械抛光液
SG10201401549SA (en) * 2009-06-22 2014-06-27 Cabot Microelectronics Corp CMP Compositions And Methods For Suppressing Polysilicon Removal Rates
KR101091030B1 (ko) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
US20140197356A1 (en) * 2011-12-21 2014-07-17 Cabot Microelectronics Corporation Cmp compositions and methods for suppressing polysilicon removal rates
US8999193B2 (en) 2012-05-10 2015-04-07 Air Products And Chemicals, Inc. Chemical mechanical polishing composition having chemical additives and methods for using same
EP3333232B1 (en) 2012-05-10 2020-03-04 Versum Materials US, LLC Chemical mechanical polishing composition having chemical additives and methods for using
US9633863B2 (en) 2012-07-11 2017-04-25 Cabot Microelectronics Corporation Compositions and methods for selective polishing of silicon nitride materials
EP3124569A4 (en) 2014-03-28 2017-03-15 Fujimi Incorporated Polishing composition, and polishing method using same
US9583359B2 (en) 2014-04-04 2017-02-28 Fujifilm Planar Solutions, LLC Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films
CN105802511A (zh) * 2014-12-29 2016-07-27 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
CN108117838B (zh) * 2016-11-29 2021-09-17 安集微电子科技（上海）股份有限公司 一种氮化硅化学机械抛光液
KR102714939B1 (ko) * 2019-06-06 2024-10-07 가부시끼가이샤 레조낙 연마액 및 연마 방법

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Also Published As

Publication number Publication date
WO2007108926A2 (en) 2007-09-27
IL192527A0 (en) 2009-02-11
CN102604541A (zh) 2012-07-25
CN102604541B (zh) 2015-05-20
CN101389722B (zh) 2012-09-05
JP5524607B2 (ja) 2014-06-18
KR101371939B1 (ko) 2014-03-07
WO2007108926A3 (en) 2008-03-20
US20070209287A1 (en) 2007-09-13
KR20080106575A (ko) 2008-12-08
CN101389722A (zh) 2009-03-18
EP1994107A2 (en) 2008-11-26
TW200740970A (en) 2007-11-01
IL192527A (en) 2013-08-29
TWI363797B (en) 2012-05-11
JP2009530811A (ja) 2009-08-27
SG170108A1 (en) 2011-04-29

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