CN107908085A - Design outer layer film aligning process for stabilizing - Google Patents
Design outer layer film aligning process for stabilizing Download PDFInfo
- Publication number
- CN107908085A CN107908085A CN201711094336.9A CN201711094336A CN107908085A CN 107908085 A CN107908085 A CN 107908085A CN 201711094336 A CN201711094336 A CN 201711094336A CN 107908085 A CN107908085 A CN 107908085A
- Authority
- CN
- China
- Prior art keywords
- circle
- film
- verification
- contraposition
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses design outer layer film aligning process for stabilizing, include the following steps：The film makes, circle of position is designed, verifies circle design, draws location hole, the film positions hole forming, positioning holes on circuit board is molded, film aligning and contraposition detect, and the three-dimensional data that the step 1) obtains will meet the required size of growth amplification and surface accuracy condition；It is described grow amplify when, transition is carried out to two dimensional model according to the local similarity of three-dimensional line on sample, fusion, equal linear array is justified in the verification to circle of position and verification circle best-fit structure of the contraposition circle best-fit structure, align the contraposition reference circle of circle best-fit structure and the verification basic circle of verification circle best-fit structure is respectively positioned on the first place of linear, the step 7) is to ensure that film aligning is accurate, first have in Quadratic Finite Element correct amount harmomegathus, the present invention, it is simple in structure, it is easy to make, effectively lift the contraposition accuracy of the film and to bit rate, lift the convenience used.
Description
Technical field
The present invention relates to film aligning technical field, specially designs outer layer film aligning process for stabilizing.
Background technology
With the fast development of electronic technology, the positive miniaturization of electronic product, high reliability direction continue to develop, so,
Also continued to develop for the printed circuit board in electronic product to miniaturization, high density direction, therefore, the road on printed circuit board
Line becomes more fine, and the pad on printed circuit board also becomes more crypto set, in this way, in the exposure manufacture process of printed circuit board
In, the requirement of printed circuit board aligning accuracy also becomes higher and higher.During existing printed circuit board exposure, phenanthrene plate is fitted in print
Circuit board surface processed exposes again, since the position between luxuriant and rich with fragrance plate and printed circuit board aligns inaccurately sometimes, after causing exposure
Circuit is not imprinted on printed circuit plate surface by preset requirement, forms useless plate, and the film is attached to printed circuit plate surface speed
Degree is slow, and consumption is artificial.
The content of the invention
It is an object of the invention to provide design outer layer film aligning process for stabilizing, to solve to propose in above-mentioned background technology
The problem of.
In order to solve the above technical problem, the present invention provides following technical solution：Outer layer film aligning process for stabilizing is designed,
1. include the following steps：
1) film makes：First, the sample with three-dimensional line is cleaned；Then, using three-dimensional scanning device to sample
Originally it is scanned, the threedimensional model of the sample is built according to the three-dimensional data of gained；Then to established threedimensional model into
Row dimensionality reduction map operation, obtains the two dimensional model of sample, in the extension composition algorithm using image, to the two dimensional model of sample into
The adaptive long amplification of row, obtains the two dimensional model of required size；Finally amplified two dimension will be being grown using a liter method for dimension
Model is mapped as threedimensional model, and then obtains required film pattern.
2) circle of position is designed：Contraposition circle best-fit structure is equipped with the film, it is multiple right that above-mentioned contraposition circle best-fit structure includes
Circle of position, it is above-mentioned multiple to containing a contraposition reference circle in circle of position, it is above-mentioned multiple mutually outer from above-mentioned multiple to circle of position to circle of position
Radius it is identical, the center of circle is arranged in a straight line, distance of center circle is equal；
3) verification circle design：With the method for concentric circles, verification circle best-fit structure, above-mentioned verification circle are equipped with circuit boards
Arrangement architecture, which includes multiple verifications, to be justified, and the center of circle of each verification circle is opposite with each center of circle to circle of position on the film on circuit board
Should；Contain a verification basic circle, radius, center location and the contraposition reference of above-mentioned verification basic circle in above-mentioned multiple verification circles
Round radius, center location are identical；Above-mentioned multiple verification circles it is mutually outer from, to verify basic circle as starting point, above-mentioned multiple verifications
Round radius is sequentially increased；
4) location hole is drawn：Printed circuit board drawing and film drawing are fit together in a computer, pass through printing
The position of positioning hole on circuit board drawing periphery draws location hole on film drawing；Then the film pattern for having location hole will be drawn
The corresponding film is obtained after output.
