SG153747A1 - Alignment method, alignment system and product with alignment mark - Google Patents

Alignment method, alignment system and product with alignment mark

Info

Publication number
SG153747A1
SG153747A1 SG200808908-8A SG2008089088A SG153747A1 SG 153747 A1 SG153747 A1 SG 153747A1 SG 2008089088 A SG2008089088 A SG 2008089088A SG 153747 A1 SG153747 A1 SG 153747A1
Authority
SG
Singapore
Prior art keywords
alignment
product
pattern
alignment mark
tracks
Prior art date
Application number
SG200808908-8A
Other languages
English (en)
Inventor
Musa Sami
Haren Richard Johannes Franciscus Van
Lalbahadoersing Sanjaysingh
Wei Xiuhong
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG153747A1 publication Critical patent/SG153747A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG200808908-8A 2007-12-13 2008-12-01 Alignment method, alignment system and product with alignment mark SG153747A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US99699907P 2007-12-13 2007-12-13

Publications (1)

Publication Number Publication Date
SG153747A1 true SG153747A1 (en) 2009-07-29

Family

ID=40350252

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200808908-8A SG153747A1 (en) 2007-12-13 2008-12-01 Alignment method, alignment system and product with alignment mark

Country Status (7)

Country Link
US (1) US8072615B2 (de)
EP (1) EP2071402B1 (de)
JP (1) JP5192358B2 (de)
KR (1) KR101074047B1 (de)
CN (1) CN101458464B (de)
SG (1) SG153747A1 (de)
TW (1) TWI467350B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008299912A (ja) * 2007-05-29 2008-12-11 Hitachi Global Storage Technologies Netherlands Bv アライメント用パターンを備えたハードディスクメディアおよびアライメント方法
JP5006889B2 (ja) * 2008-02-21 2012-08-22 エーエスエムエル ネザーランズ ビー．ブイ． 粗ウェーハ位置合わせ用マーク構造及びこのようなマーク構造の製造方法
JP5623033B2 (ja) * 2009-06-23 2014-11-12 ルネサスエレクトロニクス株式会社 半導体装置、リソグラフィ方法、及び半導体装置の製造方法
EP2699967B1 (de) * 2011-04-22 2023-09-13 ASML Netherlands B.V. Positionsbestimmung in einem lithografiesystem mit einem substrat mit teilweise reflektierender druckmarke
JP2014513869A (ja) 2011-04-22 2014-06-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． ウェーハのようなターゲットを処理するためのリソグラフィシステム、及びウェーハのようなターゲットを処理するためのリソグラフィシステムを動作させる方法
US8692204B2 (en) * 2011-04-26 2014-04-08 Kla-Tencor Corporation Apparatus and methods for electron beam detection
US9383662B2 (en) 2011-05-13 2016-07-05 Mapper Lithography Ip B.V. Lithography system for processing at least a part of a target
JP5696079B2 (ja) 2012-03-22 2015-04-08 株式会社東芝 マスクおよび半導体装置の製造方法
US9034720B2 (en) * 2012-08-17 2015-05-19 Globalfoundries Singapore Pte. Ltd. Litho scanner alignment signal improvement
US9939742B2 (en) 2012-11-05 2018-04-10 Asml Netherlands B.V. Method and apparatus for measuring asymmetry of a microstructure, position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method
WO2014081913A1 (en) * 2012-11-21 2014-05-30 Kla-Tencor Corporation Process compatible segmented targets and design methods
KR101707278B1 (ko) * 2013-02-25 2017-02-15 가부시키가이샤 스크린 홀딩스 패턴 형성 장치 및 패턴 형성 방법 및 얼라이먼트 장치 및 얼라이먼트 방법
CN105143986B (zh) * 2013-03-20 2017-04-26 Asml荷兰有限公司 用于测量微结构的非对称性的方法和设备、位置测量方法、位置测量设备、光刻设备和器件制造方法
WO2014210381A1 (en) 2013-06-27 2014-12-31 Kla-Tencor Corporation Polarization measurements of metrology targets and corresponding target designs
US9410902B1 (en) 2015-05-05 2016-08-09 United Microelectronics Corp. Overlay measurement method
JP6595870B2 (ja) * 2015-09-30 2019-10-23 株式会社Ｓｃｒｅｅｎホールディングス 補正情報生成装置、描画装置、補正情報生成方法および描画方法
US10585357B2 (en) 2015-12-28 2020-03-10 Asml Netherlands B.V. Alternative target design for metrology using modulation techniques
CN108010857B (zh) * 2016-11-01 2020-12-29 北大方正集团有限公司 离子注入工艺对准质量的检验方法
US11537051B2 (en) * 2017-03-16 2022-12-27 Nikon Corporation Control apparatus and control method, exposure apparatus and exposure method, device manufacturing method, data generating method and program
DE102017204719A1 (de) * 2017-03-21 2018-09-27 Carl Zeiss Smt Gmbh Metrologie-Target
US10663633B2 (en) * 2017-06-29 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Aperture design and methods thereof
