CN103529660A - Internal layer alignment apparatus for multi-optical path exposure equipment - Google Patents
Internal layer alignment apparatus for multi-optical path exposure equipment Download PDFInfo
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- CN103529660A CN103529660A CN201310520982.2A CN201310520982A CN103529660A CN 103529660 A CN103529660 A CN 103529660A CN 201310520982 A CN201310520982 A CN 201310520982A CN 103529660 A CN103529660 A CN 103529660A
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- pcb
- circuit board
- lens barrel
- image acquisition
- acquisition device
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Abstract
The invention discloses an internal layer alignment apparatus for multi-optical path exposure equipment. The apparatus comprises a rectilinear motion platform, a printed circuit board (PCB), spatial light modulators (SLMs), SLM imaging lens barrels, marking devices, an image acquisition device and an image acquisition device lens barrel, wherein the PCB is adsorbed on the rectilinear motion platform, the lower ends of the SLMs are connected with the SLM imaging lens barrels, the SLM imaging lens barrels project images on the PCB, the marking devices are fixed at one side of the PCB, the lower end of the image acquisition device is connected with the image acquisition device lens barrel, and the image acquisition device acquires the images on the PCB through the image acquisition device lens barrel. Preferably, the marking devices are UVLEDs or lasers and installed against the PCB. The invention has the following beneficial effects: the problem of inconsistent marks for images mutually scanned by the SLMs is overcome, and the internal layer alignment apparatus is easy and convenient to operate, has a fast speed and can improve production power.
Description
Technical field
The invention belongs to printed circuit board (PCB) technical field of lithography, relate in particular to a kind of position alignment of inner layer plates device of multi-pass exposure sources.
Background technology
Write-through photoetching technique is the image that directly shows design on the surface of substrate having, with ultraviolet light, extreme ultraviolet light, collimated light etc., through spatial light modulator SLM and projection objective, light is invested to the surface of substrate, the light that triggers the surface sense luminescent material of substrate touches reaction, the substrate of end exposure, through processing such as developers, demonstrates the image of design.Due to spatial light modulator SLM size restrictions, operable valid pixel is limited, the image size that single spatial light modulator SLM invests substrate surface through projection objective can not meet the demands, therefore need a plurality of spatial light modulator SLM array arrangements to be combined into the image of full space of a whole page width requirement, the substrate being projected is installed on the linear motion platform of linear electric motors control, linear running platform triggers electronic control signal according to movement position, the signal of controlling triggers spatial light modulator SLM new images more continuously again, with this through machinery, electronics coordinates to have controlled the scanning of image, form the image of the full space of a whole page.Each spatial light modulator SLM will scan the image of a row band at substrate surface, each spatial light modulator SLM scans at substrate surface the image that multiple row histogram picture has spliced needs again.
In printed circuit board industry, mainly photoetching making is inner layer circuit board, as circuit board of mobile phone mainly contains 8 layers of PCB the electric circuit constitute, wherein there are 6 layers to be internal layer PCB circuit board, need 3 circuit boards to do pros and cons exposure photo-etching, the circuit of pros and cons that need this each circuit board in process can complete contraposition and can correctly be communicated with positive and negative circuit to guarantee all via holes, otherwise by the useless plate that is the problem such as can produce short circuit, open circuit, and can produce the problem board disturbing by pros and cons circuit.But in write-through photosystem, complete the linear motion platform of spatial light modulator SLM scanning due to the inherent characteristic of self, in rectilinear motion, can produce the swing of inclination, pitching, rotation, make to be carried in the swing that exposure substrate on linear motion platform has larger inclination, pitching, rotation in scanning, making to scan histogram picture on the exposure substrate of spatial light modulator SLM on linear motion platform is not straight line, the edge that is band is not parallel lines, but crooked S line possibility are wide at the top and narrow at the bottom or low wide and up narrow or other, as shown in Figure 2.Inner layer circuit board need to expose respectively on the two sides of PCB circuit board, therefore directly affects inner layer circuit board exposure quality.
