IL165948A0 - Chip packaging - Google Patents

Chip packaging

Info

Publication number
IL165948A0
IL165948A0 IL16594804A IL16594804A IL165948A0 IL 165948 A0 IL165948 A0 IL 165948A0 IL 16594804 A IL16594804 A IL 16594804A IL 16594804 A IL16594804 A IL 16594804A IL 165948 A0 IL165948 A0 IL 165948A0
Authority
IL
Israel
Prior art keywords
chip packaging
packaging
chip
Prior art date
Application number
IL16594804A
Original Assignee
Rafael Armament Dev Authority
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafael Armament Dev Authority filed Critical Rafael Armament Dev Authority
Priority to IL16594804A priority Critical patent/IL165948A0/en
Priority to PCT/IL2005/001310 priority patent/WO2006067784A1/en
Publication of IL165948A0 publication Critical patent/IL165948A0/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
IL16594804A 2004-12-23 2004-12-23 Chip packaging IL165948A0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IL16594804A IL165948A0 (en) 2004-12-23 2004-12-23 Chip packaging
PCT/IL2005/001310 WO2006067784A1 (en) 2004-12-23 2005-12-06 Chip packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL16594804A IL165948A0 (en) 2004-12-23 2004-12-23 Chip packaging

Publications (1)

Publication Number Publication Date
IL165948A0 true IL165948A0 (en) 2006-01-15

Family

ID=35839758

Family Applications (1)

Application Number Title Priority Date Filing Date
IL16594804A IL165948A0 (en) 2004-12-23 2004-12-23 Chip packaging

Country Status (2)

Country Link
IL (1) IL165948A0 (en)
WO (1) WO2006067784A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103502139B (en) * 2011-04-20 2016-04-27 卡文迪什动力有限公司 Gaseous chemical product discharges to the injection in the cavity be formed in middle dielectric layer for thermal diffusion afterwards
EP2736071B8 (en) * 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Wafer level package with getter
FR3008691B1 (en) * 2013-07-22 2016-12-23 Commissariat Energie Atomique DEVICE COMPRISING A FLUID CHANNEL PROVIDED WITH AT LEAST ONE MICRO OR NANOELECTRONIC SYSTEM AND METHOD OF MAKING SUCH A DEVICE
DE102014002824A1 (en) * 2014-02-25 2015-08-27 Northrop Grumman Litef Gmbh Method for producing a component
TWI553796B (en) * 2015-08-18 2016-10-11 姜崇義 Packaging method and system of temperature sensing chip
US11551921B1 (en) * 2019-09-25 2023-01-10 National Technology & Engineering Solutions Of Sandia, Llc Miniaturized vacuum package and methods of making same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2627875B1 (en) * 1988-02-09 1991-08-16 Thomson Csf HOUSING PROVIDING PROTECTION OF INFORMATION CONTAINED IN AN ELECTRONIC CIRCUIT
US6040625A (en) * 1997-09-25 2000-03-21 I/O Sensors, Inc. Sensor package arrangement
US6281572B1 (en) * 1997-12-05 2001-08-28 The Charles Stark Draper Laboratory, Inc. Integrated circuit header assembly
EP1310380A1 (en) * 2001-11-07 2003-05-14 SensoNor asa A micro-mechanical device and method for producing the same
FR2842022B1 (en) * 2002-07-03 2005-05-06 Commissariat Energie Atomique DEVICE FOR HOLDING A VACUUM OBJECT AND METHODS OF MANUFACTURING THE SAME, APPLICATION TO NON-COOLED INTRARED SENSORS
US20040147056A1 (en) * 2003-01-29 2004-07-29 Mckinnell James C. Micro-fabricated device and method of making

Also Published As

Publication number Publication date
WO2006067784A1 (en) 2006-06-29

Similar Documents

Publication Publication Date Title
EP1773679A4 (en) Packages
GB0426825D0 (en) Package
ZAA200501234S (en) Packages
GB0427805D0 (en) Packaging
IL165948A0 (en) Chip packaging
GB0414984D0 (en) Package
GB0423612D0 (en) Packaging
GB0420995D0 (en) Packaging
GB0409746D0 (en) Packaging
GB0405584D0 (en) Packaging
GB0418163D0 (en) Packaging
GB2419348B (en) Packaging
GB0421043D0 (en) Packaging nine
GB0401602D0 (en) Packaging
GB0416400D0 (en) Packaging
GB0412322D0 (en) Packaging
GB0423192D0 (en) Packaging
AU302566S (en) Packaging
GB0418629D0 (en) Packaging
AU157652S (en) Packaging
AU155691S (en) Packaging
AU158570S (en) Packaging
GB0426411D0 (en) Packaging
AU158569S (en) Packaging
AU158568S (en) Packaging