SG155179A1 - Heated gas box for pecvd applications - Google Patents

Heated gas box for pecvd applications

Info

Publication number
SG155179A1
SG155179A1 SG200905172-3A SG2009051723A SG155179A1 SG 155179 A1 SG155179 A1 SG 155179A1 SG 2009051723 A SG2009051723 A SG 2009051723A SG 155179 A1 SG155179 A1 SG 155179A1
Authority
SG
Singapore
Prior art keywords
gas box
lid
heated gas
gas
heated
Prior art date
Application number
SG200905172-3A
Other languages
English (en)
Inventor
Soovo Sen
Inna Shmurun
Thomas Nowak
Nancy Fung
Brian Hopper
Andrzej Kaszuba
Eller Juco
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG155179A1 publication Critical patent/SG155179A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Vapour Deposition (AREA)
SG200905172-3A 2004-08-03 2005-08-03 Heated gas box for pecvd applications SG155179A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/910,269 US7628863B2 (en) 2004-08-03 2004-08-03 Heated gas box for PECVD applications

Publications (1)

Publication Number Publication Date
SG155179A1 true SG155179A1 (en) 2009-09-30

Family

ID=35448162

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200905172-3A SG155179A1 (en) 2004-08-03 2005-08-03 Heated gas box for pecvd applications

Country Status (8)

Country Link
US (1) US7628863B2 (de)
EP (1) EP1797216A2 (de)
JP (1) JP4889640B2 (de)
KR (1) KR100870792B1 (de)
CN (1) CN1993495A (de)
SG (1) SG155179A1 (de)
TW (1) TWI318422B (de)
WO (1) WO2006017596A2 (de)

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US9157151B2 (en) * 2006-06-05 2015-10-13 Applied Materials, Inc. Elimination of first wafer effect for PECVD films
US20080050932A1 (en) * 2006-08-23 2008-02-28 Applied Materials, Inc. Overall defect reduction for PECVD films
US8444926B2 (en) * 2007-01-30 2013-05-21 Applied Materials, Inc. Processing chamber with heated chamber liner
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US9441295B2 (en) * 2010-05-14 2016-09-13 Solarcity Corporation Multi-channel gas-delivery system
US8502689B2 (en) 2010-09-23 2013-08-06 Applied Materials, Inc. System and method for voltage-based plasma excursion detection
US8587321B2 (en) 2010-09-24 2013-11-19 Applied Materials, Inc. System and method for current-based plasma excursion detection
WO2014052301A1 (en) * 2012-09-26 2014-04-03 Applied Materials, Inc. Controlling temperature in substrate processing systems
JP6242095B2 (ja) * 2013-06-28 2017-12-06 株式会社日立国際電気 クリーニング方法、半導体装置の製造方法、基板処理装置及びプログラム
US9972740B2 (en) 2015-06-07 2018-05-15 Tesla, Inc. Chemical vapor deposition tool and process for fabrication of photovoltaic structures
US10741428B2 (en) * 2016-04-11 2020-08-11 Applied Materials, Inc. Semiconductor processing chamber
US10428426B2 (en) * 2016-04-22 2019-10-01 Applied Materials, Inc. Method and apparatus to prevent deposition rate/thickness drift, reduce particle defects and increase remote plasma system lifetime
US9748434B1 (en) 2016-05-24 2017-08-29 Tesla, Inc. Systems, method and apparatus for curing conductive paste
US9954136B2 (en) 2016-08-03 2018-04-24 Tesla, Inc. Cassette optimized for an inline annealing system
US10115856B2 (en) 2016-10-31 2018-10-30 Tesla, Inc. System and method for curing conductive paste using induction heating
KR20200072640A (ko) 2018-12-12 2020-06-23 삼성디스플레이 주식회사 증착 장치
US11242600B2 (en) * 2020-06-17 2022-02-08 Applied Materials, Inc. High temperature face plate for deposition application
CN113130354A (zh) * 2021-04-09 2021-07-16 长鑫存储技术有限公司 半导体生产装置

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Also Published As

Publication number Publication date
KR100870792B1 (ko) 2008-11-27
TW200610039A (en) 2006-03-16
US20070107660A9 (en) 2007-05-17
WO2006017596A2 (en) 2006-02-16
CN1993495A (zh) 2007-07-04
KR20070037507A (ko) 2007-04-04
TWI318422B (en) 2009-12-11
WO2006017596A3 (en) 2006-10-19
US7628863B2 (en) 2009-12-08
JP4889640B2 (ja) 2012-03-07
JP2008509560A (ja) 2008-03-27
EP1797216A2 (de) 2007-06-20
US20060027165A1 (en) 2006-02-09

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