Owing to taking linear motion platform to reduce the swing of motion and keep stable, will greatly increase write-through photosystem cost, therefore in the urgent need to a kind of technology that guarantees the image contraposition quality of internal layer PCB circuit board two sides exposure.
Summary of the invention
The position alignment of inner layer plates device that the object of this invention is to provide a kind of multi-pass exposure sources, to solve the above-mentioned defect existing in prior art.
In order to reach object of the present invention, the invention provides a kind of position alignment of inner layer plates device of multi-pass exposure sources, comprise linear motion platform printed circuit board (PCB) (PCB), spatial light modulator (SLM), SLM imaging lens barrel, marking device, image capture device, image capture device lens barrel, described PCB is adsorbed on described linear motion platform, described SLM lower end is connected with described SLM imaging lens barrel, described SLM imaging lens is projected on described PCB, described marking device is fixed on described PCB mono-side, described image capture device lower end is connected with described image capture device lens barrel, described image capture device gathers the image on described pcb board by described image capture device lens barrel.
Preferably, described marking device is uvLED or laser instrument, and described marking device is close to described PCB and is installed.
Beneficial effect of the present invention is, of the present invention overcome between each spatial light modulator of mark SLM mutually scan image inconsistence problems, operation is easy, speed is fast, can improve production capacity.
Accompanying drawing explanation
Fig. 1 is apparatus structure schematic diagram of the present invention;
Fig. 2 is that the histogram that scans of spatial light modulator SLM of the present invention is as schematic diagram;
Fig. 3 is circuit board face exposure schematic diagram provided by the invention;
Fig. 4 is circuit board reverse side exposure schematic diagram provided by the invention;
In figure, 1-exposure figure, 10-is linear motion platform, 11-is the PCB circuit board on linear motion platform, 12-15 is the image window that spatial light modulator SLM projects to PCB circuit board, 17-is the signal of Scan direction, 20-23 is spatial light modulator SLM, 24-27 is the imaging lens barrel of spatial light modulator SLM, 30, the 31st, measurement image capture device, the 32, the 33rd, measure lens barrel and illumination with image capture device, 34 is direction of motion signals of 31,40-47 is marking device, and 50-57 is the mark that PCB circuit board reverse side is beaten.
Embodiment
In order to make object of the present invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be understood to specific embodiment described herein only in order to explain the present invention, be not limited to protection scope of the present invention.
The invention provides a kind of position alignment of inner layer plates device of multi-pass exposure sources, comprise linear motion platform printed circuit board (PCB) (PCB), spatial light modulator (SLM), SLM imaging lens barrel, marking device, image capture device, image capture device lens barrel, described PCB is adsorbed on described linear motion platform, described SLM lower end is connected with described SLM imaging lens barrel, described SLM imaging lens is projected on described PCB, described marking device is fixed on described PCB mono-side, described image capture device lower end is connected with described image capture device lens barrel, described image capture device gathers the image on described pcb board by described image capture device lens barrel.
Preferably, described marking device is uvLED or laser instrument, and described marking device is close to described PCB and is installed.
Beneficial effect of the present invention is, of the present invention overcome between each spatial light modulator of mark SLM mutually scan image inconsistence problems, operation is easy, speed is fast, can improve production capacity.
Principle of work of the present invention is: by the direction identical with Scan, spin upside down PCB circuit board, make the histogram picture of positive and negative exposure scanning of PCB circuit board substantially at same position, to reduce between each spatial light modulator SLM, mutually scan image inconsistence problems.Simultaneously in the face exposure of PCB circuit board, at the device up to standard that the reverse side of PCB circuit board is adjacent, together lay mark, complete after the face exposure of PCB circuit board, PCB circuit board spins upside down, the reverse side of PCB circuit board is turned on spatial light modulator SLM projection focal plane, by pick-up unit, detect the coordinate that PCB circuit board reverse side is laid mark again, obtain as calculated rotation angle and translational movement that PCB circuit board is put, with this, adjust the rotation of another side image exposure and translation position of memory circuit board to be exposed.What marking device 40 was directly beaten is mark 50, and marking device 41 is directly beaten is that direct what beat is mark 57 to mark 51... marking device 47.
