TWI553796B - Packaging method and system of temperature sensing chip - Google Patents

Description

Temperature measurement chip packaging method and system thereof

The following description relates to a temperature measurement wafer packaging method and system thereof, and more particularly to techniques for temperature measurement wafer packaging and inspection using a connected chamber.

At present, infrared (IR) video cameras have been used to record and store continuous thermal images. In an infrared (IR) video camera, a temperature measurement wafer is included, which includes an array of temperature sensing elements, each temperature sensing. The component can change its resistance value according to the infrared radiation energy received by the component. Therefore, the resistance value change of each temperature sensing component can correspond to the thermal energy intensity, and each temperature sensing component array can generate a thermal image.

The temperature measuring chip is disposed on a pedestal and then encapsulated by the cover and the pedestal, and the package space is maintained in a vacuum state in order to avoid thermal convection in the package space and affect the thermal energy sensed by the temperature sensing element array. The sensitivity of the array of temperature sensing elements is related to the degree of vacuum in the package space.

Since mobile phones have universal cameras, how to increase the application of this camera is an area that many manufacturers value. If thermal sensing technology can be applied to mobile phones, it will be a great boon to consumers. However, the current price of temperature measurement cameras is still high, which is not conducive to popularization. One of the reasons is that the current packaging process and the inspection process of the temperature measurement chip are not integrated, resulting in an inefficient cost reduction.

In view of the above problems, an object of the present invention is to provide a temperature measurement chip packaging method and system, which can effectively improve the efficiency of temperature measurement chip packaging and detection.

Based on the above objects, the present invention provides a temperature measurement wafer packaging method comprising the following steps. (a) providing a first chamber for transporting the substrate and the plurality of temperature measuring wafers to the first chamber, the substrate being divided into a plurality of wafer areas and a plurality of welding areas, and the plurality of temperature measuring units in the first chamber Soldering the wafers to the plurality of wafer regions; (b) providing a second chamber connected to the first chamber, transporting the plurality of wafer covers, the plurality of sealing bodies, and the substrate combined with the plurality of temperature measuring wafers to the first a two-chamber, a plurality of wafer covers are individually provided with grooves, and a plurality of sealing bodies are respectively placed on the plurality of soldering regions of the substrate in the second chamber, and the plurality of wafer covers are aligned On the substrate, the plurality of temperature measuring wafers are respectively located in the individual grooves of the plurality of wafer covers; (c) providing a third chamber connected to the second chamber, and the substrate covering the plurality of wafer covers Transporting to the third chamber, irradiating the plurality of soldering regions of the substrate with a laser to melt the sealing body, so that the plurality of wafer covers are combined with the substrate to form a plurality of package structures; (d) providing connection with the third chamber And a fourth chamber having a detection window, which will have a plurality of seals Structure to the fourth transport chamber, and to detect light transmitted through the irradiation detection window for a plurality of photodetector package, or to screen for classifying a plurality of package.

Preferably, after the plurality of wafer covers are placed on the substrate in the step (b) and before the laser is used in the step (c), the pre-pressing of the plurality of wafer covers is performed separately (pre- Bonding).

Preferably, at least one mechanical arm or at least one is disposed between the first chamber and the second chamber, between the second chamber and the third chamber, and between the third chamber and the fourth chamber. Conveyor belt for transportation.

Preferably, the second chamber and the third chamber respectively have a pump, and the plurality of pumps are used to discharge the air in the second chamber and the third chamber, and the second chamber and the third chamber are maintained at Vacuum state.

Preferably, in step (c), the substrate is further heated.

Preferably, in step (a), a plurality of getters are further provided, and the getter is separately disposed on the surface of the substrate.

Preferably, in step (b), a plurality of getters are further provided, and a plurality of getters are respectively disposed on the surfaces of the plurality of grooves.

Preferably, the temperature measurement chip packaging method of the present invention further comprises: cutting a plurality of package structures in the fourth chamber and outputting a plurality of package structures of different levels from the plurality of discharge ports of the fourth chamber.

