SG168466A1 - Method for determining a centred position of a semiconductor substrate in an annealing furnace, device for the heat treatment of semiconductor substrates and method for calibrating such a device - Google Patents

Method for determining a centred position of a semiconductor substrate in an annealing furnace, device for the heat treatment of semiconductor substrates and method for calibrating such a device

Info

Publication number
SG168466A1
SG168466A1 SG201004252-1A SG2010042521A SG168466A1 SG 168466 A1 SG168466 A1 SG 168466A1 SG 2010042521 A SG2010042521 A SG 2010042521A SG 168466 A1 SG168466 A1 SG 168466A1
Authority
SG
Singapore
Prior art keywords
substrate
positioning
heat treatment
determining
calibrating
Prior art date
Application number
SG201004252-1A
Other languages
English (en)
Inventor
Cedric Angellier
William Palmer
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG168466A1 publication Critical patent/SG168466A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG201004252-1A 2009-07-27 2010-06-16 Method for determining a centred position of a semiconductor substrate in an annealing furnace, device for the heat treatment of semiconductor substrates and method for calibrating such a device SG168466A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0955236A FR2948494B1 (fr) 2009-07-27 2009-07-27 Procede de determination d'une position centree d'un substrat semi-conducteur dans un four de recuit, dispositif pour traiter thermiquement des substrats semi-conducteurs et procede pour calibrer un tel dispositif

Publications (1)

Publication Number Publication Date
SG168466A1 true SG168466A1 (en) 2011-02-28

Family

ID=41211905

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201004252-1A SG168466A1 (en) 2009-07-27 2010-06-16 Method for determining a centred position of a semiconductor substrate in an annealing furnace, device for the heat treatment of semiconductor substrates and method for calibrating such a device

Country Status (8)

Country Link
US (1) US20110020957A1 (ko)
EP (1) EP2280411A2 (ko)
JP (1) JP2011029613A (ko)
KR (1) KR20110011553A (ko)
CN (1) CN101969019A (ko)
FR (1) FR2948494B1 (ko)
SG (1) SG168466A1 (ko)
TW (1) TW201104786A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2948494B1 (fr) * 2009-07-27 2011-09-16 Soitec Silicon On Insulator Procede de determination d'une position centree d'un substrat semi-conducteur dans un four de recuit, dispositif pour traiter thermiquement des substrats semi-conducteurs et procede pour calibrer un tel dispositif
US11915953B2 (en) 2020-04-17 2024-02-27 Applied Materials, Inc. Apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010052392A1 (en) * 1998-02-25 2001-12-20 Masahiko Nakamura Multichamber substrate processing apparatus
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
JP4731755B2 (ja) * 2001-07-26 2011-07-27 東京エレクトロン株式会社 移載装置の制御方法および熱処理方法並びに熱処理装置
US7413612B2 (en) * 2003-07-10 2008-08-19 Applied Materials, Inc. In situ substrate holder leveling method and apparatus
FR2878075B1 (fr) 2004-11-15 2007-03-02 Soitec Silicon On Insulator Procede et appareil de mesure de plaques de semi-conducteur
EP1734571B1 (en) * 2005-06-10 2008-08-20 S.O.I.TEC. Silicon on Insulator Technologies S.A. Thermal processing equipment calibration method
JP2007067018A (ja) * 2005-08-29 2007-03-15 Sharp Corp 露光装置の露光動作評価方法および半導体デバイスの製造方法
DE102006023497B4 (de) * 2006-05-18 2008-05-29 Siltronic Ag Verfahren zur Behandlung einer Halbleiterscheibe
JP2008227426A (ja) * 2007-03-16 2008-09-25 Shin Etsu Handotai Co Ltd 基板位置ズレ検出方法及び基板位置ズレ検出装置
US8135485B2 (en) * 2007-09-28 2012-03-13 Lam Research Corporation Offset correction techniques for positioning substrates within a processing chamber
FR2948494B1 (fr) * 2009-07-27 2011-09-16 Soitec Silicon On Insulator Procede de determination d'une position centree d'un substrat semi-conducteur dans un four de recuit, dispositif pour traiter thermiquement des substrats semi-conducteurs et procede pour calibrer un tel dispositif

Also Published As

Publication number Publication date
FR2948494A1 (fr) 2011-01-28
KR20110011553A (ko) 2011-02-08
TW201104786A (en) 2011-02-01
US20110020957A1 (en) 2011-01-27
JP2011029613A (ja) 2011-02-10
FR2948494B1 (fr) 2011-09-16
CN101969019A (zh) 2011-02-09
EP2280411A2 (fr) 2011-02-02

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