SG114577A1 - Spool case for bonding wire, and method of handling spool using same - Google Patents

Spool case for bonding wire, and method of handling spool using same

Info

Publication number
SG114577A1
SG114577A1 SG200206123A SG200206123A SG114577A1 SG 114577 A1 SG114577 A1 SG 114577A1 SG 200206123 A SG200206123 A SG 200206123A SG 200206123 A SG200206123 A SG 200206123A SG 114577 A1 SG114577 A1 SG 114577A1
Authority
SG
Singapore
Prior art keywords
spool
same
bonding wire
handling
case
Prior art date
Application number
SG200206123A
Other languages
English (en)
Inventor
Man You Chang
Woo Back Jung
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of SG114577A1 publication Critical patent/SG114577A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/02—Containers, packaging elements or packages, specially adapted for particular articles or materials for annular articles
    • B65D85/04—Containers, packaging elements or packages, specially adapted for particular articles or materials for annular articles for coils of wire, rope or hose
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00—Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/38—Skips, cages, racks, or containers, adapted solely for the transport or storage of bobbins, cops, or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2407/00—Means not provided for in groups B65H2220/00 – B65H2406/00 specially adapted for particular purposes
    • B65H2407/50—Means for protecting parts of handling machine
    • B65H2407/51—Means for making dustproof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/36—Wires
    • B65H2701/361—Semiconductor bonding wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78601—Storing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Storing, Repeated Paying-Out, And Re-Storing Of Elongated Articles (AREA)
SG200206123A 2001-10-31 2002-10-10 Spool case for bonding wire, and method of handling spool using same SG114577A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0067575A KR100398832B1 (ko) 2001-10-31 2001-10-31 본딩 와이어용 스풀 케이스 및 이 케이스를 사용한 스풀취급 방법

Publications (1)

Publication Number Publication Date
SG114577A1 true SG114577A1 (en) 2005-09-28

Family

ID=19715566

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200206123A SG114577A1 (en) 2001-10-31 2002-10-10 Spool case for bonding wire, and method of handling spool using same

Country Status (7)

Country Link
US (1) US6866148B2 (fr)
EP (1) EP1308403A1 (fr)
JP (1) JP2003205989A (fr)
KR (1) KR100398832B1 (fr)
CN (1) CN1178834C (fr)
SG (1) SG114577A1 (fr)
TW (1) TWI222116B (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60239028D1 (de) † 2001-03-15 2011-03-10 Mitsubishi Rayon Co Acrylharzfilm, Verfahren zur dessen Herstellung und laminierter Film der diesen enthält
KR100422986B1 (ko) * 2002-04-22 2004-03-12 엠케이전자 주식회사 본딩와이어 스풀용 자석 부착식 케이스
US7275708B2 (en) * 2004-06-30 2007-10-02 Richard Paul Lewis Dispenser for rolled sheet material
KR101046887B1 (ko) * 2004-12-10 2011-07-07 성현국 와이어 권취 보빈용 컨테이너
US7320445B2 (en) * 2005-04-15 2008-01-22 E5 Products, Inc. Electrician's caddy
US7204452B2 (en) * 2005-06-07 2007-04-17 Sonoco Development, Inc. Dispenser for elongate material
US8016222B2 (en) * 2008-04-16 2011-09-13 Windy City Wire Cable And Technology Products, Llc Wire and cable dispensing container and systems
US8136753B2 (en) * 2009-08-25 2012-03-20 Windy City Wire Cable And Technology Products, Llc Transporter for box of spooled wire or cable
US20120091249A1 (en) 2010-10-19 2012-04-19 John Mezzalingua Associates, Inc. Cable carrying case
US8876033B2 (en) 2011-05-27 2014-11-04 Windy City Wire Cable And Technology Products, Llc Transporter for containers of spooled wire or cable
US8819604B2 (en) 2013-01-20 2014-08-26 International Business Machines Corporation Real-time display of electronic device design changes between schematic and/or physical representation and simplified physical representation of design
WO2019008803A1 (fr) * 2017-07-04 2019-01-10 田中電子工業株式会社 Bobine d'enroulement, structure enroulée de fil de liaison et boîtier de bobine pour bobine d'enroulement
EP3651187A4 (fr) * 2017-07-04 2022-03-02 Tanaka Denshi Kogyo K.K. Bobine d'enroulement de fil de connexion, structure d'enroulement et boîtier de bobine
JP2022037255A (ja) * 2018-12-27 2022-03-09 田中電子工業株式会社 ワイヤ封止体
JP7388696B2 (ja) * 2019-11-19 2023-11-29 三甲株式会社 ロール保管容器
CN115007412A (zh) * 2022-06-20 2022-09-06 常州市武进华菱电工机械有限公司 一种快换式漆包线涂漆托线轮支架