EP3451060A1 (de) * 2017-08-28 2019-03-06 ASML Netherlands B.V. Substrat, metrologievorrichtung und zugehörige verfahren für einen lithographischen prozess
CN109062452B (zh) * 2018-07-26 2021-06-25 业成科技（成都）有限公司 对位记号辨识系统
US10651129B1 (en) * 2019-02-12 2020-05-12 Micron Technology, Inc. Methods of forming alignment marks during patterning of semiconductor material
US10922808B2 (en) * 2019-02-14 2021-02-16 KLA—Tencor Corp. File selection for test image to design alignment
WO2020169419A1 (en) * 2019-02-19 2020-08-27 Asml Holding N.V. Metrology system, lithographic apparatus, and method
NL2024949A (en) 2019-03-21 2020-09-22 Asml Netherlands Bv Method for controlling a lithographic system
US11614692B2 (en) * 2019-03-25 2023-03-28 Kla Corporation Self-Moire grating design for use in metrology
CN110676243B (zh) * 2019-09-30 2021-09-14 芯盟科技有限公司 芯片及对位方法
CN114384769B (zh) * 2020-10-19 2024-05-14 联华电子股份有限公司 对准系统及对准标记
CN113725197A (zh) * 2021-08-31 2021-11-30 长江存储科技有限责任公司 半导体结构及其形成方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153818A (ja) * 1986-12-18 1988-06-27 Oki Electric Ind Co Ltd アライメント用マ−ク
US5418613A (en) * 1990-11-20 1995-05-23 Canon Kabushiki Kaisha Method and apparatus for detecting the position of a substrate having first and second patterns of different sizes
US5422723A (en) 1992-09-21 1995-06-06 Texas Instruments Incorporated Diffraction gratings for submicron linewidth measurement
JP2548068B2 (ja) * 1993-02-22 1996-10-30 株式会社ソルテック 位置ずれ及びギャップ検出方法
JP2666761B2 (ja) * 1995-03-28 1997-10-22 日本電気株式会社 半導体ウェハ
US5777392A (en) 1995-03-28 1998-07-07 Nec Corporation Semiconductor device having improved alignment marks
EP0823667A2 (de) 1996-08-06 1998-02-11 Nikon Corporation Ausrichtvorrichtung und eine damit versehene Belichtungsvorrichtung
JPH10270347A (ja) * 1997-03-24 1998-10-09 Nikon Corp 位置ずれ検出方法及びその装置
JP2000252190A (ja) * 1999-02-26 2000-09-14 Matsushita Electronics Industry Corp 半導体装置のアライメントマーク
JP4269393B2 (ja) 1999-03-03 2009-05-27 株式会社ニコン アライメントマーク及びアライメント方法
JP3371852B2 (ja) 1999-07-09 2003-01-27 日本電気株式会社 レチクル
US7115858B1 (en) * 2000-09-25 2006-10-03 Nanometrics Incorporated Apparatus and method for the measurement of diffracting structures
KR100500469B1 (ko) * 2001-01-12 2005-07-12 삼성전자주식회사 정렬마크와 이를 이용하는 노광정렬시스템 및 그 정렬방법
DE60319462T2 (de) * 2002-06-11 2009-03-12 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
KR100543536B1 (ko) 2002-09-20 2006-01-20 에이에스엠엘 네델란즈 비.브이. 리소그래피 마커구조체, 상기 리소그래피 마커구조체를포함하는 리소그래피 투영장치 및 상기 리소그래피마커구조체를 사용하여 기판을 정렬하는 방법
US7440105B2 (en) * 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
SG124270A1 (en) * 2002-12-16 2006-08-30 Asml Netherlands Bv Lithographic apparatus with alignment subsystem, device manufacturing method using alignment, and alignment structure
DE10315086B4 (de) * 2003-04-02 2006-08-24 Infineon Technologies Ag Verfahren und Vorrichtung zum Ausrichten von Halbleiterwafern bei der Halbleiterherstellung
US7113255B2 (en) * 2003-12-19 2006-09-26 Asml Holding N.V. Grating patch arrangement, lithographic apparatus, method of testing, device manufacturing method, and device manufactured thereby
US7130049B2 (en) * 2003-12-24 2006-10-31 Asml Netherlands B.V. Method of measurement, method for providing alignment marks, and device manufacturing method
JP4401814B2 (ja) * 2004-02-25 2010-01-20 株式会社日立ハイテクノロジーズ 測長用標準部材及び電子ビーム測長装置
US7737566B2 (en) * 2005-06-01 2010-06-15 Asml Netherlands B.V. Alignment devices and methods for providing phase depth control
US7687925B2 (en) 2005-09-07 2010-03-30 Infineon Technologies Ag Alignment marks for polarized light lithography and method for use thereof
US7863763B2 (en) 2005-11-22 2011-01-04 Asml Netherlands B.V. Binary sinusoidal sub-wavelength gratings as alignment marks
US7460231B2 (en) * 2006-03-27 2008-12-02 Asml Netherlands B.V. Alignment tool for a lithographic apparatus
JP2008003520A (ja) * 2006-06-26 2008-01-10 Toshiba Corp フォトマスク及び半導体装置の製造方法
TWI339778B (en) * 2006-07-12 2011-04-01 Ind Tech Res Inst Method for designing gratings

