SG168518A1 - Probe card assembly - Google Patents

Probe card assembly

Info

Publication number
SG168518A1
SG168518A1 SG201009541-2A SG2010095412A SG168518A1 SG 168518 A1 SG168518 A1 SG 168518A1 SG 2010095412 A SG2010095412 A SG 2010095412A SG 168518 A1 SG168518 A1 SG 168518A1
Authority
SG
Singapore
Prior art keywords
probe
probe card
card assembly
wiring board
secured
Prior art date
Application number
SG201009541-2A
Other languages
English (en)
Inventor
Raffi Garabedian
Nim Hak Tea
Steven Wang
Heather Karklin
Original Assignee
Touchdown Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Touchdown Technologies Inc filed Critical Touchdown Technologies Inc
Publication of SG168518A1 publication Critical patent/SG168518A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor
    • Y10T29/53243—Multiple, independent conductors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG201009541-2A 2005-12-22 2006-11-30 Probe card assembly SG168518A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/317,408 US7365553B2 (en) 2005-12-22 2005-12-22 Probe card assembly

Publications (1)

Publication Number Publication Date
SG168518A1 true SG168518A1 (en) 2011-02-28

Family

ID=37946333

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201009541-2A SG168518A1 (en) 2005-12-22 2006-11-30 Probe card assembly

Country Status (6)

