CN103529654A - Alignment method for internal layers in direct writing type photoetching system - Google Patents
Alignment method for internal layers in direct writing type photoetching system Download PDFInfo
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- CN103529654A CN103529654A CN201310520801.6A CN201310520801A CN103529654A CN 103529654 A CN103529654 A CN 103529654A CN 201310520801 A CN201310520801 A CN 201310520801A CN 103529654 A CN103529654 A CN 103529654A
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Abstract
The invention discloses an alignment method for internal layers in a direct writing type photoetching system. According to the method, during exposure of a front circuit diagram of a circuit board, a marking apparatus leaves marks on the back surface of the circuit board at same time, the marks are left at blank positions on the lower frame of the circuit board, and the position data (x[bi], y[bi]) of the marks relative to the coordinate system of a carrier platform are transformed into the coordinate system of the circuit board to obtain the coordinate (x[Bi], y[Bi]), wherein i is in range of 0 to n and n may be 7 in the position data (x[bi], y[bi]), i is in range of 0 to n in the coordinate (x[Bi], y[Bi]), the center of the circuit board has to be the datum of the coordinate system of the circuit board, and the circuit diagram overturns around a direction perpendicular to an exposure operation direction during exposure of the back surface, i.e., up-and-down overturning; the position data (x[bi], y[bi]) of the marks relative to the coordinate system of the carrier platform are measured, recorded and stored in advance by area array CCD in the system; after up-and-down overturning, exposure of the back surface of the circuit board is carried out, the area array CCD in the system is also used for measuring the position coordinate (x[ci], y[ci]) of the marks, wherein i is in range of 0 to n, the position coordinate (x[ci], y[ci]) and the transformed coordinate (x[Bi], y[Bi]) of the marks in the circuit diagram are analyzed, and rotation and translation data of the circuit diagram are calculated, wherein the angle of rotation is calculated before calculation of the translation data during calculation.
Description
Technical field
The invention belongs to printed circuit board (PCB) technical field of lithography, relate in particular to the method for position alignment of inner layer plates in a kind of write-through etching system.
Background technology
In printed circuit board industry, relate to and use photoetching technique to manufacture inner layer circuit board.As circuit board of mobile phone mainly contains 8 layer printed circuit boards (PCB) the electric circuit constitute, live width is less than 4mil(1mil=25.4um), wherein there are 6 layers to be internal layer PCB circuit board, wherein 3 circuit boards are done pros and cons exposure photo-etching.The circuit of the pros and cons of each inner layer circuit board of needs can be completed to contraposition in process and can correctly be communicated with positive and negative circuit to guarantee all via holes, otherwise by the useless plate that is the problem such as can produce short circuit, open circuit, and can produce the problem board disturbing by pros and cons circuit.
In inner layer circuit board photolithographic exposure, common film exposure machine can be installed lower two films, circuit board to be exposed is clipped between two films, in exposure machine, can give up and down ultraviolet light simultaneously, makes circuit diagram image on the film be exposed to the tow sides of circuit board simultaneously.Whether two films, by being manually installed on film exposure machine, need operating personnel to observe, repeatedly adjust the absorption position of two films, to meet aligning accuracy, and repeatedly observe and be shifted in producing.But because the error of manual observation and precision and circuit plate holder carry the displacement of generation, make aligning accuracy on common film exposure machine can not meet the circuit board exposure requirement below 6mil live width.
The system architecture of the exposure machine of write-through etching system and principle of work and mode determine, one side that at every turn can only exposure circuit plate, be front or reverse side, and the live width of can exposing reaches 1mil, artificial bit errors can not meet contraposition requirement completely, meets the method for aligning accuracy in the urgent need to a kind of pro and con figure that makes each circuit board completely.
Summary of the invention
The method that the object of this invention is to provide position alignment of inner layer plates in a kind of write-through etching system, to solve in prior art, while using write-through etching system to carry out the exposure of circuit board pros and cons, the problem that the pros and cons figure of circuit board cannot exactitude position.
