SG11202107006XA - Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method - Google Patents
Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling methodInfo
- Publication number
- SG11202107006XA SG11202107006XA SG11202107006XA SG11202107006XA SG11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA SG 11202107006X A SG11202107006X A SG 11202107006XA
- Authority
- SG
- Singapore
- Prior art keywords
- laminate body
- peeling
- adhesive composition
- optical irradiation
- production method
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
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- C—CHEMISTRY; METALLURGY
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
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- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L2224/29001—Core members of the layer connector
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- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018245938 | 2018-12-27 | ||
JP2019098890 | 2019-05-27 | ||
PCT/JP2019/051020 WO2020138240A1 (ja) | 2018-12-27 | 2019-12-25 | 光照射剥離用接着剤組成物及び積層体並びに積層体の製造方法及び剥離方法 |
Publications (1)
Publication Number | Publication Date |
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SG11202107006XA true SG11202107006XA (en) | 2021-07-29 |
Family
ID=71128711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202107006XA SG11202107006XA (en) | 2018-12-27 | 2019-12-25 | Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method |
Country Status (8)
Country | Link |
---|---|
US (1) | US20220073801A1 (zh) |
EP (1) | EP3907074A4 (zh) |
JP (2) | JP7486025B2 (zh) |
KR (1) | KR20210107788A (zh) |
CN (1) | CN113226743A (zh) |
SG (1) | SG11202107006XA (zh) |
TW (1) | TW202026387A (zh) |
WO (1) | WO2020138240A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11202010863YA (en) * | 2018-05-01 | 2020-11-27 | Nissan Chemical Corp | Polysiloxane-containing temporary adhesive comprising heat-resistant polymerization inhibitor |
CN114868232A (zh) * | 2019-12-02 | 2022-08-05 | 信越化学工业株式会社 | 晶片加工用临时粘接剂、晶片层叠体及薄型晶片的制造方法 |
JP7517942B2 (ja) | 2020-10-15 | 2024-07-17 | 日鉄ケミカル&マテリアル株式会社 | 積層体の製造方法および処理方法、当該製造方法および処理方法で用いる感光性樹脂組成物 |
KR20230162939A (ko) * | 2021-03-26 | 2023-11-29 | 닛산 가가쿠 가부시키가이샤 | 적층체, 적층체의 제조 방법, 및 반도체 기판의 제조 방법 |
EP4317338A1 (en) * | 2021-03-26 | 2024-02-07 | Nissan Chemical Corporation | Adhesive composition, layered product, method for producing layered product, and method for producing semiconductor substrate |
EP4369380A1 (en) * | 2021-07-26 | 2024-05-15 | Nissan Chemical Corporation | Layered body manufacturing method, and kit for adhesive composition |
KR20240040071A (ko) * | 2021-07-26 | 2024-03-27 | 닛산 가가쿠 가부시키가이샤 | 적층체의 제조 방법, 및 접착제 조성물의 키트 |
WO2023032165A1 (ja) * | 2021-09-03 | 2023-03-09 | 昭和電工マテリアルズ株式会社 | 仮固定用フィルム、仮固定用積層体、及び半導体装置の製造方法 |
JP2023044430A (ja) * | 2021-09-17 | 2023-03-30 | キオクシア株式会社 | 半導体装置、半導体装置の製造方法、および基板の再利用方法 |
