SG11202111144YA - Bonding apparatus - Google Patents
Bonding apparatusInfo
- Publication number
- SG11202111144YA SG11202111144YA SG11202111144YA SG11202111144YA SG11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA SG 11202111144Y A SG11202111144Y A SG 11202111144YA
- Authority
- SG
- Singapore
- Prior art keywords
- bonding apparatus
- bonding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
- H05K13/0434—Feeding one by one by other means than belts with containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019075412 | 2019-04-11 | ||
PCT/JP2020/015746 WO2020209269A1 (ja) | 2019-04-11 | 2020-04-07 | ボンディング装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202111144YA true SG11202111144YA (en) | 2021-11-29 |
Family
ID=72751115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202111144YA SG11202111144YA (en) | 2019-04-11 | 2020-04-07 | Bonding apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US11749541B2 (zh) |
JP (1) | JP7205941B2 (zh) |
KR (1) | KR20210144881A (zh) |
CN (1) | CN113661564B (zh) |
SG (1) | SG11202111144YA (zh) |
TW (1) | TWI734434B (zh) |
WO (1) | WO2020209269A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI734434B (zh) * | 2019-04-11 | 2021-07-21 | 日商新川股份有限公司 | 接合裝置 |
WO2024023926A1 (ja) * | 2022-07-26 | 2024-02-01 | ヤマハ発動機株式会社 | 表面実装機及び表面実装方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3054480B2 (ja) * | 1991-12-20 | 2000-06-19 | 株式会社日立製作所 | ペレットボンディング装置 |
US5608638A (en) * | 1995-02-06 | 1997-03-04 | Advanced Micro Devices | Device and method for automation of a build sheet to manufacture a packaged integrated circuit |
CH693229A5 (de) * | 1997-04-30 | 2003-04-30 | Esec Tradingsa | Einrichtung und Verfahren zur Montage vonHalbleiterchips auf einem Substrat. |
KR100252317B1 (ko) * | 1997-10-30 | 2000-04-15 | 윤종용 | 리드 프레임의 다이 본딩장치 |
US7353589B2 (en) * | 2003-10-15 | 2008-04-08 | Matsushita Electric Industrial Co., Ltd. | Component mounting apparatus |
JP4397349B2 (ja) * | 2005-05-20 | 2010-01-13 | 株式会社新川 | チップボンディング装置 |
JP2011035178A (ja) | 2009-08-03 | 2011-02-17 | Hitachi High-Technologies Corp | 電子部品実装装置 |
JP2012019189A (ja) | 2010-06-11 | 2012-01-26 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
JP6055239B2 (ja) * | 2012-08-29 | 2016-12-27 | ファスフォードテクノロジ株式会社 | ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法 |
US9961817B2 (en) | 2012-09-28 | 2018-05-01 | Fuji Machine Mfg. Co., Ltd. | Substrate working machine |
JP5507775B1 (ja) * | 2013-11-25 | 2014-05-28 | キヤノンマシナリー株式会社 | ボンディング装置およびボンディング方法 |
JP6343199B2 (ja) | 2014-07-28 | 2018-06-13 | 株式会社Fuji | 通信システム、実装機及び通信データ処理方法 |
US10199254B2 (en) * | 2015-05-12 | 2019-02-05 | Nexperia B.V. | Method and system for transferring semiconductor devices from a wafer to a carrier structure |
JP6622306B2 (ja) | 2015-06-26 | 2019-12-18 | 株式会社Fuji | 部品実装機 |
JP6488940B2 (ja) * | 2015-08-07 | 2019-03-27 | 富士電機株式会社 | 半導体装置 |
TWI632626B (zh) * | 2016-01-06 | 2018-08-11 | 日商新川股份有限公司 | Electronic parts processing unit |
US10910248B2 (en) | 2016-01-06 | 2021-02-02 | Shinkawa Ltd. | Electronic component mounting apparatus |
GB2549250B (en) * | 2016-02-15 | 2021-06-30 | Pragmatic Printing Ltd | Apparatus and method for manufacturing plurality of electronic circuits |
JP6705668B2 (ja) * | 2016-03-11 | 2020-06-03 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
KR20190022159A (ko) * | 2017-08-25 | 2019-03-06 | 세메스 주식회사 | 다이 본딩 장치 |
KR102047035B1 (ko) * | 2017-09-25 | 2019-11-20 | 세메스 주식회사 | 다이 본딩 장치 |
TWI734434B (zh) * | 2019-04-11 | 2021-07-21 | 日商新川股份有限公司 | 接合裝置 |
-
2020
- 2020-04-01 TW TW109111338A patent/TWI734434B/zh active
- 2020-04-07 CN CN202080027169.XA patent/CN113661564B/zh active Active
- 2020-04-07 SG SG11202111144YA patent/SG11202111144YA/en unknown
- 2020-04-07 WO PCT/JP2020/015746 patent/WO2020209269A1/ja active Application Filing
- 2020-04-07 KR KR1020217035721A patent/KR20210144881A/ko not_active Application Discontinuation
- 2020-04-07 US US17/602,279 patent/US11749541B2/en active Active
- 2020-04-07 JP JP2021513654A patent/JP7205941B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN113661564A (zh) | 2021-11-16 |
TWI734434B (zh) | 2021-07-21 |
CN113661564B (zh) | 2024-03-01 |
TW202041138A (zh) | 2020-11-01 |
KR20210144881A (ko) | 2021-11-30 |
JP7205941B2 (ja) | 2023-01-17 |
WO2020209269A1 (ja) | 2020-10-15 |
US20220165591A1 (en) | 2022-05-26 |
US11749541B2 (en) | 2023-09-05 |
JPWO2020209269A1 (zh) | 2020-10-15 |
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