SG121162A1 - Apparatus and method for procesing a substrate - Google Patents

Apparatus and method for procesing a substrate

Info

Publication number
SG121162A1
SG121162A1 SG200506095A SG200506095A SG121162A1 SG 121162 A1 SG121162 A1 SG 121162A1 SG 200506095 A SG200506095 A SG 200506095A SG 200506095 A SG200506095 A SG 200506095A SG 121162 A1 SG121162 A1 SG 121162A1
Authority
SG
Singapore
Prior art keywords
procesing
substrate
Prior art date
Application number
SG200506095A
Other languages
English (en)
Inventor
James P Garcia
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG121162A1 publication Critical patent/SG121162A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
SG200506095A 2004-09-30 2005-09-21 Apparatus and method for procesing a substrate SG121162A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/957,260 US7520285B2 (en) 2002-09-30 2004-09-30 Apparatus and method for processing a substrate

Publications (1)

Publication Number Publication Date
SG121162A1 true SG121162A1 (en) 2006-04-26

Family

ID=35482287

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200506095A SG121162A1 (en) 2004-09-30 2005-09-21 Apparatus and method for procesing a substrate

Country Status (8)

Country Link
US (2) US7520285B2 (ja)
EP (1) EP1643541B1 (ja)
JP (1) JP4578373B2 (ja)
KR (1) KR101164826B1 (ja)
CN (1) CN1794420B (ja)
MY (1) MY163666A (ja)
SG (1) SG121162A1 (ja)
TW (1) TWI278358B (ja)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7584761B1 (en) * 2000-06-30 2009-09-08 Lam Research Corporation Wafer edge surface treatment with liquid meniscus
US6884145B2 (en) * 2002-11-22 2005-04-26 Samsung Austin Semiconductor, L.P. High selectivity slurry delivery system
KR101178754B1 (ko) * 2003-04-10 2012-09-07 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
KR20170064003A (ko) * 2003-04-10 2017-06-08 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
KR101707294B1 (ko) * 2004-03-25 2017-02-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8844461B2 (en) 2007-04-16 2014-09-30 Lam Research Corporation Fluid handling system for wafer electroless plating and associated methods
US8485120B2 (en) 2007-04-16 2013-07-16 Lam Research Corporation Method and apparatus for wafer electroless plating
US20060201425A1 (en) * 2005-03-08 2006-09-14 Applied Microstructures, Inc. Precursor preparation for controlled deposition coatings
US8813764B2 (en) * 2009-05-29 2014-08-26 Lam Research Corporation Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
US7811423B2 (en) * 2006-10-06 2010-10-12 Lam Research Corporation Proximity processing using controlled batch volume with an integrated proximity head
JP4755573B2 (ja) * 2006-11-30 2011-08-24 東京応化工業株式会社 処理装置および処理方法、ならびに表面処理治具
US8464736B1 (en) * 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US8141566B2 (en) * 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
JP4971078B2 (ja) * 2007-08-30 2012-07-11 東京応化工業株式会社 表面処理装置
US8226775B2 (en) * 2007-12-14 2012-07-24 Lam Research Corporation Methods for particle removal by single-phase and two-phase media
CN101971299B (zh) * 2008-02-08 2013-03-20 朗姆研究公司 用于晶片表面处理中相对临近头的均匀的流体流率的设备
JP5239457B2 (ja) * 2008-03-31 2013-07-17 Ｊｆｅスチール株式会社 金属帯への塗装方法
US8421993B2 (en) * 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US8828145B2 (en) * 2009-03-10 2014-09-09 Lam Research Corporation Method of particle contaminant removal
KR20100066631A (ko) * 2008-12-10 2010-06-18 삼성전자주식회사 세정설비 및 그의 세정방법
US8317934B2 (en) * 2009-05-13 2012-11-27 Lam Research Corporation Multi-stage substrate cleaning method and apparatus
EP2315235B1 (en) * 2009-10-21 2019-04-24 IMEC vzw Method and apparatus for cleaning a semiconductor substrate
JP4927158B2 (ja) * 2009-12-25 2012-05-09 東京エレクトロン株式会社 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置
US20120260517A1 (en) * 2011-04-18 2012-10-18 Lam Research Corporation Apparatus and Method for Reducing Substrate Pattern Collapse During Drying Operations
CN102214558A (zh) * 2011-05-23 2011-10-12 叶伟清 晶圆表面局部定位清洗方法
CN102214559A (zh) * 2011-05-23 2011-10-12 叶伟清 晶圆亲水面表面清洗方法
CN102214553A (zh) * 2011-05-23 2011-10-12 叶伟清 晶圆端面清洗方法
CN102194726A (zh) * 2011-05-23 2011-09-21 叶伟清 晶圆表面局部定位采样方法
EP3900618A1 (en) * 2014-10-17 2021-10-27 G-Tech Medical, Inc. Systems and methods for processing electromyographic signals of the gastrointestinal tract
TWM522954U (zh) * 2015-12-03 2016-06-01 財團法人工業技術研究院 電沉積設備
CN105977188A (zh) * 2016-06-20 2016-09-28 刘玉忠 一种二极管油墨标记烘烤清洗装置
JP6916003B2 (ja) * 2017-02-24 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102116534B1 (ko) * 2018-06-25 2020-05-28 주식회사 에이치에스하이테크 기판 세정용 노즐 및 그 제조 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5601655A (en) * 1995-02-14 1997-02-11 Bok; Hendrik F. Method of cleaning substrates
JPH1133506A (ja) 1997-07-24 1999-02-09 Tadahiro Omi 流体処理装置及び洗浄処理システム
US6398975B1 (en) * 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
US7234477B2 (en) * 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
JP2002075947A (ja) * 2000-08-30 2002-03-15 Alps Electric Co Ltd ウェット処理装置
JP4003441B2 (ja) 2001-11-08 2007-11-07 セイコーエプソン株式会社 表面処理装置および表面処理方法
JP4003440B2 (ja) * 2001-11-08 2007-11-07 セイコーエプソン株式会社 表面処理装置および表面処理方法
US7367345B1 (en) * 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7198055B2 (en) 2002-09-30 2007-04-03 Lam Research Corporation Meniscus, vacuum, IPA vapor, drying manifold
US7093375B2 (en) * 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
IL161550A0 (en) * 2002-09-30 2004-09-27 Lam Res Corp Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
US6988327B2 (en) * 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7329321B2 (en) * 2002-09-30 2008-02-12 Lam Research Corporation Enhanced wafer cleaning method
TWI230396B (en) 2002-09-30 2005-04-01 Lam Res Corp System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7003899B1 (en) * 2004-09-30 2006-02-28 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head