Also Published As

Publication number Publication date
CN101458464B (zh) 2013-03-27
EP2071402B1 (de) 2013-11-06
KR101074047B1 (ko) 2011-10-17
EP2071402A3 (de) 2012-02-29
EP2071402A2 (de) 2009-06-17
US8072615B2 (en) 2011-12-06
KR20090063157A (ko) 2009-06-17
TW200931209A (en) 2009-07-16
US20090153861A1 (en) 2009-06-18
JP5192358B2 (ja) 2013-05-08
TWI467350B (zh) 2015-01-01
JP2009147328A (ja) 2009-07-02
CN101458464A (zh) 2009-06-17

Similar Documents

Publication Publication Date Title
SG153747A1 (en) Alignment method, alignment system and product with alignment mark
IL234539B (en) Metrology method and device, lithographic system and device manufacturing method
SG131761A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
WO2006003452A3 (en) Scale reading apparatus
WO2013178404A3 (en) A method to determine the usefulness of alignment marks to correct overlay, and a combination of a lithographic apparatus and an overlay measurement system
Ye et al. Design of a precise and robust linearized converter for optical encoders using a ratiometric technique
WO2010049693A3 (en) Method for coordinate measuring system
TW200709587A (en) Circuit for measuring an eye size of data, and method of measuring the eye size of data
EP2458441A3 (de) Messverfahren, Vorrichtung und Substrat
WO2012119126A3 (en) Apparatus, system, and method for automatic identification of sensor placement
EP2581710A3 (de) Codiersystem, Maschinenwerkzeug und Transfervorrichtung
SG158187A1 (en) Lithographic apparatus with multiple alignment arrangements and alignment measurement method
WO2011097110A8 (en) Method and apparatus for precise positioning of a borehole measurement instrument
WO2012091843A3 (en) Systems and methods for evaluating range sensor calibration data
AU2003300005A1 (en) Differential critical dimension and overlay metrology apparatus and measurement method
WO2003104851A3 (en) METHOD USING NONLINEAR OPTICAL TECHNIQUE TO DETECT INTERACTIONS INVOLVING CONFORMATIONAL MODIFICATION
NZ596559A (en) Dry coating thickness measurement and instrument
DE602008002764D1 (de) Verfahren und system zur überwachung der eigenschaften von musterstrukturen
EP2549239A3 (de) Elektromagnetischer Induktions-Absolutpositionierungs-Mess-Codierer
DE602005020614D1 (de) Verfahren und Vorrichtung für redundante Abstandsmessung und für das Aufheben von Phasenversatz
TW200951426A (en) Apparatus for detecting periodic defect and method therefor
KR20190107298A (ko) 산란계측 측정들에서의 격자 비대칭성들에 관련된 부정확성들의 완화
FI20065217A0 (fi) Menetelmä synkronoidun aikakeskiarvon laskemiseksi
GB2507022A (en) Grating-based scanner with phase and pitch adjustment
ATE496282T1 (de) Scale- und readhead-system