5) film positioning hole forming：Positioning is gone out on film periphery with perforating press according to the position of positioning hole on film drawing
Hole, the positioning bore dia gone out on the film are more than printed circuit board periphery positioning bore dia；
6) positioning holes on circuit board is molded：Printed circuit board after plating, by the aperture of printed circuit board location hole be washed into
Film location hole aperture is consistent；
7) film aligning：The above-mentioned film is installed on the following table of exposure machine, during the automatic aligning of exposure machine,
The above-mentioned film is fixed；Then foregoing circuit plate is installed on the upper table surface of exposure machine, in the automatic aligning mistake of exposure machine
Cheng Zhong, foregoing circuit plate can be relative to the film movements on following table, after exposure machine automatic aligning, each verification on circuit board
Circle is each overlapping to circle of position with the film, and circuit board is completed to align with the film；
8) contraposition detection：After circuit board and the film complete contraposition, to verify basic circle as starting point, from small to large in observation
Each verification circle overlaps degree with each on the lower film to circle of position on the film, so as to judge the contraposition essence of the upper film and the lower film
Whether degree reaches required precision；If verification basic circle overlaps with contraposition reference circle, is in addition to basic circle is verified other each
Verification circle forms concentric circles with corresponding to circle of position respectively, i.e., each verification circle is respectively with corresponding to circle of position not inscribe, then electricity
The aligning accuracy of road plate and the film reaches requirement；If verify basic circle and contraposition reference circle it is misaligned, except verification basic circle with
Outer other each verification circles cannot form concentric circles with corresponding to circle of position respectively, then the contraposition of circuit board and the film does not reach
Required precision, at this time, to verify basic circle as starting point, observes each verification circle, finds out and justify with the verification to circle of position inscribe one by one,
The verification of mutual inscribe is round and is the contraposition offset of circuit board and the film to the radial difference between circle of position.
According to above-mentioned technical proposal, three-dimensional data that the step 1) obtains to meet growth amplify required size and
Surface accuracy condition；It is described grow amplify when, two dimensional model is carried out according to the local similarity of three-dimensional line on sample transition,
Fusion.
According to above-mentioned technical proposal, the verification to circle of position and verification circle best-fit structure of the contraposition circle best-fit structure is justified
Linear array, aligns the contraposition reference circle of circle best-fit structure and the verification basic circle of verification circle best-fit structure is respectively positioned on linear
First place on.
According to above-mentioned technical proposal, the step 7) first has to rise in Quadratic Finite Element correct amount to ensure that film aligning is accurate
Contracting, it is proposed that amount at least 6 plates, are subject to average；The film aligning should be operated in dust free room, and the temperature of the dust free room exists
18-22 DEG C, humidity is in 45-65% sections, it is ensured that the film itself harmomegathus is stable, deformation is small；The film medicine face will paste protection
Film, wipes to prevent the film and spends, and causes batch ink remaining；PIN nails are paid the utmost attention to during the contraposition, 10 times must be used after Manual-alignment
Whether sem observation pad has to inclined, is preferentially aligned using butterfly pad.
According to above-mentioned technical proposal, the step 7) uses exposure machine as a kind of LDI exposure machines.
According to above-mentioned technical proposal, step 1) the line scanning device is roughness measuring instrument, profile measurer or probe
Formula measuring instrument；The three-dimensional scanning device is optical scanner or laser 3 d scanner.
Compared with prior art, the beneficial effect that is reached of the present invention is：The present invention is by using three-dimensional scanning device pair
Sample is scanned, and the threedimensional model of the sample is built according to the three-dimensional data of gained；Then to established threedimensional model
Dimensionality reduction map operation is carried out, obtains the two dimensional model of sample, the extension composition algorithm of image is being utilized, to the two dimensional model of sample
Adaptive long amplification is carried out, obtains the two dimensional model of required size, can effectively lift the manufacturing speed and production quality of the film,
Effectively lift the convenience used；The precision of contraposition can be effectively lifted by LDI exposure machines, effectively lifts the convenience used
Property；The design of characterization processes is aligned, the aligning accuracy of the film can be effectively lifted, lift the convenience used.
Brief description of the drawings
Attached drawing is used for providing a further understanding of the present invention, and a part for constitution instruction, the reality with the present invention
Apply example to be used to explain the present invention together, be not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the film aligning process for stabilizing flow chart of the present invention；
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
Referring to Fig. 1, the present invention provides technical solution：Outer layer film aligning process for stabilizing is designed, is included the following steps：
1) film makes：First, the sample with three-dimensional line is cleaned；Then, using three-dimensional scanning device to sample
Originally it is scanned, the threedimensional model of the sample is built according to the three-dimensional data of gained；Then to established threedimensional model into
Row dimensionality reduction map operation, obtains the two dimensional model of sample, in the extension composition algorithm using image, to the two dimensional model of sample into
The adaptive long amplification of row, obtains the two dimensional model of required size；Finally amplified two dimension will be being grown using a liter method for dimension
Model is mapped as threedimensional model, and then obtains required film pattern.