In view of the above, the present invention further provides a temperature measurement wafer packaging system including a first chamber, a second chamber, a third chamber, a fourth chamber, a light emitting device, and a plurality of transport devices. The first chamber has a plurality of first inlets, a first outlet, and a welding device, and the substrate, the plurality of temperature measuring wafers, and the soldering system are respectively transported from the plurality of first inlets to the first chamber, on the substrate The system is divided into a plurality of wafer regions and a plurality of soldering regions, and the soldering device can respectively solder a plurality of temperature measuring wafers to a plurality of wafer regions through soldering. The second chamber has a plurality of second inlets, a second outlet, and a mounting device, and one of the plurality of second inlets is in communication with the first outlet, and the plurality of wafer covers, the plurality of The sealing body and the substrate combined with the plurality of temperature measuring wafers are respectively transported from the plurality of second inlets to the second chamber, and the plurality of wafer covers are individually provided with grooves, and the plurality of sealing bodies are respectively placed on the substrate. The plurality of wafer covers are aligned on the substrate, such that the plurality of temperature measurement wafers are respectively located in the plurality of grooves and the plurality of wafer cover systems are disposed on the plurality of sealing bodies. The third chamber has a third inlet port, a third discharge port, and a laser device. The third inlet port communicates with the second discharge port, and the substrate plate that has covered the plurality of wafer covers is from the third The inlet port is transported to the third chamber, and the laser device emits a plurality of soldering regions of the laser to irradiate the substrate to melt the sealing body, so that the plurality of wafer covers are combined with the substrate to form a plurality of package structures. The illuminating device is disposed outside the fourth chamber, and the illuminating device emits the detecting light. The fourth chamber has a fourth inlet, at least a fourth outlet, a detection window and a wafer detecting device. The fourth inlet is in communication with the third outlet, and the plurality of packaging structures are passed through the fourth inlet. The port is transported to the fourth chamber, and the wafer detecting device can be electrically connected to the plurality of package structures to receive the detection light penetrating the detection window for photoelectric detection to filter or classify the plurality of package structures. A plurality of transport devices are used to transport between the first chamber and the second chamber, between the second chamber and the third chamber, and between the third chamber and the fourth chamber, respectively.

Preferably, the second chamber further comprises a pre-pressing device for pre-bonding the wafer cover after the plurality of wafer covers are placed on the substrate.

Preferably, the plurality of transport devices comprise at least one robotic arm, at least one conveyor belt, or a combination of both.

Preferably, the second chamber and the third chamber respectively have a pump, and the plurality of pumps are used to discharge the air in the second chamber and the third chamber, and the second chamber and the third chamber are maintained at Vacuum state.

Preferably, the third chamber further comprises heating means for heating the substrate.

Preferably, the fourth chamber further comprises a cutting device for separating the plurality of package structures, and the plurality of package structures of different levels are respectively output from the plurality of discharge ports of the fourth chamber.

As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. When the phrase "at least one of" is preceded by a list of elements, the entire list of elements is modified instead of the individual elements in the list.

Referring to Figures 1 through 7, which are schematic and block diagrams of a temperature-controlled wafer package system in accordance with the present invention. In the figure, the temperature measurement wafer packaging system includes a first chamber 10, a second chamber 20, a third chamber 30, a fourth chamber 40, a light emitting device 42, and a plurality of transport devices. The plurality of transport devices may include at least one robot arm, at least one conveyor belt, or a combination of the two for separately performing between the first chamber 10 and the second chamber 20, and between the second chamber 20 and the third chamber 30. Transportation between the third chamber 30 and the fourth chamber 40.

The first chamber 10 has a plurality of first inlets 101, a first outlet 102, and a welding device 103, and the substrate 70, the plurality of temperature measuring wafers 52, and the solder 512 are respectively from the plurality of first inlets 101. The substrate 70 is transported to the plurality of wafer regions 71 and the plurality of solder regions 72. The soldering device 103 can solder the plurality of temperature sensing wafers 52 through the solder 512 to the plurality of wafer regions 71, such as Figure 3 shows. The weld zone 72 can be formed from aluminum or other metals. The substrate 70 can be a whole piece of substrate, or a single or multiple wafer carrier.

