SG11202112079RA - Ni-BASED SPUTTERING TARGET AND MAGNETIC RECORDING MEDIUM - Google Patents
Ni-BASED SPUTTERING TARGET AND MAGNETIC RECORDING MEDIUMInfo
- Publication number
- SG11202112079RA SG11202112079RA SG11202112079RA SG11202112079RA SG11202112079RA SG 11202112079R A SG11202112079R A SG 11202112079RA SG 11202112079R A SG11202112079R A SG 11202112079RA SG 11202112079R A SG11202112079R A SG 11202112079RA SG 11202112079R A SG11202112079R A SG 11202112079RA
- Authority
- SG
- Singapore
- Prior art keywords
- recording medium
- magnetic recording
- sputtering target
- based sputtering
- target
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019087667A JP7385370B2 (en) | 2019-05-07 | 2019-05-07 | Ni-based sputtering target and magnetic recording medium |
PCT/JP2020/018399 WO2020226130A1 (en) | 2019-05-07 | 2020-05-01 | Ni-BASED SPUTTERING TARGET AND MAGNETIC RECORDING MEDIUM |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202112079RA true SG11202112079RA (en) | 2021-11-29 |
Family
ID=73044284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202112079RA SG11202112079RA (en) | 2019-05-07 | 2020-05-01 | Ni-BASED SPUTTERING TARGET AND MAGNETIC RECORDING MEDIUM |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7385370B2 (en) |
CN (1) | CN113825856B (en) |
SG (1) | SG11202112079RA (en) |
TW (1) | TW202108798A (en) |
WO (1) | WO2020226130A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021054136A1 (en) * | 2019-09-19 | 2021-03-25 | ||
TWI769081B (en) * | 2021-09-17 | 2022-06-21 | 光洋應用材料科技股份有限公司 | Cr-ni-ti alloy target and method of preparing the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080131735A1 (en) * | 2006-12-05 | 2008-06-05 | Heraeus Incorporated | Ni-X, Ni-Y, and Ni-X-Y alloys with or without oxides as sputter targets for perpendicular magnetic recording |
JP5370917B2 (en) * | 2009-04-20 | 2013-12-18 | 日立金属株式会社 | Method for producing Fe-Co-Ni alloy sputtering target material |
JP5656104B2 (en) | 2009-07-01 | 2015-01-21 | 日立金属株式会社 | Fe-Co-Ni alloy sputtering target material |
JP5958822B2 (en) * | 2011-12-22 | 2016-08-02 | 日立金属株式会社 | Method for producing Mo alloy sputtering target material and Mo alloy sputtering target material |
JP5812217B1 (en) * | 2014-04-17 | 2015-11-11 | 三菱マテリアル株式会社 | Sputtering target and manufacturing method of sputtering target |
JP6581780B2 (en) * | 2015-02-09 | 2019-09-25 | 山陽特殊製鋼株式会社 | Ni-based target material with excellent sputtering properties |
JP6681019B2 (en) | 2015-02-25 | 2020-04-15 | 日立金属株式会社 | Sputtering target material for forming laminated wiring film and coating layer for electronic parts |
WO2016143858A1 (en) | 2015-03-12 | 2016-09-15 | 山陽特殊製鋼株式会社 | Ni-BASED SPUTTERING TARGET MATERIAL AND MAGNETIC RECORDING MEDIUM |
JP6431496B2 (en) * | 2016-04-13 | 2018-11-28 | 山陽特殊製鋼株式会社 | Alloy for seed layer of magnetic recording medium, sputtering target material, and magnetic recording medium |
TWI636149B (en) * | 2016-09-12 | 2018-09-21 | 日商Jx金屬股份有限公司 | Ferromagnetic sputtering target |
-
2019
- 2019-05-07 JP JP2019087667A patent/JP7385370B2/en active Active
-
2020
- 2020-05-01 SG SG11202112079RA patent/SG11202112079RA/en unknown
- 2020-05-01 WO PCT/JP2020/018399 patent/WO2020226130A1/en active Application Filing
- 2020-05-01 CN CN202080033599.2A patent/CN113825856B/en active Active
- 2020-05-06 TW TW109114981A patent/TW202108798A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN113825856A (en) | 2021-12-21 |
TW202108798A (en) | 2021-03-01 |
CN113825856B (en) | 2024-04-02 |
JP2020183557A (en) | 2020-11-12 |
WO2020226130A1 (en) | 2020-11-12 |
JP7385370B2 (en) | 2023-11-22 |
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