Country Link
US (3) US7365553B2 (fr)
EP (1) EP1963869A1 (fr)
JP (1) JP2009521674A (fr)
KR (1) KR101353188B1 (fr)
SG (1) SG168518A1 (fr)
WO (1) WO2007078493A1 (fr)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7319335B2 (en) * 2004-02-12 2008-01-15 Applied Materials, Inc. Configurable prober for TFT LCD array testing
EP1817598A2 (fr) * 2004-12-02 2007-08-15 K & S Interconnect, Inc. Carte sonde a substrat segmente
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
US7245135B2 (en) * 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US7362119B2 (en) * 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US20070075717A1 (en) * 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7180316B1 (en) * 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
KR101255334B1 (ko) * 2006-05-08 2013-04-16 페어차일드코리아반도체 주식회사 저 열저항 파워 모듈 및 그 제조방법
US7368930B2 (en) * 2006-08-04 2008-05-06 Formfactor, Inc. Adjustment mechanism
US7884627B2 (en) * 2006-12-29 2011-02-08 Formfactor, Inc. Stiffener assembly for use with testing devices
EP2128630A4 (fr) * 2007-03-14 2014-05-14 Nhk Spring Co Ltd Carte sonde
DE102007027380A1 (de) * 2007-06-11 2008-12-18 Micronas Gmbh Nadelkartenanordnung
DE102007038514A1 (de) * 2007-08-16 2009-02-19 Robert Bosch Gmbh Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung
US7750651B2 (en) * 2008-03-07 2010-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer level test probe card
US7692436B2 (en) * 2008-03-20 2010-04-06 Touchdown Technologies, Inc. Probe card substrate with bonded via
JP5643476B2 (ja) * 2008-04-16 2014-12-17 日本電子材料株式会社 二重弾性機構プローブカード
DE102008034918B4 (de) * 2008-07-26 2012-09-27 Feinmetall Gmbh Elektrische Prüfeinrichtung für die Prüfung eines elektrischen Prüflings sowie elektrisches Prüfverfahren
US20100039133A1 (en) * 2008-08-13 2010-02-18 Formfactor, Inc. Probe head controlling mechanism for probe card assemblies
CN101676733A (zh) * 2008-09-17 2010-03-24 汉民测试系统科技股份有限公司 集成电路测试探针卡的结构
US8008936B2 (en) * 2008-11-13 2011-08-30 Qualcomm, Incorporated Probe card actuator
US7960989B2 (en) * 2008-12-03 2011-06-14 Formfactor, Inc. Mechanical decoupling of a probe card assembly to improve thermal response
TWI399547B (zh) * 2009-07-22 2013-06-21 King Yuan Electronics Co Ltd 具同心圓探針座之半導體測試設備
US8269514B2 (en) * 2009-08-25 2012-09-18 Formfactor, Inc. Method and apparatus for multilayer support substrate
JP2011089891A (ja) * 2009-10-22 2011-05-06 Micronics Japan Co Ltd 電気的接続装置及びこれを用いる試験装置
KR101097156B1 (ko) 2009-12-03 2011-12-21 윌테크놀러지(주) 프로브카드용 보조기판의 금속봉 접합방법
TWI461698B (zh) * 2010-09-30 2014-11-21 Mpi Corp Probe unit and its making method
US8838408B2 (en) 2010-11-11 2014-09-16 Optimal Plus Ltd Misalignment indication decision system and method
WO2012099572A1 (fr) * 2011-01-18 2012-07-26 Touchdown Technologies, Inc. Plaque raidisseuse pour une carte de sonde et procédé associé
TW201333494A (zh) * 2012-02-02 2013-08-16 Mpi Corp 整合式高速測試模組
US8525168B2 (en) * 2011-07-11 2013-09-03 International Business Machines Corporation Integrated circuit (IC) test probe
TWI428608B (zh) * 2011-09-16 2014-03-01 Mpi Corp 探針測試裝置與其製造方法
US8917106B2 (en) 2011-11-09 2014-12-23 Advantest America, Inc. Fine pitch microelectronic contact array and method of making same
JP2014027020A (ja) * 2012-07-24 2014-02-06 Toshiba Corp 回路基板、電子機器、および回路基板の製造方法
ITMI20130561A1 (it) * 2013-04-09 2014-10-10 Technoprobe Spa Testa di misura di dispositivi elettronici
US9599665B2 (en) * 2013-05-21 2017-03-21 Advantest Corporation Low overdrive probes with high overdrive substrate
US9678108B1 (en) 2014-02-06 2017-06-13 Advantest America, Inc. Methods to manufacture semiconductor probe tips
EP3114488B1 (fr) * 2014-03-06 2018-08-01 Technoprobe S.p.A Carte sonde à haute planéité pour appareil de test pour dispositifs électroniques
TWI521212B (zh) * 2014-03-10 2016-02-11 A method and a method of assembling a vertical probe device, and a vertical probe device
WO2015157363A2 (fr) * 2014-04-08 2015-10-15 Elma Electronic Inc. Procédé et appareil pour une carte à pointes
US9876307B2 (en) * 2015-09-03 2018-01-23 Apple Inc. Surface connector with silicone spring member
US9899757B2 (en) * 2015-09-03 2018-02-20 Apple Inc. Surface connector with silicone spring member
JP6652361B2 (ja) * 2015-09-30 2020-02-19 東京エレクトロン株式会社 ウエハ検査装置及びウエハ検査方法
IT201700046645A1 (it) 2017-04-28 2018-10-28 Technoprobe Spa Scheda di misura per un’apparecchiatura di test di dispositivi elettronici
KR102018791B1 (ko) * 2018-03-30 2019-09-06 (주)엠투엔 인터포저 유닛
KR102018787B1 (ko) * 2018-03-30 2019-09-06 (주)엠투엔 프로브 카드 및 그 제조 방법
CN108731706B (zh) * 2018-04-03 2020-08-07 烟台北方星空自控科技有限公司 一种传感器
KR102093419B1 (ko) * 2018-11-27 2020-03-26 주식회사 에스디에이 프로브 카드
KR102141535B1 (ko) * 2020-03-03 2020-08-05 장용철 멀티 플라잉 프로브 테스터
KR102393600B1 (ko) * 2020-09-11 2022-05-03 스테코 주식회사 프로브 카드
CN112976147A (zh) * 2021-03-16 2021-06-18 广州市昊志机电股份有限公司 一种钻孔机z轴结构和钻孔机
CN114200278B (zh) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 一种薄膜探针卡及其探针头
US11726138B2 (en) * 2021-12-21 2023-08-15 Nanya Technology Corporation Method for testing semiconductor dies and test structure
US20240125817A1 (en) * 2022-10-17 2024-04-18 The Boeing Company Tilt calibration for probe systems

