SG11202111977XA - Method for inspecting semiconductor and semiconductor inspecting device - Google Patents

Method for inspecting semiconductor and semiconductor inspecting device

Info

Publication number
SG11202111977XA
SG11202111977XA SG11202111977XA SG11202111977XA SG11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA SG 11202111977X A SG11202111977X A SG 11202111977XA
Authority
SG
Singapore
Prior art keywords
semiconductor
inspecting
inspecting device
inspecting semiconductor
semiconductor inspecting
Prior art date
Application number
SG11202111977XA
Other languages
English (en)
Inventor
Tomochika Takeshima
Takafumi Higuchi
Kazuhiro Hotta
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of SG11202111977XA publication Critical patent/SG11202111977XA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
    • G06T3/4053—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Biophysics (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG11202111977XA 2019-06-03 2020-04-16 Method for inspecting semiconductor and semiconductor inspecting device SG11202111977XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019103831 2019-06-03
PCT/JP2020/016753 WO2020246150A1 (ja) 2019-06-03 2020-04-16 半導体検査方法及び半導体検査装置

Publications (1)

Publication Number Publication Date
SG11202111977XA true SG11202111977XA (en) 2021-11-29

Family

ID=73652093

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202111977XA SG11202111977XA (en) 2019-06-03 2020-04-16 Method for inspecting semiconductor and semiconductor inspecting device

Country Status (8)

Country Link
US (1) US20220301135A1 (ko)
EP (1) EP3958210A4 (ko)
JP (1) JP7413376B2 (ko)
KR (1) KR20220016030A (ko)
CN (1) CN113966524A (ko)
SG (1) SG11202111977XA (ko)
TW (1) TW202101292A (ko)
WO (1) WO2020246150A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220067525A1 (en) * 2020-08-25 2022-03-03 Nvidia Corporation Techniques for pruning neural networks
JP2022135215A (ja) * 2021-03-05 2022-09-15 株式会社日立ハイテク 学習器の学習方法、及び画像生成システム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002097535A2 (en) * 2001-05-30 2002-12-05 Nptest, Inc. Sub-resolution alignment of images
JP2009162718A (ja) 2008-01-10 2009-07-23 Olympus Corp 基板検査装置および検査領域設定方法
JP2015098342A (ja) 2013-11-19 2015-05-28 株式会社エンプラス 密閉容器および密閉容器セット
SG11201602201XA (en) 2013-12-26 2016-04-28 Hamamatsu Photonics Kk Image processing method, image processing system, image processing program, and storage medium storing image processing program
US9965901B2 (en) 2015-11-19 2018-05-08 KLA—Tencor Corp. Generating simulated images from design information
TWI797699B (zh) * 2015-12-22 2023-04-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US10648924B2 (en) * 2016-01-04 2020-05-12 Kla-Tencor Corp. Generating high resolution images from low resolution images for semiconductor applications
US10395356B2 (en) 2016-05-25 2019-08-27 Kla-Tencor Corp. Generating simulated images from input images for semiconductor applications
US10282510B2 (en) 2017-04-07 2019-05-07 Fei Company Alignment of CAD data to images in high resolution optical fault analysis
US10733744B2 (en) * 2017-05-11 2020-08-04 Kla-Tencor Corp. Learning based approach for aligning images acquired with different modalities
JP6957197B2 (ja) * 2017-05-17 2021-11-02 キヤノン株式会社 画像処理装置および画像処理方法
JP7002949B2 (ja) * 2018-01-22 2022-01-20 株式会社日立ハイテク 画像評価方法及び画像評価装置

Also Published As

Publication number Publication date
US20220301135A1 (en) 2022-09-22
EP3958210A4 (en) 2023-05-03
KR20220016030A (ko) 2022-02-08
JP7413376B2 (ja) 2024-01-15
CN113966524A (zh) 2022-01-21
TW202101292A (zh) 2021-01-01
JPWO2020246150A1 (ko) 2020-12-10
EP3958210A1 (en) 2022-02-23
WO2020246150A1 (ja) 2020-12-10

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