In order to reach object of the present invention, the invention provides the method for position alignment of inner layer plates in a kind of write-through etching system, comprise the following steps:
The 1st step, in the two-dimensional direct angle coordinate system of setting up with support plate platform, the coordinate that calculates marking device is (x
bi, y
bi), wherein, the integer that i is 0-n;
The 2nd step, circuit board is placed into described support plate platform while doing face exposure, and marking device is got to mark the reverse side of described circuit board simultaneously, and counting circuit figure central point is (x at the coordinate of take in the two-dimensional direct angle coordinate system that described support plate platform sets up
l, y
l), described in calculating according to the coordinate of the coordinate of described marking device and described circuit diagram central point, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with circuit diagram
bi, y
bi), wherein, the integer that i is 0-n;
The 3rd step, described circuit board is overturn 180 ° around the vertical direction of exposure traffic direction, complete upper and lower turnover panel, described in get to circuit board reverse side mark will be turned to the top of circuit board, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with support plate platform described in calculating
ci, y
ci), i=0-n;
The 4th step, chooses i=0, j=n, substitution rotation angle β computing formula: arctg[(y
ci-y
cj)/(x
ci-x
cj)]-arctg[(y
bi-y
bj)/(x
bi-x
bj)] and translation number according to computing formula:
calculate described rotation angle β and described translation data;
The 5th step, according to described rotation angle β and described translation data, carries out image rotation and translation to circuit board reverse side exposure figure.
Preferably, described x
bi=x
bi-x
l, y
bi=y
l-y
bi.
Preferably, described marking device refers to controlled uvLED or laser instrument.
Preferably, described mark refers to the hot spot that uvLED or laser instrument are beaten;
Beneficial effect of the present invention is, mark described in the present invention and circuit board front description are exposed to respectively the pros and cons of circuit board simultaneously, make mark and circuit diagram produce intrinsic relation, when exposing, the reverse side after upper and lower turnover panel can guarantee aligning accuracy, measure simultaneously, calculate simple and direct, save the time shutter, improved production capacity.
Accompanying drawing explanation
Figure l is method flow diagram of the present invention;
Fig. 2 is circuit board exposure provided by the invention, measurement, marking intention;
Fig. 3 is circuit board face exposure schematic diagram provided by the invention;
Fig. 4 is circuit board reverse side exposure schematic diagram provided by the invention;
In figure, 1-support plate platform, 2-circuit board, 3-the first image capture device, 4-the second image capture device, the image window of 5-exposure projections, 6-marking device, 7-mark, the two-dimensional direct angle coordinate system basic point that 8-sets up with support plate platform, the two-dimensional direct angle coordinate system basic point that 9-sets up with circuit diagram.
Embodiment
In order to make object of the present invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be understood to specific embodiment described herein only in order to explain the present invention, be not limited to protection scope of the present invention.
Principle of work of the present invention is: in write-through etching system during the front circuit diagram of exposure circuit plate, by marking device, mark is beaten on the reverse side of circuit board simultaneously, be marked at the blank position on the lower frame of circuit board, simultaneously by mark with respect to position data (x in carrier platform coordinate system
bi, y
bi), i=0-n, wherein n can be 7, is transformed in the coordinate system of circuit diagram, is (x
bi, y
bi), i=0-n, it is benchmark that the coordinate system of circuit diagram must be take the center of circuit diagram, circuit diagram when exposure reverse side to be around in the vertical direction upset of exposure traffic direction, i.e. upper and lower turnover panel.Mark with respect to position data (x in platform coordinate system
bi, y
bi), i=0～n, be in system area array CCD in advance survey record preserve; While doing the exposure of circuit board reverse side after upper and lower turnover panel, same in system the position coordinates (x of area array CCD measurement markers
ci, y
ci), i=0-n, then be marked at coordinate (x in circuit diagram with passing over
bi, y
bi), i=0-n analyzes, and calculates rotation, the translation data of circuit diagram, in calculating, calculate rotation angle and calculate again translation data.