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164252A (en) * 1961-10-25 1965-01-05 Essex Wire Corp Spool package
JPH0786326A (ja) * 1993-09-10 1995-03-31 Sumitomo Metal Mining Co Ltd 半導体ボンディングワイヤー用スプールケース
JPH07161754A (ja) * 1993-12-06 1995-06-23 Mitsubishi Materials Corp 半導体ボンディングワイヤーのスプール収納ケース
EP0826618A1 (fr) * 1996-09-03 1998-03-04 SAT (Société Anonyme de Télécommunications) Dispositif de conditionnement de câbles
JPH10326804A (ja) * 1997-05-26 1998-12-08 Mitsubishi Materials Corp 半導体装置用ボンディングワイヤーのスプールケース
EP0896363A2 (fr) * 1997-08-08 1999-02-10 Tanaka Denshi Kogyo Kabushiki Kaisha Boitier pour bobine de fil de connexion
EP1118571A2 (fr) * 2000-01-21 2001-07-25 Messi E Paoloni- S.R.L. Bobine pour fil électrique et sa boíte

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5841188Y2 (ja) 1977-12-29 1983-09-17 田中電子工業株式会社 半導体用ボンデイングワイヤ−のスプ−ルケ−ス
JPS5826432B2 (ja) 1978-02-01 1983-06-02 マツダ株式会社 高温ハロゲン雰囲気に対する耐食性部材の製造法
JPS61219040A (ja) * 1985-03-25 1986-09-29 Fuji Photo Film Co Ltd 写真感光材料収納マガジン
JP2000012599A (ja) 1998-06-25 2000-01-14 Tanaka Electronics Ind Co Ltd ボンディングワイヤ用スプールケース並びにそのスプールケースを用いたスプール取り扱い方法
JP2826307B1 (ja) * 1997-08-08 1998-11-18 田中電子工業株式会社 ボンディングワイヤ用スプールケース
JP2000049187A (ja) * 1998-07-31 2000-02-18 Tanaka Denshi Kogyo Kk ボンディングワイヤ用スプールケース及びそれを用いたスプール取り扱い方法
JP3795238B2 (ja) 1998-10-01 2006-07-12 シャープ株式会社 文書画像処理装置及び文書画像処理方法
JP2000294596A (ja) * 1999-04-02 2000-10-20 Tanaka Electronics Ind Co Ltd ボンディングワイヤ用スプールケース
JP2001171769A (ja) * 1999-12-16 2001-06-26 Tanaka Electronics Ind Co Ltd ボンディングワイヤ用スプールケースの梱包部材及びそれを用いた梱包構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164252A (en) * 1961-10-25 1965-01-05 Essex Wire Corp Spool package
JPH0786326A (ja) * 1993-09-10 1995-03-31 Sumitomo Metal Mining Co Ltd 半導体ボンディングワイヤー用スプールケース
JPH07161754A (ja) * 1993-12-06 1995-06-23 Mitsubishi Materials Corp 半導体ボンディングワイヤーのスプール収納ケース
EP0826618A1 (fr) * 1996-09-03 1998-03-04 SAT (Société Anonyme de Télécommunications) Dispositif de conditionnement de câbles
JPH10326804A (ja) * 1997-05-26 1998-12-08 Mitsubishi Materials Corp 半導体装置用ボンディングワイヤーのスプールケース
EP0896363A2 (fr) * 1997-08-08 1999-02-10 Tanaka Denshi Kogyo Kabushiki Kaisha Boitier pour bobine de fil de connexion
EP1118571A2 (fr) * 2000-01-21 2001-07-25 Messi E Paoloni- S.R.L. Bobine pour fil électrique et sa boíte

Also Published As

Publication number Publication date
CN1417098A (zh) 2003-05-14
JP2003205989A (ja) 2003-07-22
CN1178834C (zh) 2004-12-08
KR20030035477A (ko) 2003-05-09
EP1308403A1 (fr) 2003-05-07
KR100398832B1 (ko) 2003-09-19
TWI222116B (en) 2004-10-11
US20030080011A1 (en) 2003-05-01
US6866148B2 (en) 2005-03-15

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