SG150404A1 - Semiconductor assemblies and methods of manufacturing such assemblies - Google Patents

Semiconductor assemblies and methods of manufacturing such assemblies

Info

Publication number
SG150404A1
SG150404A1 SG200706296-1A SG2007062961A SG150404A1 SG 150404 A1 SG150404 A1 SG 150404A1 SG 2007062961 A SG2007062961 A SG 2007062961A SG 150404 A1 SG150404 A1 SG 150404A1
Authority
SG
Singapore
Prior art keywords
assemblies
manufacturing
methods
molded portion
semiconductor
Prior art date
Application number
SG200706296-1A
Other languages
English (en)
Inventor
Chua Swee Kwang
Boon Suan Jeung
Chia Yong Poo
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to SG200706296-1A priority Critical patent/SG150404A1/en
Priority to US11/933,754 priority patent/US7674655B2/en
Priority to PCT/US2008/073878 priority patent/WO2009032539A2/en
Priority to CN2008801044103A priority patent/CN101785093B/zh
Priority to EP08798380.5A priority patent/EP2195831B1/en
Priority to KR1020107005114A priority patent/KR101192084B1/ko
Priority to JP2010523046A priority patent/JP5136866B2/ja
Priority to TW097132934A priority patent/TWI387021B/zh
Publication of SG150404A1 publication Critical patent/SG150404A1/en
Priority to US12/696,182 priority patent/US7915711B2/en
Priority to US13/074,938 priority patent/US8362594B2/en

Links

Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG200706296-1A 2007-08-28 2007-08-28 Semiconductor assemblies and methods of manufacturing such assemblies SG150404A1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
SG200706296-1A SG150404A1 (en) 2007-08-28 2007-08-28 Semiconductor assemblies and methods of manufacturing such assemblies
US11/933,754 US7674655B2 (en) 2007-08-28 2007-11-01 Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material
PCT/US2008/073878 WO2009032539A2 (en) 2007-08-28 2008-08-21 Semiconductor assemblies and methods of manufacturing such assemblies
CN2008801044103A CN101785093B (zh) 2007-08-28 2008-08-21 半导体组合件及制造所述组合件的方法
EP08798380.5A EP2195831B1 (en) 2007-08-28 2008-08-21 A method of manufacturing a semiconductor device and the corresponding intermediate product
KR1020107005114A KR101192084B1 (ko) 2007-08-28 2008-08-21 반도체 어셈블리 및 이러한 어셈블리의 제조 방법
JP2010523046A JP5136866B2 (ja) 2007-08-28 2008-08-21 半導体アセンブリ、およびそのアセンブリの製造方法
TW097132934A TWI387021B (zh) 2007-08-28 2008-08-28 半導體組件及製造該組件之方法
US12/696,182 US7915711B2 (en) 2007-08-28 2010-01-29 Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die
US13/074,938 US8362594B2 (en) 2007-08-28 2011-03-29 Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200706296-1A SG150404A1 (en) 2007-08-28 2007-08-28 Semiconductor assemblies and methods of manufacturing such assemblies

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SG150404A1 true SG150404A1 (en) 2009-03-30

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EP (1) EP2195831B1 (ko)
JP (1) JP5136866B2 (ko)
KR (1) KR101192084B1 (ko)
CN (1) CN101785093B (ko)
SG (1) SG150404A1 (ko)
TW (1) TWI387021B (ko)
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Also Published As

Publication number Publication date
EP2195831B1 (en) 2021-01-20
CN101785093A (zh) 2010-07-21
WO2009032539A3 (en) 2009-06-04
US7674655B2 (en) 2010-03-09
KR101192084B1 (ko) 2012-10-17
TW200917396A (en) 2009-04-16
TWI387021B (zh) 2013-02-21
US7915711B2 (en) 2011-03-29
US20110175206A1 (en) 2011-07-21
JP5136866B2 (ja) 2013-02-06
US8362594B2 (en) 2013-01-29
EP2195831A2 (en) 2010-06-16
KR20100041874A (ko) 2010-04-22
JP2010538469A (ja) 2010-12-09
WO2009032539A2 (en) 2009-03-12
US20090057843A1 (en) 2009-03-05
CN101785093B (zh) 2013-03-13
US20100133662A1 (en) 2010-06-03

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