A kind of having particular application as of the present invention, comprises the following steps:
Step s1, in the two-dimensional direct angle coordinate system of setting up with support plate platform, the coordinate that calculates marking device is (x
bi, y
bi), wherein, the integer that i is 0-n;
Utilize the measuring equipment of etching system to measure the position coordinates (x of marking device mark
bi, y
bi), wherein, the integer that i is 0-n, (n>1), and n=7 for example, coordinate is herein the projection coordinate of marking device in the two-dimensional direct angle coordinate system setting up with support plate platform, is also the mark coordinate of beating at circuit board reverse side.
The two-dimensional direct angle coordinate system basic point of setting up with support plate platform is defined in the lower left corner of support plate platform, with support plate platform, set up two-dimensional direct angle coordinate system, initial point is located at basic point, support plate platform can move in the Y direction, measuring equipment, comprise the first image capture device, the second image capture device can move at directions X.Make marking device to measuring equipment below on support plate platform 10, mobile measuring equipment is measured the difference position coordinates of marking device.According to the displacement of the respective coordinates of measuring equipment, support plate platform and equipment, can calculate the coordinate (x of marking device
bi, y
bi), this coordinate data is preserved.
Step s2, circuit board is placed into described support plate platform while doing face exposure, and marking device is got to mark the reverse side of described circuit board simultaneously, and counting circuit figure central point is (x at the coordinate of take in the two-dimensional direct angle coordinate system that described support plate platform sets up
l, y
l), described in calculating according to the coordinate of the coordinate of described marking device and described circuit diagram central point, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with circuit diagram
bi, y
bi), wherein, the integer that i is 0-n;
Circuit board is put into support plate platform while doing face exposure, marking device reaches mark the reverse side of circuit board, and circuit diagram is thrown on circuit board through exposure projections, because the circuit diagram front description exposing is without any constraint, there are direct-write photoetching system acquiescence, the position coordinates (x of the centre of figure in the position of figure
l, y
l) can go out according to the calculation of parameter of circuit diagram, so the mark stamped through marking device of circuit board with respect to the data of the position coordinates of the centre of figure also just with x described in translation method
bi=x
bi-x
l, y
bi=y
l-y
bicalculate (x
bi, y
bi).
Step s3, described circuit board is overturn 180 ° around the vertical direction of exposure traffic direction, complete upper and lower turnover panel, described in get to circuit board reverse side mark will be turned to the top of circuit board, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with support plate platform described in calculating
ci, y
ci), i=0-n;
Circuit board, around the x axle Rotate 180 ° of the vertical direction upset of exposure traffic direction, completes upper and lower turnover panel action, and the mark of circuit board reverse side will be turned to the top of circuit board, then through measuring equipment, measures the coordinate (x of mark
ci, y
ci).
Step s4, chooses i=0, j=n, substitution rotation angle β computing formula: arctg[(y
ci-y
cj)/(x
ci-x
cj)]-arctg[(y
bi-y
bj)/(x
bi-x
bj)] and translation number according to computing formula:
Calculate described rotation angle β and described translation data;
I wherein, j selection principle is minimum value and the maximal value that can get to the marking serial numbers on circuit board, chooses i=0, j=n calculates according to computing formula the data that position alignment of inner layer plates needs for people's rotation angle β computing formula and translation number.
Step s5, according to described rotation angle β and described translation data, carries out image rotation and translation to circuit board reverse side exposure figure.
Circuit board reverse side pattern just can carry out according to rotation angle β, translation data rotation and the translation of figure successively.
Described marking device refers to controlled uvLED or laser instrument;
Described turnover panel up and down refers to that circuit board is around in the vertical direction upset of exposure traffic direction;
Described measuring equipment refers to area array CCD general reference image capture device;
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some and retouching, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (2)
1. the position alignment of inner layer plates device of a multi-pass exposure sources, it is characterized in that, comprise linear motion platform printed circuit board (PCB) (PCB), spatial light modulator (SLM), SLM imaging lens barrel, marking device, image capture device, image capture device lens barrel, described PCB is adsorbed on described linear motion platform, described SLM lower end is connected with described SLM imaging lens barrel, described SLM imaging lens is projected on described PCB, described marking device is fixed on described PCB mono-side, described image capture device lower end is connected with described image capture device lens barrel, described image capture device gathers the image on described pcb board by described image capture device lens barrel.