As shown in Figure 1, Figure 2, Figure 3, Figure 4, the method for position alignment of inner layer plates in a kind of write-through etching system provided by the invention, comprises the following steps:
Step s1, in the two-dimensional direct angle coordinate system of setting up with support plate platform, the coordinate that calculates marking device is (x
bi, y
bi), wherein, the integer that i is 0-n;
Utilize the measuring equipment of etching system to measure the position coordinates (x of marking device mark
bi, y
bi), wherein, the integer that i is 0-n, (n>1), and n=7 for example, coordinate is herein the projection coordinate of marking device in the two-dimensional direct angle coordinate system setting up with support plate platform, is also the mark coordinate of beating at circuit board reverse side.
The two-dimensional direct angle coordinate system basic point of setting up with support plate platform is defined in the lower left corner of support plate platform, with support plate platform, set up two-dimensional direct angle coordinate system, initial point is located at basic point, support plate platform can move in the Y direction, measuring equipment, comprise the first image capture device, the second image capture device can move at directions X.Make marking device to measuring equipment below on support plate platform 10, mobile measuring equipment is measured the difference position coordinates of marking device.According to the displacement of the respective coordinates of measuring equipment, support plate platform and equipment, can calculate the coordinate (x of marking device
bi, y
bi), this coordinate data is preserved.
Step s2, circuit board is placed into described support plate platform while doing face exposure, and marking device is got to mark the reverse side of described circuit board simultaneously, and counting circuit figure central point is (x at the coordinate of take in the two-dimensional direct angle coordinate system that described support plate platform sets up
l, y
l), described in calculating according to the coordinate of the coordinate of described marking device and described circuit diagram central point, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with circuit diagram
bi, y
bi), wherein, the integer that i is 0-n;
Circuit board is put into support plate platform while doing face exposure, marking device reaches mark the reverse side of circuit board, and circuit diagram is thrown on circuit board through exposure projections, because the circuit diagram front description exposing is without any constraint, there are direct-write photoetching system acquiescence, the position coordinates (x of the centre of figure in the position of figure
l, y
l) can go out according to the calculation of parameter of circuit diagram, so the mark stamped through marking device of circuit board with respect to the data of the position coordinates of the centre of figure also just with x described in translation method
bi=x
bi-x
l, y
bi=y
l-y
bicalculate (x
bi, y
bi).
Step s3, described circuit board is overturn 180 ° around the vertical direction of exposure traffic direction, complete upper and lower turnover panel, described in get to circuit board reverse side mark will be turned to the top of circuit board, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with support plate platform described in calculating
ci, y
ci), i=0-n;
Circuit board, around the x axle Rotate 180 ° of the vertical direction upset of exposure traffic direction, completes upper and lower turnover panel action, and the mark of circuit board reverse side will be turned to the top of circuit board, then through measuring equipment, measures the coordinate (x of mark
ci, y
ci).
Step s4, chooses i=0, j=n, substitution rotation angle β computing formula: arctg[(y
ci-y
cj)/(x
ci-x
cj)]-arctg[(y
bi-y
bj)/(x
bi-x
bj)] and translation number according to computing formula:
calculate described rotation angle β and described translation data;
I wherein, j selection principle is minimum value and the maximal value that can get to the marking serial numbers on circuit board, chooses i=0, j=n calculates according to computing formula the data that position alignment of inner layer plates needs for people's rotation angle β computing formula and translation number.
Step s5, according to described rotation angle β and described translation data, carries out image rotation and translation to circuit board reverse side exposure figure.
Circuit board reverse side pattern just can carry out according to rotation angle β, translation data rotation and the translation of figure successively.