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4382228A (en) * 1974-07-15 1983-05-03 Wentworth Laboratories Inc. Probes for fixed point probe cards
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPH0384470A (ja) * 1989-08-28 1991-04-10 Nippon Maikuronikusu:Kk 半固定プローブボード
US5190637A (en) 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers
US5461326A (en) * 1993-02-25 1995-10-24 Hughes Aircraft Company Self leveling and self tensioning membrane test probe
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5974662A (en) * 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5565788A (en) * 1994-07-20 1996-10-15 Cascade Microtech, Inc. Coaxial wafer probe with tip shielding
KR0150334B1 (ko) * 1995-08-17 1998-12-01 남재우 수직형니들을 가지는 프로브카드 및 그 제조방법
JPH116726A (ja) * 1997-06-17 1999-01-12 Hoya Corp 反り値の測定方法及び測定装置
JPH11111787A (ja) * 1997-10-03 1999-04-23 Eejingu Tesuta Kaihatsu Kyodo Kumiai ウエハ用検査装置
JP3066895B2 (ja) * 1998-12-10 2000-07-17 株式会社東京精密 顕微鏡チルト機構
JP2000235046A (ja) * 1999-02-15 2000-08-29 Mitsubishi Materials Corp コンタクトプローブ及びプローブ装置
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US6509751B1 (en) * 2000-03-17 2003-01-21 Formfactor, Inc. Planarizer for a semiconductor contactor
KR100459050B1 (ko) 2000-03-17 2004-12-03 폼팩터, 인크. 반도체 접촉자를 평탄화하기 위한 방법 및 장치
US6441629B1 (en) * 2000-05-31 2002-08-27 Advantest Corp Probe contact system having planarity adjustment mechanism
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
US6677771B2 (en) * 2001-06-20 2004-01-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
US7271002B2 (en) * 2001-11-09 2007-09-18 United States Of America, Represented By The Secretary, Department Of Health And Human Services Production of adeno-associated virus in insect cells
WO2003083494A1 (fr) * 2002-03-22 2003-10-09 Electro Scientific Industries, Inc. Appareil d'alignement de sondes d'essais
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
FR2849016B1 (fr) 2002-12-18 2005-06-10 Commissariat Energie Atomique Procede de realisation d'une micro-structure suspendue plane, utilisant une couche sacrificielle en materiau polymere et composant obtenu
DE10334548A1 (de) * 2003-07-29 2005-03-03 Infineon Technologies Ag Verfahren zum Kontaktieren von zu testenden Schaltungseinheiten und selbstplanarisierende Prüfkarteneinrichtung zur Durchführung des Verfahrens
US7230437B2 (en) * 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
US7271022B2 (en) 2004-12-21 2007-09-18 Touchdown Technologies, Inc. Process for forming microstructures
US7264984B2 (en) 2004-12-21 2007-09-04 Touchdown Technologies, Inc. Process for forming MEMS
US7362119B2 (en) 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US7245135B2 (en) 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US20070057685A1 (en) 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US20070075717A1 (en) 2005-09-14 2007-04-05 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7365553B2 (en) 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US7180316B1 (en) * 2006-02-03 2007-02-20 Touchdown Technologies, Inc. Probe head with machined mounting pads and method of forming same
US7791361B2 (en) * 2007-12-10 2010-09-07 Touchdown Technologies, Inc. Planarizing probe card
US7692436B2 (en) * 2008-03-20 2010-04-06 Touchdown Technologies, Inc. Probe card substrate with bonded via

Also Published As

Publication number Publication date
EP1963869A1 (fr) 2008-09-03
JP2009521674A (ja) 2009-06-04
US7759952B2 (en) 2010-07-20
KR101353188B1 (ko) 2014-01-17
US7728612B2 (en) 2010-06-01
US20080007281A1 (en) 2008-01-10
US20080211525A1 (en) 2008-09-04
KR20080087126A (ko) 2008-09-30
WO2007078493A1 (fr) 2007-07-12
US20070145988A1 (en) 2007-06-28
US7365553B2 (en) 2008-04-29

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