SG117482A1 - Flip chip bonder - Google Patents

Flip chip bonder

Info

Publication number
SG117482A1
SG117482A1 SG200401977A SG200401977A SG117482A1 SG 117482 A1 SG117482 A1 SG 117482A1 SG 200401977 A SG200401977 A SG 200401977A SG 200401977 A SG200401977 A SG 200401977A SG 117482 A1 SG117482 A1 SG 117482A1
Authority
SG
Singapore
Prior art keywords
flip chip
chip bonder
bonder
flip
chip
Prior art date
Application number
SG200401977A
Other languages
English (en)
Inventor
Arai Kazuhisa
Mori Takashi
Sandoh Hideyuki
Namioka Shinichi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG117482A1 publication Critical patent/SG117482A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
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    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/13001—Core members of the bump connector
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/749—Tools for reworking, e.g. for shaping
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    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01068—Erbium [Er]
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    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
SG200401977A 2003-04-15 2004-11-08 Flip chip bonder SG117482A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003110538A JP4057457B2 (ja) 2003-04-15 2003-04-15 フリップチップボンダー

Publications (1)

Publication Number Publication Date
SG117482A1 true SG117482A1 (en) 2005-12-29

Family

ID=33156961

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200401977A SG117482A1 (en) 2003-04-15 2004-11-08 Flip chip bonder

Country Status (5)

Country Link
US (1) US7222772B2 (ja)
JP (1) JP4057457B2 (ja)
CN (1) CN100378936C (ja)
DE (1) DE102004017836B4 (ja)
SG (1) SG117482A1 (ja)

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JP2004319697A (ja) * 2003-04-15 2004-11-11 Disco Abrasive Syst Ltd 板状物に形成された電極の加工装置
JP4153899B2 (ja) * 2004-05-25 2008-09-24 株式会社ディスコ 加工装置におけるチャックテーブルの加工方法
US7656810B2 (en) * 2005-03-25 2010-02-02 Microsoft Corporation System and method for monitoring and reacting to peer-to-peer network metrics
US7875496B2 (en) * 2005-05-17 2011-01-25 Panasonic Corporation Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
JP4767090B2 (ja) * 2006-05-31 2011-09-07 富士通株式会社 半導体装置およびその製造方法
US7845543B1 (en) * 2009-11-17 2010-12-07 Asm Assembly Automation Ltd Apparatus and method for bonding multiple dice
JP2012240148A (ja) * 2011-05-18 2012-12-10 Disco Corp バイト切削装置及び被加工物のバイト切削方法
AT512859B1 (de) * 2012-05-11 2018-06-15 Hanmi Semiconductor Co Ltd Halbleiterchip Wende- und Befestigungseinrichtung
TWI490956B (zh) * 2013-03-12 2015-07-01 Shinkawa Kk 覆晶接合器以及覆晶接合方法
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
JP2016120569A (ja) * 2014-12-25 2016-07-07 株式会社ディスコ 加工装置
CN113560760B (zh) * 2021-08-06 2022-09-16 甫洛照明有限公司 一种用于照明灯具的led芯片引脚焊接装置

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US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US4321738A (en) * 1979-05-07 1982-03-30 International Business Machines Corp. Apparatus and method for rework dressing of a chip site
US5060843A (en) * 1989-06-07 1991-10-29 Nec Corporation Process of forming bump on electrode of semiconductor chip and apparatus used therefor
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5263620A (en) * 1992-02-28 1993-11-23 International Business Machines Corporation Wirebond removal apparatus using alternating fluid stream
JP2707189B2 (ja) * 1992-08-26 1998-01-28 株式会社日立製作所 電子部品の基板からの取外し方法及び装置
KR0129119B1 (ko) * 1992-11-27 1998-04-07 모리시다 요이찌 반도체칩의 제거방법 및 제거장치
US5340011A (en) * 1992-12-09 1994-08-23 Lsi Logic Corporation Adjustable height work holder for bonding semiconductor dies
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
KR100199293B1 (ko) * 1996-11-08 1999-06-15 윤종용 반도체 패키지 제조 장치
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JP4249827B2 (ja) * 1998-12-04 2009-04-08 株式会社ディスコ 半導体ウェーハの製造方法
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US6244499B1 (en) * 1999-12-13 2001-06-12 Advanced Semiconductor Engineering, Inc. Structure of a ball bump for wire bonding and the formation thereof
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JP2002257829A (ja) 2001-02-27 2002-09-11 Advance Co Ltd 簡易体液検査ユニット
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Also Published As

Publication number Publication date
JP4057457B2 (ja) 2008-03-05
US20040206800A1 (en) 2004-10-21
DE102004017836B4 (de) 2017-05-11
CN100378936C (zh) 2008-04-02
CN1538509A (zh) 2004-10-20
JP2004319699A (ja) 2004-11-11
US7222772B2 (en) 2007-05-29
DE102004017836A1 (de) 2004-11-18

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