Described marking device refers to controlled uvLED or laser instrument;
Described turnover panel up and down refers to that circuit board is around in the vertical direction upset of exposure traffic direction;
Described measuring equipment refers to area array CCD general reference image capture device;
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some and retouching, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (4)
1. a method for position alignment of inner layer plates in write-through etching system, is characterized in that, comprises the following steps:
The 1st step, in the two-dimensional direct angle coordinate system of setting up with support plate platform, the coordinate that calculates marking device is (x
bi, y
bi), wherein, the integer that i is 0-n;
The 2nd step, circuit board is placed into described support plate platform while doing face exposure, and marking device is got to mark the reverse side of described circuit board simultaneously, and counting circuit figure central point is (x at the coordinate of take in the two-dimensional direct angle coordinate system that described support plate platform sets up
l, y
l), described in calculating according to the coordinate of the coordinate of described marking device and described circuit diagram central point, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with circuit diagram
bi, y
bi), wherein, the integer that i is 0-n;
The 3rd step, described circuit board is overturn 180 ° around the vertical direction of exposure traffic direction, complete upper and lower turnover panel, described in get to circuit board reverse side mark will be turned to the top of circuit board, be marked at the coordinate (x in the two-dimensional direct angle coordinate system of setting up with support plate platform described in calculating
ci, y
ci), i=0-n;
The 4th step, chooses i=0, and j equals the ordinal number of witness marking maximum, substitution rotation angle β computing formula: arctg[(y
ci-y
cj)/(x
ci-x
cj)]-arctg[(y
bi-y
bj)/(x
bi-x
bj)] and translation number according to computing formula:
calculate described rotation angle β and described translation data;
The 5th step, according to described rotation angle β and described translation data, carries out image rotation and translation to circuit board reverse side exposure figure.
2. the method for position alignment of inner layer plates in write-through etching system according to claim 1, is characterized in that described x
bi=x
bi-x
l, y
bi=y
l-y
bi.
3. the method for position alignment of inner layer plates in write-through etching system according to claim 1 and 2, is characterized in that, described marking device refers to controlled uvLED or laser instrument.
4. the method for position alignment of inner layer plates in write-through etching system according to claim 3, is characterized in that, described mark refers to the hot spot that uvLED or laser instrument are beaten.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520801.6A CN103529654A (en) | 2013-10-29 | 2013-10-29 | Alignment method for internal layers in direct writing type photoetching system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520801.6A CN103529654A (en) | 2013-10-29 | 2013-10-29 | Alignment method for internal layers in direct writing type photoetching system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103529654A true CN103529654A (en) | 2014-01-22 |
Family
ID=49931766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310520801.6A Pending CN103529654A (en) | 2013-10-29 | 2013-10-29 | Alignment method for internal layers in direct writing type photoetching system |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104407502A (en) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | Method for producing inner layer non-porous circuit board by utilizing laser direct imaging device |
| CN105278261A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method for measuring alignment accuracy of inner layer of laser direct-writing exposure machine |
| CN106019857A (en) * | 2016-07-22 | 2016-10-12 | 合肥芯碁微电子装备有限公司 | Positioning method based on alignment exposure of mask-free direct writing system |
| CN106353977A (en) * | 2016-11-25 | 2017-01-25 | 天津津芯微电子科技有限公司 | Aligning method and aligning device for LDI (Laser Direct Image) outer layer |
| CN106371298A (en) * | 2016-11-25 | 2017-02-01 | 天津津芯微电子科技有限公司 | LDI inner layer alignment method and system |
| CN106647180A (en) * | 2016-11-28 | 2017-05-10 | 湖北凯昌光电科技有限公司 | Error correction and compensation method and device based on calibration board in direct-writing exposure machine |