WO2023214308A1 (en) * | 2022-05-06 | 2023-11-09 | Flooring Industries Limited, Sarl | Panel and adhesive system for panels |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4250075A (en) * | 1979-02-05 | 1981-02-10 | Dow Corning Corporation | Electrically conductive polydiorganosiloxanes |
JPS62149751A (ja) * | 1985-12-25 | 1987-07-03 | Dow Corning Kk | 耐熱性ポリオルガノシロキサン組成物 |
US4777205A (en) * | 1987-07-22 | 1988-10-11 | Wacker Silicones Corporation | Electrically conductive compositions |
JP2882823B2 (ja) * | 1989-11-15 | 1999-04-12 | 東レ・ダウコーニング・シリコーン株式会社 | 接着剤 |
JP2978319B2 (ja) * | 1991-10-31 | 1999-11-15 | 東レ・ダウコーニング・シリコーン株式会社 | エアーバッグ用基布 |
JP4565804B2 (ja) | 2002-06-03 | 2010-10-20 | スリーエム イノベイティブ プロパティズ カンパニー | 被研削基材を含む積層体、その製造方法並びに積層体を用いた極薄基材の製造方法及びそのための装置 |
JP2008127544A (ja) * | 2006-11-24 | 2008-06-05 | Emulsion Technology Co Ltd | 電子部品の加工方法及び電子部品加工用粘着テープ |
US8399592B2 (en) * | 2007-04-17 | 2013-03-19 | Kaneka Corporation | Polyhedral polysiloxane modified product and composition using the modified product |
JP2010090363A (ja) * | 2008-09-11 | 2010-04-22 | Shin-Etsu Chemical Co Ltd | 硬化性シリコーン樹脂組成物、その硬化物および該組成物からなる遮光性シリコーン接着シート |
JP5580800B2 (ja) | 2010-10-29 | 2014-08-27 | 東京応化工業株式会社 | 積層体、およびその積層体の分離方法 |
JP6413796B2 (ja) * | 2015-01-26 | 2018-10-31 | 東洋インキScホールディングス株式会社 | 架橋性組成物、硬化物の製造方法、および硬化物 |
JP6404723B2 (ja) * | 2015-01-27 | 2018-10-17 | デンカ株式会社 | 仮固定用接着剤組成物、それを用いた部材の仮固定方法及び硬化体残渣の除去方法 |
JP2017014309A (ja) * | 2015-06-26 | 2017-01-19 | Dic株式会社 | 熱剥離性粘着テープ、画像読み取り装置及びその解体方法 |
JP6582739B2 (ja) * | 2015-08-26 | 2019-10-02 | 富士通株式会社 | 電子複合部品の製造方法及び電子複合部品 |
JP6629554B2 (ja) * | 2015-09-28 | 2020-01-15 | アイカ工業株式会社 | 剥離性シリコーン樹脂組成物及びこれを塗布した剥離フィルム |
EP3477685A4 (en) * | 2016-06-22 | 2020-07-01 | Nissan Chemical Corporation | ADHESIVE WITH POLYDIMETHYL SILOXANE |
-
2019
- 2019-12-25 US US17/417,967 patent/US20220073801A1/en active Pending
- 2019-12-25 WO PCT/JP2019/051020 patent/WO2020138240A1/ja unknown
- 2019-12-25 CN CN201980085649.9A patent/CN113226743A/zh active Pending
- 2019-12-25 KR KR1020217023330A patent/KR20210107788A/ko not_active Application Discontinuation
- 2019-12-25 EP EP19905490.9A patent/EP3907074A4/en active Pending
- 2019-12-25 SG SG11202107006XA patent/SG11202107006XA/en unknown
- 2019-12-25 JP JP2020563389A patent/JP7486025B2/ja active Active
- 2019-12-26 TW TW108147935A patent/TW202026387A/zh unknown
-
2024
- 2024-03-06 JP JP2024033535A patent/JP2024072835A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2020138240A1 (ja) | 2020-07-02 |
US20220073801A1 (en) | 2022-03-10 |
KR20210107788A (ko) | 2021-09-01 |
EP3907074A1 (en) | 2021-11-10 |
EP3907074A4 (en) | 2022-09-14 |
JP7486025B2 (ja) | 2024-05-17 |
TW202026387A (zh) | 2020-07-16 |
JP2024072835A (ja) | 2024-05-28 |
JPWO2020138240A1 (ja) | 2021-11-18 |
CN113226743A (zh) | 2021-08-06 |
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