SG11202106695XA - Photocurable composition for imprinting - Google Patents

Photocurable composition for imprinting

Info

Publication number
SG11202106695XA
SG11202106695XA SG11202106695XA SG11202106695XA SG11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA SG 11202106695X A SG11202106695X A SG 11202106695XA
Authority
SG
Singapore
Prior art keywords
imprinting
photocurable composition
photocurable
composition
Prior art date
Application number
SG11202106695XA
Other languages
English (en)
Inventor
Shota Imai
Takehiro Nagasawa
Taku Kato
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of SG11202106695XA publication Critical patent/SG11202106695XA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F251/00Macromolecular compounds obtained by polymerising monomers on to polysaccharides or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/372Sulfides, e.g. R-(S)x-R'
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041Lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
SG11202106695XA 2018-12-21 2019-12-16 Photocurable composition for imprinting SG11202106695XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018240319 2018-12-21
PCT/JP2019/049184 WO2020129902A1 (ja) 2018-12-21 2019-12-16 インプリント用光硬化性組成物

Publications (1)

Publication Number Publication Date
SG11202106695XA true SG11202106695XA (en) 2021-07-29

Family

ID=71101301

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106695XA SG11202106695XA (en) 2018-12-21 2019-12-16 Photocurable composition for imprinting

Country Status (6)

Country Link
JP (1) JP7021710B2 (zh)
KR (1) KR102496908B1 (zh)
CN (1) CN113195547B (zh)
SG (1) SG11202106695XA (zh)
TW (1) TWI805881B (zh)
WO (1) WO2020129902A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023157024A (ja) * 2020-09-14 2023-10-26 日産化学株式会社 インプリント用プライマー層形成組成物
JPWO2022210664A1 (zh) * 2021-03-30 2022-10-06

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2174960B1 (en) * 2008-05-07 2016-08-10 Advanced Softmaterials Inc. Polyrotaxane, crosslinked structure comprising polyrotaxane and polymer, and processes for producing these
JP2010000612A (ja) * 2008-06-18 2010-01-07 Fujifilm Corp ナノインプリント用硬化性組成物、パターン形成方法
US8853291B2 (en) 2010-02-26 2014-10-07 Nippon Steel & Sumikin Chemical Co., Ltd. Curable resin composition, cured article thereof, and optical material
JP2014234458A (ja) 2013-06-03 2014-12-15 昭和電工株式会社 硬化性組成物およびその硬化物
JP2015071741A (ja) * 2013-09-04 2015-04-16 Jsr株式会社 硬化性組成物、ナノインプリント材料、硬化膜、積層体、硬化膜の製造方法、パターン形成方法及び半導体発光素子用基板
KR102387237B1 (ko) 2014-11-04 2022-04-18 가부시키가이샤 에이에스엠 광경화성 조성물, 광경화성 조성물로 형성되는 경화체, 및 해당 경화체의 제조 방법
JP2016121277A (ja) 2014-12-25 2016-07-07 日東電工株式会社 光硬化性樹脂組成物およびそれを用いた光学材料
KR20170139600A (ko) * 2015-04-21 2017-12-19 스미또모 가가꾸 가부시키가이샤 광경화성 수지 조성물, 이것을 이용하는 경화막의 제조 방법 및 당해 경화막을 포함하는 적층체
JPWO2018052008A1 (ja) * 2016-09-16 2019-08-15 住友精化株式会社 ポリロタキサン含有組成物及びその硬化物
WO2018155013A1 (ja) * 2017-02-22 2018-08-30 日産化学工業株式会社 インプリント用光硬化性組成物

Also Published As

Publication number Publication date
KR20210106459A (ko) 2021-08-30
JPWO2020129902A1 (ja) 2021-11-04
KR102496908B1 (ko) 2023-02-07
TW202039606A (zh) 2020-11-01
JP7021710B2 (ja) 2022-02-17
CN113195547A (zh) 2021-07-30
WO2020129902A1 (ja) 2020-06-25
TWI805881B (zh) 2023-06-21
CN113195547B (zh) 2023-08-11

Similar Documents

Publication Publication Date Title
EP3694907A4 (en) PHOTOSETTING COMPOSITIONS AND 3D PRINTING PROCESSES USING THEM
EP3778681A4 (en) COMPOSITION OF LIGHT-CURING RESIN
EP3508190A4 (en) PHOTOSETTING COMPOSITION
IL267443A (en) stamping device
SG11201609095VA (en) Material for forming film for lithography, composition for forming film for lithography, film for lithography, pattern forming method and purification method
SG11201610838VA (en) Photocurable electroconductive ink composition
EP3880386C0 (en) COMPOSITION FOR 3D PRINTING
SG10202106500YA (en) Photocurable resin composition for nail or artificial nail
GB201810492D0 (en) Composition
EP3795273C0 (en) MOLD
GB201818164D0 (en) New composition
GB201811100D0 (en) Composition
EP3658590C0 (de) Photoinitiatoren für lichthärtende zusammensetzungen
SG11201705828SA (en) Photocurable composition
GB201812145D0 (en) Composition
GB201804434D0 (en) Composition
SG11202106695XA (en) Photocurable composition for imprinting
EP3880909C0 (en) CYLINDER FOR DRIVE MECHANISM
GB201815031D0 (en) Composition
ZA202101967B (en) Mold plate
EP3876884C0 (de) Bandagenaufdruck
GB201809113D0 (en) Compounds for new use
IL289753A (en) Resin preparation for embedding
GB201810024D0 (en) Composition
GB201809123D0 (en) Composition