| CN106896653A (en) * | 2017-01-24 | 2017-06-27 | 苏州微影激光技术有限公司 | It is a kind of to be applied to the method that direct write exposure machine makes the non-porous aligning plate of internal layer |
| CN107864573A (en) * | 2017-11-09 | 2018-03-30 | 建业科技电子（惠州）有限公司 | One kind increase position alignment of inner layer plates degree of accuracy orifice ring technique |
| CN109358476A (en) * | 2018-12-13 | 2019-02-19 | 苏州源卓光电科技有限公司 | Yellow light is to Barebone, litho machine and its alignment methods |
| CN110441993A (en) * | 2019-07-29 | 2019-11-12 | 合肥芯碁微电子装备有限公司 | A kind of marking method for the imaging contraposition of laser direct imaging equipment front and back sides |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| CN111624860A (en) * | 2019-02-28 | 2020-09-04 | 深圳凯世光研股份有限公司 | Circuit board exposure reference positioning method and device |
| CN114415482A (en) * | 2022-03-30 | 2022-04-29 | 之江实验室 | Writing method and device of super-resolution laser direct writing system based on galvanometer |
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Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104407502A (en) * | 2014-11-19 | 2015-03-11 | 江苏影速光电技术有限公司 | Method for producing inner layer non-porous circuit board by utilizing laser direct imaging device |
| CN105278261A (en) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | Method for measuring alignment accuracy of inner layer of laser direct-writing exposure machine |
| CN106019857A (en) * | 2016-07-22 | 2016-10-12 | 合肥芯碁微电子装备有限公司 | Positioning method based on alignment exposure of mask-free direct writing system |
| CN106019857B (en) * | 2016-07-22 | 2018-02-02 | 合肥芯碁微电子装备有限公司 | It is a kind of based on the localization method exposed without mask straight-writing system alignment |
| CN106371298B (en) * | 2016-11-25 | 2018-09-14 | 天津津芯微电子科技有限公司 | LDI position alignment of inner layer plates method and system |
| CN106353977A (en) * | 2016-11-25 | 2017-01-25 | 天津津芯微电子科技有限公司 | Aligning method and aligning device for LDI (Laser Direct Image) outer layer |
| CN106371298A (en) * | 2016-11-25 | 2017-02-01 | 天津津芯微电子科技有限公司 | LDI inner layer alignment method and system |
| CN106353977B (en) * | 2016-11-25 | 2019-05-14 | 天津津芯微电子科技有限公司 | LDI outer layer alignment method and device |
| CN106647180B (en) * | 2016-11-28 | 2018-09-28 | 湖北凯昌光电科技有限公司 | Error correction and compensation method based on scaling board in direct write exposure machine |
| CN106647180A (en) * | 2016-11-28 | 2017-05-10 | 湖北凯昌光电科技有限公司 | Error correction and compensation method and device based on calibration board in direct-writing exposure machine |
| CN106896653A (en) * | 2017-01-24 | 2017-06-27 | 苏州微影激光技术有限公司 | It is a kind of to be applied to the method that direct write exposure machine makes the non-porous aligning plate of internal layer |
| CN107864573A (en) * | 2017-11-09 | 2018-03-30 | 建业科技电子（惠州）有限公司 | One kind increase position alignment of inner layer plates degree of accuracy orifice ring technique |
| CN109358476A (en) * | 2018-12-13 | 2019-02-19 | 苏州源卓光电科技有限公司 | Yellow light is to Barebone, litho machine and its alignment methods |
| CN111624860A (en) * | 2019-02-28 | 2020-09-04 | 深圳凯世光研股份有限公司 | Circuit board exposure reference positioning method and device |
| CN110441993A (en) * | 2019-07-29 | 2019-11-12 | 合肥芯碁微电子装备有限公司 | A kind of marking method for the imaging contraposition of laser direct imaging equipment front and back sides |
| CN110441993B (en) * | 2019-07-29 | 2021-08-13 | 合肥芯碁微电子装备股份有限公司 | Marking method for front and back imaging alignment of laser direct imaging equipment |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| CN111221223B (en) * | 2019-12-05 | 2021-02-26 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| CN114415482A (en) * | 2022-03-30 | 2022-04-29 | 之江实验室 | Writing method and device of super-resolution laser direct writing system based on galvanometer |
| CN114415482B (en) * | 2022-03-30 | 2022-07-15 | 之江实验室 | Inscribing method and device of super-resolution laser direct writing system based on galvanometer |
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Effective date of registration: 20140702 Address after: Fifth Street 300000 Tianjin City Development Zone, Taihua Road No. 12 TEDA SME development center room 3103 Applicant after: TIANJIN JINXIN MICROELECTRONIC TECHNOLOGY CO., LTD. Address before: 300457 No. 167 Huang Hai Road, Tianjin Development Zone, Binhai New Area, Tianjin, China Applicant before: Tianjin Xinshuo Precision Machinery Co., Ltd. |
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Application publication date: 20140122 |