SG148902A1 - Die ejector with illuminating unit - Google Patents

Die ejector with illuminating unit

Info

Publication number
SG148902A1
SG148902A1 SG200705113-9A SG2007051139A SG148902A1 SG 148902 A1 SG148902 A1 SG 148902A1 SG 2007051139 A SG2007051139 A SG 2007051139A SG 148902 A1 SG148902 A1 SG 148902A1
Authority
SG
Singapore
Prior art keywords
ejector
die
wafer
illuminating unit
die ejector
Prior art date
Application number
SG200705113-9A
Other languages
English (en)
Inventor
Puah Yong Joo
Brunner Johann Joset
Original Assignee
Generic Power Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Generic Power Pte Ltd filed Critical Generic Power Pte Ltd
Priority to SG200705113-9A priority Critical patent/SG148902A1/en
Priority to PCT/SG2008/000241 priority patent/WO2009008839A1/fr
Publication of SG148902A1 publication Critical patent/SG148902A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200705113-9A 2007-07-09 2007-07-09 Die ejector with illuminating unit SG148902A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200705113-9A SG148902A1 (en) 2007-07-09 2007-07-09 Die ejector with illuminating unit
PCT/SG2008/000241 WO2009008839A1 (fr) 2007-07-09 2008-07-08 Éjecteur de puce avec unité d'éclairage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200705113-9A SG148902A1 (en) 2007-07-09 2007-07-09 Die ejector with illuminating unit

Publications (1)

Publication Number Publication Date
SG148902A1 true SG148902A1 (en) 2009-01-29

Family

ID=40228855

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705113-9A SG148902A1 (en) 2007-07-09 2007-07-09 Die ejector with illuminating unit

Country Status (2)

Country Link
SG (1) SG148902A1 (fr)
WO (1) WO2009008839A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101471773B1 (ko) * 2013-06-25 2014-12-10 세메스 주식회사 다이 이젝팅 장치
EP3198000B1 (fr) 2014-09-26 2020-09-16 Ovivo Inc. Digestion de boues activées par des déchets avec des algues

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125641A (en) * 1979-03-22 1980-09-27 Nec Corp Automatic chip selection apparatus
JP2800396B2 (ja) * 1990-10-09 1998-09-21 松下電器産業株式会社 チップの観察装置
JP2004022936A (ja) * 2002-06-19 2004-01-22 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法および分割装置
US7494900B2 (en) * 2006-05-25 2009-02-24 Electro Scientific Industries, Inc. Back side wafer dicing

Also Published As

Publication number Publication date
WO2009008839A1 (fr) 2009-01-15

Similar Documents

Publication Publication Date Title
KR101575833B1 (ko) 전자 부품 및/또는 캐리어를 배출 장치에 대하여 위치 결정하기 위한 장치 및 방법
JP4797081B2 (ja) レンズ部品の実装方法
EP1708513A3 (fr) Unité d'éclairage et appareil de projection d'images utilisant une telle unité
EP1708028A3 (fr) Elément optique, appareil d'exposition et procédé de fabrication d'un dispositif
EP2442095A3 (fr) Inspection de trou
SG148994A1 (en) Exposure apparatus, exposure method, method for producing device, and optical part
CN106920762A (zh) 半导体制造装置、半导体器件的制造方法及芯片贴装机
TW200636315A (en) Image pickup module and manufacturing method of image pickup module
NZ599753A (en) Led apparatus and method for accurate lens alignment
MY149740A (en) Optical detection device and method for detecting surface of components
TW200702656A (en) Surface defect inspection apparatus
TW200739061A (en) Method and system for inspecting surfaces with improved light efficiency
EP2036484A3 (fr) Dispositif de source lumineuse
CN205247063U (zh) 一种可视化系统及工艺腔室
DE502006004474D1 (de) Messvorrichtung
TW200719288A (en) System, display apparatus and method for providing controlled illumination using internal reflection
US20110293168A1 (en) Method for mounting transparent component
CN102672347B (zh) 激光加工装置
EP2314911A3 (fr) Appareil de source lumineuse
EP1763254A3 (fr) Système d'illumination optique et appareil de projection d'image
TW200722860A (en) Backlight module
SG148902A1 (en) Die ejector with illuminating unit
EP1715385A3 (fr) Appareil de mesure et appareil d'exposition équipé de celui-ci
JP2016128792A (ja) 光学測定装置及び発光素子搬送装置
EP2925112A1 (fr) Machine de montage de composants