SG132573A1 - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
SG132573A1
SG132573A1 SG200603493-8A SG2006034938A SG132573A1 SG 132573 A1 SG132573 A1 SG 132573A1 SG 2006034938 A SG2006034938 A SG 2006034938A SG 132573 A1 SG132573 A1 SG 132573A1
Authority
SG
Singapore
Prior art keywords
plating apparatus
plating
Prior art date
Application number
SG200603493-8A
Other languages
English (en)
Inventor
Yuji Uchiumi
Original Assignee
Electroplating Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Eng filed Critical Electroplating Eng
Publication of SG132573A1 publication Critical patent/SG132573A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
SG200603493-8A 2005-11-22 2006-05-25 Plating apparatus SG132573A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005336916 2005-11-22
JP2006025673A JP4822858B2 (ja) 2005-11-22 2006-02-02 めっき装置

Publications (1)

Publication Number Publication Date
SG132573A1 true SG132573A1 (en) 2007-06-28

Family

ID=38052388

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200603493-8A SG132573A1 (en) 2005-11-22 2006-05-25 Plating apparatus

Country Status (5)

Country Link
US (1) US7799186B2 (ja)
JP (1) JP4822858B2 (ja)
KR (1) KR100772755B1 (ja)
SG (1) SG132573A1 (ja)
TW (1) TWI319785B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007291419A (ja) * 2006-04-21 2007-11-08 Nec Electronics Corp メッキ処理装置
KR100990029B1 (ko) * 2008-07-25 2010-10-26 주식회사 케이씨텍 기판도금장치
JP5672672B2 (ja) * 2009-07-10 2015-02-18 富士通セミコンダクター株式会社 めっき処理方法及び半導体装置の製造方法
JP6740951B2 (ja) * 2017-04-03 2020-08-19 トヨタ自動車株式会社 金属皮膜の成膜装置
EP3868923A1 (en) * 2020-02-19 2021-08-25 Semsysco GmbH Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate
JP2022081869A (ja) * 2020-11-20 2022-06-01 三友セミコンエンジニアリング株式会社 めっき装置
JP6951609B1 (ja) * 2020-12-28 2021-10-20 株式会社荏原製作所 めっき装置
JP2022122494A (ja) * 2021-02-10 2022-08-23 キオクシア株式会社 陽極化成装置及び陽極化成方法
KR102475318B1 (ko) * 2021-10-28 2022-12-08 가부시키가이샤 에바라 세이사꾸쇼 도금 장치
JP7165843B1 (ja) * 2022-03-31 2022-11-04 株式会社荏原製作所 めっき装置及びめっき方法
CN114808055B (zh) * 2022-04-02 2023-07-04 中国电子科技集团公司第三十八研究所 局部电镀保护装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831834A (ja) * 1994-07-20 1996-02-02 Nippondenso Co Ltd 半導体ウエハのめっき方法
JPH09287095A (ja) * 1996-04-19 1997-11-04 Sagami Shokai:Kk 電気メッキ装置
JPH10152798A (ja) * 1996-10-15 1998-06-09 Reynolds Tech Fabricators Inc 電気めっきセルおよびこのセルを用いためっき方法
US6284108B1 (en) * 1998-08-31 2001-09-04 Louis DiFrancesco Method and apparatus for momentum plating

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123089A (ja) * 1987-11-04 1989-05-16 Mitsubishi Electric Corp メッキ装置
US6126798A (en) * 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
JP2908790B1 (ja) 1998-06-12 1999-06-21 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置及びそれを用いたウェーハのめっき方法
JP2001316868A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd カソード用シート、電解メッキ装置及び電解メッキ方法
JP2001316867A (ja) 2000-05-08 2001-11-16 Tokyo Electron Ltd 液処理装置及び液処理方法
US6527920B1 (en) * 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
JP3568455B2 (ja) * 2000-06-14 2004-09-22 大日本スクリーン製造株式会社 基板メッキ装置
JP2002097598A (ja) * 2000-09-25 2002-04-02 Mitsubishi Electric Corp 電解メッキ装置
US6964792B1 (en) * 2000-11-03 2005-11-15 Novellus Systems, Inc. Methods and apparatus for controlling electrolyte flow for uniform plating
JP3746221B2 (ja) * 2001-10-11 2006-02-15 日本エレクトロプレイテイング・エンジニヤース株式会社 カップ式めっき装置
JP2003201600A (ja) * 2002-01-10 2003-07-18 Tokyo Electron Ltd メッキ処理装置、および半導体デバイスの製造方法
JP3477469B1 (ja) 2002-10-08 2003-12-10 東京エレクトロン株式会社 液処理装置及び液処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831834A (ja) * 1994-07-20 1996-02-02 Nippondenso Co Ltd 半導体ウエハのめっき方法
JPH09287095A (ja) * 1996-04-19 1997-11-04 Sagami Shokai:Kk 電気メッキ装置
JPH10152798A (ja) * 1996-10-15 1998-06-09 Reynolds Tech Fabricators Inc 電気めっきセルおよびこのセルを用いためっき方法
US6284108B1 (en) * 1998-08-31 2001-09-04 Louis DiFrancesco Method and apparatus for momentum plating

Also Published As

Publication number Publication date
KR100772755B1 (ko) 2007-11-01
KR20070054089A (ko) 2007-05-28
JP4822858B2 (ja) 2011-11-24
JP2007169773A (ja) 2007-07-05
US7799186B2 (en) 2010-09-21
US20070114127A1 (en) 2007-05-24
TW200720488A (en) 2007-06-01
TWI319785B (en) 2010-01-21

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