Also Published As

Publication number Publication date
EP1643541B1 (en) 2014-02-26
US7862663B2 (en) 2011-01-04
CN1794420A (zh) 2006-06-28
US20090176360A1 (en) 2009-07-09
CN1794420B (zh) 2010-11-03
EP1643541A2 (en) 2006-04-05
TWI278358B (en) 2007-04-11
TW200628236A (en) 2006-08-16
JP4578373B2 (ja) 2010-11-10
MY163666A (en) 2017-10-13
EP1643541A3 (en) 2011-03-09
KR20060051981A (ko) 2006-05-19
KR101164826B1 (ko) 2012-07-11
JP2006148069A (ja) 2006-06-08
US7520285B2 (en) 2009-04-21
US20060005860A1 (en) 2006-01-12

Similar Documents

Publication Publication Date Title
SG121162A1 (en) Apparatus and method for procesing a substrate
GB0506187D0 (en) Apparatus and method for completing a wellbore
TWI365480B (en) Apparatus and method for treating substrate
GB0417953D0 (en) A method and apparatus for searching data
EP1600270A4 (en) DEVICE AND METHOD FOR SUBSTRATE SEPARATION
GB2433916B (en) Method and apparatus for supporting and clamping a substrate
HK1103855A1 (en) Substrate holding device, exposure apparatus having the same and method for producing a device
EP1817072A4 (en) METHOD AND DEVICE FOR REDUCING ADIPOSITAS
EP1806767A4 (en) SUBSTRATE TRANSFER DEVICE, SUBSTRATE TRANSFER METHOD AND EXPOSURE DEVICE
SG123786A1 (en) Apparatus and method for aligning devices on carriers
EP1801860A4 (en) SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
IL181633A0 (en) Substrate carrying device, substrate carrying method, and exposure device
ZA200709026B (en) Apparatus and method for coating a substrate
EP1831796A4 (en) METHOD AND DEVICE FOR AN APPLICATION CRAWLER
SG10201801998TA (en) Substrate holding device, exposure apparatus, and device manufacturing method
HK1110701A1 (en) Substrate holding apparatus, exposure apparatus and device manufacturing method
EP1784280A4 (en) METHOD AND DEVICE FOR LOCATING AND ORIENTING BRACKETS
SG121045A1 (en) Method and device for packaging a substrate
SG119321A1 (en) Wafer dividing method and apparatus
GB2445699B8 (en) Apparatus and method for finding a device
HK1117099A1 (en) Method for pattern formation and apparatus for pattern formation
EP1976806A4 (en) METHOD AND DEVICE FOR PROCESSING A SUBSTRATE
GB2417266B (en) Apparatus and method for repairing tubulars
GB2435795B (en) A Method and apparatus for demagnetizing a borehole
EP1757003A4 (en) METHOD AND DEVICE FOR DATA TRANSFER