The second chamber 20 has a plurality of second inlets 201, a second outlet 202, and a mounting device 22, and one of the plurality of second inlets 201 is in communication with the first outlet 102, and a plurality of The wafer cover 54, the plurality of sealing bodies 55, and the substrate 70 combined with the plurality of temperature measuring wafers 52 are transported from the plurality of second inlets 201 to the second chamber 20, respectively. The third to seventh figures only show the packaging flow of the single wafer cover 54 for the single temperature measurement chip 52. However, the present invention is not limited to the embodiment, and substantially, a plurality of wafers can be used on the substrate. The cover body 54 is respectively packaged corresponding to the positions of the plurality of temperature measurement wafers 52, and the plurality of wafer cover bodies 54 may be connected to each other or integrally formed, and then cut for individual package structures after being packaged.

The wafer cover 54 is provided with a recess 542, and the mounting device 22 aligns the wafer cover 54 on the substrate 70, that is, the soldering area 72, so that the temperature measuring wafer 52 is respectively located in the recess 542, such as Figure 4 and Figure 5 show. In addition, the substrate 70 is provided with a wire bonding area 73 around the wafer area 71 on which the wafer is disposed. The wire bonding area 73 is provided with at least a pin pad 521 embedded in the surface of the substrate 70, and the pin pad 521 is transmitted through the substrate. The metal wire 514 within the 70 is electrically connected to the temperature measuring wafer 52. It is worth mentioning that a plurality of slots for accommodating the temperature measuring wafer 52 and the sealing body 55 can be preset on the substrate 70, so that the temperature measuring wafer 52 and the sealing body 55 can be embedded in the surface of the substrate 70.

In addition, in a specific implementation, the second chamber 20 may further include a pre-pressing device 21, and the pre-pressing device 21 pre-presses the wafer cover 54 after the wafer cover 54 is placed on the substrate 70. -bonding). The wafer cover 54 is formed of an infrared permeable material such as germanium (Ge), germanium or bismuth glass.

In addition, in a specific implementation, the first chamber 10 or the second chamber 20 may further input a plurality of getters 80, which are respectively disposed on the surface of the substrate 70 in the first chamber 10; or in the second The chamber 20 is disposed on the surface of the recess 542. In the second embodiment, this embodiment is exemplified by the getter 80 being input to the second chamber 20, but is not limited thereto.

The third chamber 30 has a third inlet 301, a third outlet 302, and a laser device 31. The third inlet 301 communicates with the second outlet 202 and is covered with the wafer cover 54. The substrate 70 is transported from the third inlet 301 to the third chamber 30, and the laser device 31 emits a plurality of lands 72 of the substrate 710 by the laser 311 to melt the sealing body 55, thereby causing the plurality of wafer covers 54. The substrate 70 is combined to form a plurality of package structures 56.

In addition, in a specific implementation, the third chamber 30 further includes a heating device for heating the substrate 70 to further accelerate the outgassing of the substrate 70.

Since the degree of vacuum affects the sensitivity of the temperature measuring wafer 52, the second chamber 20 and the third chamber 30 respectively have a pump for discharging the air in the second chamber 20 and the third chamber 30, The second chamber 20 and the third chamber 30 are maintained in a vacuum state.

The fourth chamber 40 has a fourth inlet 401, at least a fourth outlet 402, a detection window 41, and a wafer detecting device 43. The fourth inlet 401 is in communication with the third outlet 302, and the plurality of packages Structure 56 is transported through fourth inlet port 401 to fourth chamber 40. The light-emitting device 42 is disposed outside the fourth chamber 40, and the light-emitting device 42 emits the detection light 421 and penetrates the detection window 41 into the fourth chamber 40. The wafer detecting device 43 can be electrically connected to the plurality of package structures 56 to receive the detection light 421 of the penetration detecting window 41 for detection to filter or classify the plurality of package structures 56.

The fourth chamber 40 further includes a cutting device for cutting a plurality of package structures 56, and a plurality of different package structures 56 are output from the plurality of discharge ports of the fourth chamber 40, respectively.

