SG11202112708YA - Seamless electrical conduit - Google Patents

Seamless electrical conduit

Info

Publication number
SG11202112708YA
SG11202112708YA SG11202112708YA SG11202112708YA SG11202112708YA SG 11202112708Y A SG11202112708Y A SG 11202112708YA SG 11202112708Y A SG11202112708Y A SG 11202112708YA SG 11202112708Y A SG11202112708Y A SG 11202112708YA SG 11202112708Y A SG11202112708Y A SG 11202112708YA
Authority
SG
Singapore
Prior art keywords
electrical conduit
coupled
conductor
chamber
outer conductor
Prior art date
Application number
SG11202112708YA
Other languages
English (en)
Inventor
Philip Allan Kraus
Anantha K Subramani
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11202112708YA publication Critical patent/SG11202112708YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0208—Cables with several layers of insulating material
    • H01B7/0216—Two layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H01B7/1875—Multi-layer sheaths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/42—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
    • H01B7/421—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction for heat dissipation
    • H01B7/423—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction for heat dissipation using a cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/04—Protective tubing or conduits, e.g. cable ladders or cable troughs
    • H02G3/0406—Details thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Architecture (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202112708YA 2019-06-07 2020-06-02 Seamless electrical conduit SG11202112708YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962858738P 2019-06-07 2019-06-07
PCT/US2020/035709 WO2020247375A1 (en) 2019-06-07 2020-06-02 Seamless electrical conduit

Publications (1)

Publication Number Publication Date
SG11202112708YA true SG11202112708YA (en) 2021-12-30

Family

ID=73651710

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202112708YA SG11202112708YA (en) 2019-06-07 2020-06-02 Seamless electrical conduit

Country Status (7)

Country Link
US (1) US11368003B2 (https=)
JP (1) JP7696840B2 (https=)
KR (1) KR102810211B1 (https=)
CN (1) CN113994451B (https=)
SG (1) SG11202112708YA (https=)
TW (1) TWI870413B (https=)
WO (1) WO2020247375A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220049350A1 (en) * 2020-08-13 2022-02-17 Applied Materials, Inc. Apparatus design for photoresist deposition
US20240071729A1 (en) * 2022-08-26 2024-02-29 Applied Materials, Inc. Gas cooled high power connection rod

