SG161166A1 - Substrate transport apparatus and method for manufacturing magnetic recording medium - Google Patents

Substrate transport apparatus and method for manufacturing magnetic recording medium

Info

Publication number
SG161166A1
SG161166A1 SG200906792-7A SG2009067927A SG161166A1 SG 161166 A1 SG161166 A1 SG 161166A1 SG 2009067927 A SG2009067927 A SG 2009067927A SG 161166 A1 SG161166 A1 SG 161166A1
Authority
SG
Singapore
Prior art keywords
transport apparatus
substrate transport
recording medium
magnetic recording
manufacturing magnetic
Prior art date
Application number
SG200906792-7A
Other languages
English (en)
Inventor
Itaru Hagiwara
Naoyuki Nozawa
Original Assignee
Canon Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp filed Critical Canon Anelva Corp
Publication of SG161166A1 publication Critical patent/SG161166A1/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31014—Synchronization between AGV movement and workpiece treatment chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/40—Minimising material used in manufacturing processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49069—Data storage inductor or core

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
SG200906792-7A 2008-10-28 2009-10-12 Substrate transport apparatus and method for manufacturing magnetic recording medium SG161166A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008276821 2008-10-28
JP2009232524A JP5529484B2 (ja) 2008-10-28 2009-10-06 基板搬送装置、及び磁気記録媒体の製造方法

Publications (1)

Publication Number Publication Date
SG161166A1 true SG161166A1 (en) 2010-05-27

Family

ID=42116093

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200906792-7A SG161166A1 (en) 2008-10-28 2009-10-12 Substrate transport apparatus and method for manufacturing magnetic recording medium

Country Status (4)

Country Link
US (1) US8534975B2 (zh)
JP (1) JP5529484B2 (zh)
CN (1) CN101727920B (zh)
SG (1) SG161166A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011205878A (ja) * 2009-12-25 2011-10-13 Canon Anelva Corp 真空アクチュエータ及び基板搬送ロボット
KR20120051916A (ko) * 2010-11-15 2012-05-23 엠파워(주) 표면처리된 수직형 기판 이송장치
TWI476139B (zh) * 2011-06-30 2015-03-11 Sfa Engineering Corp 用於傳送基板的裝置
KR102014299B1 (ko) * 2013-02-07 2019-08-26 주식회사 원익아이피에스 대상물 이송 시스템 및 이를 위한 캐리어 위치 초기화 방법
JP2014179508A (ja) * 2013-03-15 2014-09-25 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP6303167B2 (ja) 2013-11-07 2018-04-04 昭和電工株式会社 インライン式成膜装置及びそれを用いた磁気記録媒体の製造方法
JP6239954B2 (ja) * 2013-11-28 2017-11-29 中外炉工業株式会社 成膜方法、絶縁基板の製造方法、及びモジュール
DE102015009861A1 (de) * 2015-08-04 2017-02-09 Manz Ag Substratbearbeitungsvorrichtung und Beschichtungsverfahren
CN110042354B (zh) * 2019-04-19 2022-01-14 广东旗滨节能玻璃有限公司 一种玻璃镀膜传送系统及其控制方法
CN110128032A (zh) * 2019-06-24 2019-08-16 广东旗滨节能玻璃有限公司 玻璃镀膜传送系统及其控制方法
CN113581792B (zh) * 2021-08-04 2023-04-28 三一机器人科技有限公司 托盘位置校验方法、装置和托盘就位系统
CN115287609A (zh) * 2022-08-30 2022-11-04 新倍司特系统科技(苏州)有限公司 一种均匀涂覆大面积厚涂层的设备及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6290824B1 (en) * 1992-10-28 2001-09-18 Hitachi, Ltd. Magnetic film forming system
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6213704B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6919001B2 (en) * 2000-05-01 2005-07-19 Intevac, Inc. Disk coating system
JP2004018922A (ja) * 2002-06-14 2004-01-22 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP4278460B2 (ja) * 2003-08-25 2009-06-17 安川情報システム株式会社 ワーク搬送システムの制御方法
JP4447279B2 (ja) * 2003-10-15 2010-04-07 キヤノンアネルバ株式会社 成膜装置
JP2005138010A (ja) * 2003-11-05 2005-06-02 Sekisui Chem Co Ltd 常圧プラズマ処理装置およびレジスト剥離装置
US7296673B2 (en) * 2005-06-10 2007-11-20 Applied Materials, Inc. Substrate conveyor system
US7438175B2 (en) * 2005-06-10 2008-10-21 Applied Materials, Inc. Linear vacuum deposition system
US7770714B2 (en) * 2007-08-27 2010-08-10 Canon Anelva Corporation Transfer apparatus

Also Published As

Publication number Publication date
US8534975B2 (en) 2013-09-17
JP5529484B2 (ja) 2014-06-25
US20100101075A1 (en) 2010-04-29
CN101727920B (zh) 2012-02-22
CN101727920A (zh) 2010-06-09
JP2010135049A (ja) 2010-06-17

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