Please refer to FIG. 8 , which is a flow chart showing the steps of the temperature measurement chip packaging method of the present invention. In the figure, the temperature measurement chip packaging method is described with reference to the component symbols in FIGS. 1 to 7, and includes the following steps. In step S1, a first chamber 10 is provided, and a substrate 70 and a plurality of temperature measuring wafers 52 are transported to the first chamber 10. The substrate 70 is divided into a plurality of wafer regions 71 and a plurality of soldering regions 72, and A plurality of temperature measuring wafers 52 are respectively soldered to the plurality of wafer regions 71 in the first chamber 10.

In step S2, a second chamber 20 connected to the first chamber 10 is provided, and the plurality of wafer covers 54, the plurality of sealing bodies 55, and the substrate 70 combined with the plurality of temperature measuring wafers 52 are transported to the second a plurality of wafer covers 54 are respectively provided with recesses 542, and a plurality of sealing bodies 55 are respectively placed on the plurality of soldering regions 72 of the substrate 70 in the second chamber 20, and a plurality of the plurality of soldering regions 72 are respectively disposed on the plurality of soldering regions 72 of the substrate 70. The wafer cover bodies 54 are respectively disposed on the substrate 70 such that the plurality of temperature measurement wafers 52 are respectively located in the plurality of grooves 542.

In step S3, a third chamber 30 connected to the second chamber 20 is provided, and the substrate 70 covered with the plurality of wafer covers 54 is transported to the third chamber 30, and the substrate 70 is irradiated with a laser 311. A plurality of lands 72 are formed to melt the sealing body 55 such that a plurality of wafer covers 54 are bonded to the substrate 70 to form a plurality of package structures 56. In step S3, the substrate 70 may be further heated as needed.

In practice, after the plurality of wafer covers 54 are placed on the substrate 70 and before the laser 311 is used in step S3, a pre-bonding of the wafer cover 54 is further included. In addition, the second chamber 20 and the third chamber 30 respectively have a pump, and a plurality of pumps are used to discharge the air in the second chamber 20 and the third chamber 30, and the second chamber 20 and the third chamber The chamber 30 is maintained in a vacuum state.

In addition, in step S1 or step S2, a plurality of getters 80 are further provided, and the getter 80 is disposed on the surface of the substrate 70 or on the surface of the plurality of grooves 542, respectively.

In step S4, a fourth chamber 40 connected to the third chamber 30 and having a detection window 41 is provided, and the plurality of package structures 56 are transported to the fourth chamber 40, and the detection light is passed through the detection window 41. A plurality of package structures 56 are illuminated for detection to screen or classify a plurality of package structures 56.

Finally, in step S5, a plurality of package structures 56 are cut in the fourth chamber 40 and a plurality of package structures 56 of different levels are respectively output from the plurality of discharge ports of the fourth chamber 40.

When the above steps S1 to S4 are performed, between the first chamber 10 and the second chamber 20, between the second chamber 20 and the third chamber 30, and between the third chamber 30 and the fourth chamber 40 The transport is carried out using at least one robotic arm or at least one conveyor.

The specific embodiments of the present invention are intended to be illustrative only and not to limit the invention to the above embodiments, without departing from the spirit of the invention and the following claims. The scope of the invention and the various changes made are within the scope of the invention.

10‧‧‧ first chamber
101‧‧‧First inlet
102‧‧‧First discharge opening
103‧‧‧Welding device
20‧‧‧Second chamber
201‧‧‧Second inlet
202‧‧‧Second outlet
21‧‧‧Preloading device
22‧‧‧Installation device
30‧‧‧ third chamber
301‧‧‧ third inlet
302‧‧‧ Third discharge opening
31‧‧‧ Laser device
311‧‧‧Laser
40‧‧‧fourth chamber
401‧‧‧fourth inlet
402‧‧‧fourth discharge opening
41‧‧‧Detection window
42‧‧‧Lighting device
421‧‧‧Detection light
43‧‧‧ wafer inspection device
51‧‧‧ slot base
511‧‧‧Edge
512‧‧‧ solder
514‧‧‧Wire
52‧‧‧Wet Wafer
521‧‧‧foot pads
53‧‧‧ Cover
54‧‧‧ wafer cover
542‧‧‧ Groove
55‧‧‧ Sealing body
56‧‧‧Package structure
70‧‧‧Substrate
71‧‧‧ wafer area
72‧‧‧Weld area
73‧‧‧Line area
80‧‧‧ getter
S1~S5‧‧‧Steps