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762025A (en) * 1953-02-11 1956-09-04 Erich P Tilenius Shielded cable connectors
US3336563A (en) * 1964-04-13 1967-08-15 Amphenol Corp Coaxial connectors
US3871735A (en) * 1973-08-23 1975-03-18 Amp Inc Shielded high voltage connector
US3982059A (en) * 1974-12-26 1976-09-21 The Machlett Laboratories, Incorporated Flexible cable termination
US4046451A (en) * 1976-07-08 1977-09-06 Andrew Corporation Connector for coaxial cable with annularly corrugated outer conductor
US4479702A (en) * 1982-07-06 1984-10-30 Olin Corporation Method and apparatus for assembling a compact multi-conductor optical fiber communication cable
US4426127A (en) * 1981-11-23 1984-01-17 Omni Spectra, Inc. Coaxial connector assembly
US4485266A (en) * 1982-07-29 1984-11-27 The United States Of America As Represented By The United States Department Of Energy Termination for a superconducting power transmission line including a horizontal cryogenic bushing
US4603023A (en) * 1983-12-01 1986-07-29 International Business Machines Corporation Method of making a hybrid dielectric probe interposer
US4896939A (en) * 1987-10-30 1990-01-30 D. G. O'brien, Inc. Hybrid fiber optic/electrical cable and connector
US5574815A (en) * 1991-01-28 1996-11-12 Kneeland; Foster C. Combination cable capable of simultaneous transmission of electrical signals in the radio and microwave frequency range and optical communication signals
US5167533A (en) * 1992-01-08 1992-12-01 Andrew Corporation Connector for coaxial cable having hollow inner conductors
US5302780A (en) * 1992-06-29 1994-04-12 Hughes Aircraft Company Split coaxial cable conductor and method of fabrication
KR19980071012A (ko) * 1997-01-24 1998-10-26 조셉 제이. 스위니 고온 및 고 증착율의 티타늄 막을 증착하기 위한 방법 및 장치
US6231357B1 (en) * 1998-01-20 2001-05-15 Relight America, Inc. Waterproof high voltage connector
US6863835B1 (en) 2000-04-25 2005-03-08 James D. Carducci Magnetic barrier for plasma in chamber exhaust
US6581275B2 (en) * 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
US6830939B2 (en) 2002-08-28 2004-12-14 Verity Instruments, Inc. System and method for determining endpoint in etch processes using partial least squares discriminant analysis in the time domain of optical emission spectra
JP3962661B2 (ja) * 2002-08-30 2007-08-22 三菱重工業株式会社 静電チャック支持機構及び支持台装置及びプラズマ処理装置
US7134189B2 (en) * 2002-09-12 2006-11-14 Andrew Corporation Coaxial cable connector and tool and method for connecting a coaxial cable
US6926555B2 (en) * 2003-10-09 2005-08-09 Radio Frequency Systems, Inc. Tuned radio frequency coaxial connector
JP2005347620A (ja) 2004-06-04 2005-12-15 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理装置の載置台ユニット
US7556718B2 (en) 2004-06-22 2009-07-07 Tokyo Electron Limited Highly ionized PVD with moving magnetic field envelope for uniform coverage of feature structure and wafer
US7217155B2 (en) * 2004-07-16 2007-05-15 John Mezzalinaqua Associates, Inc. Compression connector for braided coaxial cable
US20060254801A1 (en) * 2005-05-27 2006-11-16 Stevens Randall D Shielded electrical transmission cables and methods for forming the same
US9520276B2 (en) * 2005-06-22 2016-12-13 Tokyo Electron Limited Electrode assembly and plasma processing apparatus
EP1953877A1 (de) * 2007-01-31 2008-08-06 Applied Materials, Inc. Spannungszuführung zu wenigstens einem elektrischen Verbraucher
CN101663421A (zh) * 2007-04-27 2010-03-03 应用材料股份有限公司 环形挡板
KR100941070B1 (ko) 2007-05-10 2010-02-09 세메스 주식회사 플라즈마를 이용하여 기판을 처리하는 장치
US7448906B1 (en) 2007-08-22 2008-11-11 Andrew Llc Hollow inner conductor contact for coaxial cable connector
JP5222598B2 (ja) 2008-03-25 2013-06-26 東京エレクトロン株式会社 プラズマ処理装置及び給電棒
DE102010027619B3 (de) * 2010-07-20 2011-11-17 Roth & Rau Ag Mikrowellenplasmaquelle mit einer Vorrichtung zur Zuführung von Mikrowellenenergie
US9123762B2 (en) 2010-10-22 2015-09-01 Applied Materials, Inc. Substrate support with symmetrical feed structure
US9088074B2 (en) * 2011-07-14 2015-07-21 Nuvotronics, Llc Hollow core coaxial cables and methods of making the same
JP5969840B2 (ja) * 2012-06-29 2016-08-17 オリンパス株式会社 光電気複合コネクタ
US20150083042A1 (en) * 2013-09-26 2015-03-26 Applied Materials, Inc. Rotatable substrate support having radio frequency applicator
JP6424049B2 (ja) 2014-09-12 2018-11-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6478748B2 (ja) * 2015-03-24 2019-03-06 東京エレクトロン株式会社 マイクロ波プラズマ源およびプラズマ処理装置
US10049862B2 (en) * 2015-04-17 2018-08-14 Lam Research Corporation Chamber with vertical support stem for symmetric conductance and RF delivery
US20170040140A1 (en) 2015-08-06 2017-02-09 Seagate Technology Llc Magnet array for plasma-enhanced chemical vapor deposition
US9805963B2 (en) * 2015-10-05 2017-10-31 Lam Research Corporation Electrostatic chuck with thermal choke
JP6697346B2 (ja) * 2016-07-20 2020-05-20 株式会社ディスコ 吸着確認方法、離脱確認方法、及び減圧処理装置
US10163609B2 (en) * 2016-12-15 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Plasma generation for ion implanter
JP6394721B2 (ja) * 2017-03-03 2018-09-26 日立金属株式会社 同軸ケーブル
CN107093545B (zh) * 2017-06-19 2019-05-31 北京北方华创微电子装备有限公司 反应腔室的下电极机构及反应腔室

Also Published As

Publication number Publication date
TWI870413B (zh) 2025-01-21
US11368003B2 (en) 2022-06-21
JP2022534804A (ja) 2022-08-03
JP7696840B2 (ja) 2025-06-23
TW202113909A (zh) 2021-04-01
WO2020247375A1 (en) 2020-12-10
CN113994451B (zh) 2025-09-12
KR20220027091A (ko) 2022-03-07
US20200388998A1 (en) 2020-12-10
KR102810211B1 (ko) 2025-05-19
CN113994451A (zh) 2022-01-28

Similar Documents

Publication Publication Date Title
US11560626B2 (en) Substrate processing chamber
US8629370B2 (en) Assembly for delivering RF power and DC voltage to a plasma processing chamber
US20140130926A1 (en) Annular baffle
JP7412257B2 (ja) エッチング方法、基板処理装置、及び基板処理システム
US11368003B2 (en) Seamless electrical conduit
CN115280484A (zh) 用于射频环境的冷却的基板支撑组件
JP2023118883A (ja) プラズマ処理装置
EP1610369A1 (en) Plasma film-forming method and plasma film-forming apparatus
JP5082411B2 (ja) 成膜方法
US20240420924A1 (en) Semiconductor manufacturing process chamber cooling flange for remote plasma source supply
US11270905B2 (en) Modulating film properties by optimizing plasma coupling materials
JPH06243994A (ja) プラズマ処理装置
US12431339B2 (en) Adjustable de-chucking voltage
US20230377855A1 (en) Lower deposition chamber ccp electrode cleaning solution
TWI918742B (zh) 處理基板之方法
US20240371613A1 (en) High-throughput plasma lid for semiconductor manufacturing processing chambers
TW202429765A (zh) 用於基板支撐組件的電連接器
CN121843435A (zh) 半导体结构的制备方法及沉积设备