SG150465A1 - Layered-filament lattice for chemical mechanical polishing - Google Patents

Layered-filament lattice for chemical mechanical polishing

Info

Publication number
SG150465A1
SG150465A1 SG200806001-4A SG2008060014A SG150465A1 SG 150465 A1 SG150465 A1 SG 150465A1 SG 2008060014 A SG2008060014 A SG 2008060014A SG 150465 A1 SG150465 A1 SG 150465A1
Authority
SG
Singapore
Prior art keywords
polishing
filaments
multiple layers
layered
chemical mechanical
Prior art date
Application number
SG200806001-4A
Other languages
English (en)
Inventor
Gregory P Muldowney
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of SG150465A1 publication Critical patent/SG150465A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG200806001-4A 2007-08-16 2008-08-13 Layered-filament lattice for chemical mechanical polishing SG150465A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/893,495 US7517277B2 (en) 2007-08-16 2007-08-16 Layered-filament lattice for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
SG150465A1 true SG150465A1 (en) 2009-03-30

Family

ID=40032782

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200806001-4A SG150465A1 (en) 2007-08-16 2008-08-13 Layered-filament lattice for chemical mechanical polishing

Country Status (7)

Country Link
US (1) US7517277B2 (enExample)
EP (1) EP2025459B1 (enExample)
JP (1) JP5452897B2 (enExample)
KR (1) KR101539462B1 (enExample)
CN (1) CN101367202B (enExample)
SG (1) SG150465A1 (enExample)
TW (1) TWI446424B (enExample)

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CN102229105A (zh) * 2011-06-28 2011-11-02 清华大学 化学机械抛光方法
US9108291B2 (en) * 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
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US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
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TWI713526B (zh) * 2016-05-20 2020-12-21 智勝科技股份有限公司 基底層、具有基底層的研磨墊及研磨方法
US10849660B2 (en) 2017-02-21 2020-12-01 Diamabrush Llc Sanding screen device
CN106881636B (zh) * 2017-04-10 2018-10-23 上海理工大学 一种载液板及其制造方法以及磁性复合流体抛光头装置
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11524385B2 (en) 2019-06-07 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with lobed protruding structures
CN110587387A (zh) * 2019-06-24 2019-12-20 南昌大学 一种超声电化学机械抛光蓝宝石衬底材料的装置
US20210053056A1 (en) * 2019-08-23 2021-02-25 Lawrence Livermore National Security, Llc Systems and methods for reaction and transport engineering via cellular fluidics
CN112677062B (zh) * 2019-10-18 2022-12-09 江苏韦尔博新材料科技有限公司 一种打磨钢材磨盘的专用磨粒地貌、其金刚石磨盘与制备方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
US11833638B2 (en) 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112935994B (zh) * 2021-01-29 2023-08-01 中国建筑材料科学研究总院有限公司 异型表面抛光装置及抛光方法
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

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Also Published As

Publication number Publication date
CN101367202A (zh) 2009-02-18
EP2025459A2 (en) 2009-02-18
TW200910443A (en) 2009-03-01
JP2009056586A (ja) 2009-03-19
EP2025459A3 (en) 2014-06-25
US20090047877A1 (en) 2009-02-19
EP2025459B1 (en) 2015-06-17
JP5452897B2 (ja) 2014-03-26
CN101367202B (zh) 2012-07-11
US7517277B2 (en) 2009-04-14
KR20090017992A (ko) 2009-02-19
KR101539462B1 (ko) 2015-07-24
TWI446424B (zh) 2014-07-21

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