SG11202106554WA - Alignment device, method and equipment for double-sided exposure - Google Patents

Alignment device, method and equipment for double-sided exposure

Info

Publication number
SG11202106554WA
SG11202106554WA SG11202106554WA SG11202106554WA SG11202106554WA SG 11202106554W A SG11202106554W A SG 11202106554WA SG 11202106554W A SG11202106554W A SG 11202106554WA SG 11202106554W A SG11202106554W A SG 11202106554WA SG 11202106554W A SG11202106554W A SG 11202106554WA
Authority
SG
Singapore
Prior art keywords
double
equipment
alignment device
sided exposure
sided
Prior art date
Application number
SG11202106554WA
Inventor
Zhiwei Fu
Original Assignee
Jiangsu Ysphotech Integrated Circuit Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Ysphotech Integrated Circuit Equipment Co Ltd filed Critical Jiangsu Ysphotech Integrated Circuit Equipment Co Ltd
Publication of SG11202106554WA publication Critical patent/SG11202106554WA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/708—Mark formation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG11202106554WA 2018-12-19 2018-12-19 Alignment device, method and equipment for double-sided exposure SG11202106554WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/121967 WO2020124406A1 (en) 2018-12-19 2018-12-19 Alignment device, method and equipment for double-sided exposure

Publications (1)

Publication Number Publication Date
SG11202106554WA true SG11202106554WA (en) 2021-07-29

Family

ID=71102342

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106554WA SG11202106554WA (en) 2018-12-19 2018-12-19 Alignment device, method and equipment for double-sided exposure

Country Status (3)

Country Link
JP (1) JP7203959B2 (en)
SG (1) SG11202106554WA (en)
WO (1) WO2020124406A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000250232A (en) * 1999-02-25 2000-09-14 Ono Sokki Co Ltd Pattern forming device
JP4053723B2 (en) * 2000-09-27 2008-02-27 株式会社東芝 Method for manufacturing exposure mask
JP5813556B2 (en) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング Exposure drawing apparatus, program, and exposure drawing method
CN102681360A (en) * 2012-04-24 2012-09-19 合肥芯硕半导体有限公司 Alignment method for realizing circuit board double-sided figure alignment in laser imaging system
CN102890428A (en) * 2012-09-18 2013-01-23 天津芯硕精密机械有限公司 Method for aligning exposure patterns on two sides of PCB (printed circuit board)
CN103529660A (en) * 2013-10-29 2014-01-22 天津芯硕精密机械有限公司 Internal layer alignment apparatus for multi-optical path exposure equipment
JP6465591B2 (en) * 2014-08-27 2019-02-06 株式会社オーク製作所 Drawing device
CN206348594U (en) * 2016-12-31 2017-07-21 合肥芯碁微电子装备有限公司 It is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system
CN206557530U (en) * 2017-01-24 2017-10-13 苏州微影激光技术有限公司 It is a kind of expose inner plating contraposition caliberating device and apply its exposure machine

Also Published As

Publication number Publication date
WO2020124406A1 (en) 2020-06-25
JP2022511304A (en) 2022-01-31
KR20210076114A (en) 2021-06-23
JP7203959B2 (en) 2023-01-13

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