The above and other features and advantages of the present invention will become more apparent from the detailed description of the exemplary embodiments illustrated in the accompanying drawings in which: FIG. 1 is a schematic diagram of a temperature-controlled wafer packaging system in accordance with the present invention; 2 is a block diagram of a temperature measurement wafer package system in accordance with the present invention; FIGS. 3 through 7 are schematic views of operation in different chambers in accordance with the present invention; and FIG. 8 is a temperature according to the present invention. A flow chart of the steps of the chip packaging method.

S1~S5‧‧‧Steps

Claims (17)

A temperature measurement chip packaging method includes: (a) providing a first chamber for transporting a substrate and a plurality of temperature measurement wafers to the first chamber, the substrate being divided into a plurality of wafer regions and a plurality of a soldering zone, and soldering the plurality of temperature measuring wafers to the plurality of wafer areas in the first chamber; (b) providing a second chamber connected to the first chamber, and covering the plurality of wafer covers The body, the plurality of sealing bodies and the substrate combined with the plurality of temperature measuring wafers are transported to the second chamber, the plurality of wafer covers are individually provided with grooves, and the plurality of wafer covers are aligned Providing a plurality of soldering regions on the substrate such that the plurality of temperature measuring wafers are respectively located in individual recesses of the plurality of wafer covers; (c) providing a third chamber connected to the second chamber Transporting the substrate overlying the plurality of wafer covers to the third chamber, and irradiating the plurality of solder pads of the substrate with a laser to melt the sealing body, thereby causing the plurality of wafer covers Combining with the substrate to form a plurality of package structures; and (d) a fourth chamber connected to the third chamber and having a detection window, transporting the plurality of package structures to the fourth chamber, and illuminating the plurality of package structures with a detection light through the detection window Photoelectric detection is performed to screen or classify the plurality of package structures. The temperature measurement chip packaging method according to claim 1, wherein after the plurality of wafer covers are placed on the substrate in the step (b) and before the laser is used in the step (c), Further comprising pre-bonding the plurality of wafer covers respectively. The temperature measurement chip packaging method of claim 1, wherein between the first chamber and the second chamber, between the second chamber and the third chamber, the third chamber At least one robot arm or at least one conveyor belt is disposed between the chamber and the fourth chamber for transportation. The temperature measurement chip packaging method of claim 1, wherein the second chamber and the third chamber respectively have a pump, the plurality of pumps for discharging the second chamber and the first The air in the three chambers maintains the second chamber and the third chamber in a vacuum state. The temperature-measuring chip packaging method of claim 1, further comprising: cutting the plurality of package structures in the fourth chamber; and separately separating the plurality of package structures of different levels from the fourth chamber The plurality of outlets are output. A temperature measurement chip packaging system includes: a first chamber having a plurality of first feed ports, a first discharge port, and a soldering device, a substrate, a plurality of temperature measuring wafers, and a solder system respectively The plurality of first inlets are transported to the first chamber, and the substrate is divided into a plurality of wafer regions and a plurality of soldering regions, and the soldering device respectively solders the plurality of temperature measuring wafers to the plurality of soldering wafers a second chamber having a plurality of second inlets, a second outlet, and a mounting device, one of the plurality of second inlets being in communication with the first outlet And the plurality of wafer covers, the plurality of sealing bodies, and the substrate system combined with the plurality of temperature measuring wafers are respectively transported from the plurality of second inlets to the second chamber, the plurality of wafer covers The plurality of sealing bodies are respectively disposed on the plurality of soldering regions of the substrate, and the plurality of wafer covers are aligned on the substrate, so that the plurality of temperature measuring wafers are respectively Located in the plurality of grooves and the complex a wafer cover system is disposed on the plurality of sealing bodies; a third chamber having a third inlet port, a third discharge port, and a laser device, the third inlet port and the third The two discharge ports communicate, the substrate that