2. the position alignment of inner layer plates device of multi-pass exposure sources according to claim 2, is characterized in that, described marking device is uvLED or laser instrument, and described marking device is close to described PCB and is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520982.2A CN103529660A (en) | 2013-10-29 | 2013-10-29 | Internal layer alignment apparatus for multi-optical path exposure equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520982.2A CN103529660A (en) | 2013-10-29 | 2013-10-29 | Internal layer alignment apparatus for multi-optical path exposure equipment |
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| CN103529660A true CN103529660A (en) | 2014-01-22 |
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| CN201310520982.2A Pending CN103529660A (en) | 2013-10-29 | 2013-10-29 | Internal layer alignment apparatus for multi-optical path exposure equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105278262A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method of demarcating positional relation of optical paths of exposure machine through chuck camera |
| CN106371298A (en) * | 2016-11-25 | 2017-02-01 | 天津津芯微电子科技有限公司 | LDI inner layer alignment method and system |
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
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| WO2012063631A1 (en) * | 2010-11-08 | 2012-05-18 | 株式会社ブイ・テクノロジー | Exposure apparatus |
| CN102890428A (en) * | 2012-09-18 | 2013-01-23 | 天津芯硕精密机械有限公司 | Method for aligning exposure patterns on two sides of PCB (printed circuit board) |
| CN202735677U (en) * | 2012-06-08 | 2013-02-13 | 合肥芯硕半导体有限公司 | Device for marking inner layer circuit board of laser direct-writing exposure machine |
| CN103197501A (en) * | 2013-02-19 | 2013-07-10 | 北京京东方光电科技有限公司 | Array substrate and preparation method thereof, and display device |
-
2013
- 2013-10-29 CN CN201310520982.2A patent/CN103529660A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012063631A1 (en) * | 2010-11-08 | 2012-05-18 | 株式会社ブイ・テクノロジー | Exposure apparatus |
| CN202735677U (en) * | 2012-06-08 | 2013-02-13 | 合肥芯硕半导体有限公司 | Device for marking inner layer circuit board of laser direct-writing exposure machine |
| CN102890428A (en) * | 2012-09-18 | 2013-01-23 | 天津芯硕精密机械有限公司 | Method for aligning exposure patterns on two sides of PCB (printed circuit board) |
| CN103197501A (en) * | 2013-02-19 | 2013-07-10 | 北京京东方光电科技有限公司 | Array substrate and preparation method thereof, and display device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105278262A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method of demarcating positional relation of optical paths of exposure machine through chuck camera |
| CN106371298A (en) * | 2016-11-25 | 2017-02-01 | 天津津芯微电子科技有限公司 | LDI inner layer alignment method and system |
| CN106371298B (en) * | 2016-11-25 | 2018-09-14 | 天津津芯微电子科技有限公司 | LDI position alignment of inner layer plates method and system |
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
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Owner name: TIANJIN JINXIN MICROELECTRONICS TECHNOLOGY CO., LT Free format text: FORMER OWNER: TIANJIN XINSHUO PRECISION MACHINERY CO., LTD. Effective date: 20140702 |
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Free format text: CORRECT: ADDRESS; FROM: 300457 BINHAI NEW DISTRICT, TIANJIN TO: 300000 BINHAI NEW DISTRICT, TIANJIN |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20140702 Address after: Fifth Street 300000 Tianjin City Development Zone, Taihua Road No. 12 TEDA SME development center room 3103 Applicant after: TIANJIN JINXIN MICROELECTRONIC TECHNOLOGY CO., LTD. Address before: 300457 No. 167 Huang Hai Road, Tianjin Development Zone, Binhai New Area, Tianjin, China Applicant before: Tianjin Xinshuo Precision Machinery Co., Ltd. |
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Application publication date: 20140122 |