has covered the plurality of wafer covers is transported from the third inlet to the third chamber, and the laser device emits a plurality of lasers to illuminate the substrate a soldering area to melt the sealing body, so that the plurality of wafer covers are combined with the substrate to form a plurality of package structures; a light emitting device is disposed outside the fourth chamber, and the light emitting device emits a detection a fourth chamber having a fourth inlet, at least a fourth outlet, a detection window, and a wafer detecting device, the fourth inlet port being in communication with the third discharge port, the plurality The package structure is transported to the fourth chamber through the fourth inlet, the wafer detecting device is electrically connected to the plurality of package structures to receive the detection light penetrating the detection window for photoelectric detection to filter or Classifying the plurality of package structures; and a plurality of transport devices Between the first chamber to the second chamber, respectively, between the second chamber and the third chamber, the transport between the third chamber and the fourth chamber. The temperature measurement chip packaging system of claim 6, wherein the second chamber further comprises a pre-pressing device, the pre-pressing device is opposite to the crystal after the plurality of wafer covers are placed on the substrate The dome is pre-bonded. The temperature-measuring wafer package system of claim 6, wherein the plurality of transport devices comprise at least one robotic arm, at least one conveyor belt, or a combination of the two. The temperature measurement chip packaging system of claim 6, wherein the second chamber and the third chamber respectively have a pump, the plurality of pumps for discharging the second chamber and the first The air in the three chambers maintains the second chamber and the third chamber in a vacuum state. The temperature measurement chip packaging system of claim 6, wherein the fourth chamber further comprises a cutting device for separating the plurality of package structures, and the plurality of package structures of different grades are respectively from the first A plurality of discharge ports of the four chambers are output. A temperature measurement chip packaging method comprises: (a) providing a first chamber, transporting a slot type base to the first chamber by a temperature measuring wafer, and measuring the temperature in the first chamber Soldering the wafer to the trough-type base; (b) providing a second chamber connected to the first chamber, transporting a cover, a sealing body, and the trough-type base incorporating the temperature measuring wafer To the second chamber, and placing the sealing body on the edge portion of the grooved base in the second chamber, and placing the cover on the grooved base; (c) providing a third chamber connected to the second chamber, transporting the slot base covering the cover to the third chamber, and irradiating the edge portion of the slot base with a laser to melt the a sealing body that causes the cover to combine with the edge portion to form a package structure; and (d) a fourth chamber connected to the third chamber and having a detection window, the package structure being transported to the first A four-chamber chamber is irradiated with the detection light through the test window to perform photodetection to screen or classify the package structure. The temperature measurement chip packaging method according to claim 11, wherein before the cover body is placed on the grooved base in the step (b), the method further comprises: detecting the temperature measurement chip, when the temperature is measured The cover is placed on the slot base after the wafer is tested. The temperature-measuring wafer packaging method of claim 11, wherein after the cover is placed on the grooved base in the step (b) and before the laser is used in the step (c), Moreover, a pre-bonding of the cover is included. The temperature-measuring chip packaging method of claim 11, wherein the optical alignment process is performed when the cover is placed on the grooved base in the step (b). The temperature measurement chip packaging method of claim 11, wherein the second chamber and the third chamber respectively have a pump, the plurality of pumps for discharging the second chamber and the first The air in the three chambers maintains the second chamber and the third chamber in a vacuum state. The temperature measurement chip packaging method of claim 11, wherein the number of the grooved bases is plural and is disposed on a base, and the temperature measurement wafers are respectively disposed in the plurality of grooved bases. The number of the covers is plural and has sufficient area to cover the base and respectively correspond to the positions of the plurality of temperature measuring wafers. The temperature measurement chip packaging method of claim 16, further comprising outputting the plurality of package structures of different levels from the plurality of discharge ports of the fourth chamber.