2) circle of position is designed：Contraposition circle best-fit structure is equipped with the film, it is multiple right that above-mentioned contraposition circle best-fit structure includes
Circle of position, it is above-mentioned multiple to containing a contraposition reference circle in circle of position, it is above-mentioned multiple mutually outer from above-mentioned multiple to circle of position to circle of position
Radius it is identical, the center of circle is arranged in a straight line, distance of center circle is equal；
3) verification circle design：With the method for concentric circles, verification circle best-fit structure, above-mentioned verification circle are equipped with circuit boards
Arrangement architecture, which includes multiple verifications, to be justified, and the center of circle of each verification circle is opposite with each center of circle to circle of position on the film on circuit board
Should；Contain a verification basic circle, radius, center location and the contraposition reference of above-mentioned verification basic circle in above-mentioned multiple verification circles
Round radius, center location are identical；Above-mentioned multiple verification circles it is mutually outer from, to verify basic circle as starting point, above-mentioned multiple verifications
Round radius is sequentially increased；
4) location hole is drawn：Printed circuit board drawing and film drawing are fit together in a computer, pass through printing
The position of positioning hole on circuit board drawing periphery draws location hole on film drawing；Then the film pattern for having location hole will be drawn
The corresponding film is obtained after output.
5) film positioning hole forming：Positioning is gone out on film periphery with perforating press according to the position of positioning hole on film drawing
Hole, the positioning bore dia gone out on the film are more than printed circuit board periphery positioning bore dia；
6) positioning holes on circuit board is molded：Printed circuit board after plating, by the aperture of printed circuit board location hole be washed into
Film location hole aperture is consistent；
7) film aligning：The above-mentioned film is installed on the following table of exposure machine, during the automatic aligning of exposure machine,
The above-mentioned film is fixed；Then foregoing circuit plate is installed on the upper table surface of exposure machine, in the automatic aligning mistake of exposure machine
Cheng Zhong, foregoing circuit plate can be relative to the film movements on following table, after exposure machine automatic aligning, each verification on circuit board
Circle is each overlapping to circle of position with the film, and circuit board is completed to align with the film；
8) contraposition detection：After circuit board and the film complete contraposition, to verify basic circle as starting point, from small to large in observation
Each verification circle overlaps degree with each on the lower film to circle of position on the film, so as to judge the contraposition essence of the upper film and the lower film
Whether degree reaches required precision；If verification basic circle overlaps with contraposition reference circle, is in addition to basic circle is verified other each
Verification circle forms concentric circles with corresponding to circle of position respectively, i.e., each verification circle is respectively with corresponding to circle of position not inscribe, then electricity
The aligning accuracy of road plate and the film reaches requirement；If verify basic circle and contraposition reference circle it is misaligned, except verification basic circle with
Outer other each verification circles cannot form concentric circles with corresponding to circle of position respectively, then the contraposition of circuit board and the film does not reach
Required precision, at this time, to verify basic circle as starting point, observes each verification circle, finds out and justify with the verification to circle of position inscribe one by one,
The verification of mutual inscribe is round and is the contraposition offset of circuit board and the film to the radial difference between circle of position.
According to above-mentioned technical proposal, the three-dimensional data that step 1) obtains will meet that required size and surface are amplified in growth
Precision conditions；When growing amplification, transition, fusion carry out two dimensional model according to the local similarity of three-dimensional line on sample.
According to above-mentioned technical proposal, equal straight line is justified in the verification to circle of position and verification circle best-fit structure of contraposition circle best-fit structure
Shape arranges, and aligns the contraposition reference circle of circle best-fit structure and the verification basic circle of verification circle best-fit structure is respectively positioned on the head of linear
On position.
According to above-mentioned technical proposal, step 7) first has to, in Quadratic Finite Element correct amount harmomegathus, build to ensure that film aligning is accurate
View amount at least 6 plates, are subject to average；Film aligning should be operated in dust free room, and the temperature of dust free room exists in 18-22 DEG C, humidity
45-65% sections, it is ensured that the film itself harmomegathus is stable, deformation is small；Film medicine face wants pasting protective film, wipes and spends to prevent the film, makes
Ink is remaining in batch；PIN nails are paid the utmost attention to during contraposition, whether must be had to inclined with 10 times of sem observations pad after Manual-alignment,
Preferentially aligned using butterfly pad.
According to above-mentioned technical proposal, step 7) uses exposure machine as a kind of LDI exposure machines.
According to above-mentioned technical proposal, step 1) line scanning device is roughness measuring instrument, profile measurer or probe-type are surveyed
Measure instrument；Three-dimensional scanning device is optical scanner or laser 3 d scanner.
Operation principle：The present invention is scanned sample by using three-dimensional scanning device, according to the three-dimensional data of gained
Build the threedimensional model of the sample；Then dimensionality reduction map operation is being carried out to established threedimensional model, is obtaining the two dimension of sample
Model, is utilizing the extension composition algorithm of image, carries out adaptive long amplification to the two dimensional model of sample, obtains required size
Two dimensional model, can effectively lift the manufacturing speed and production quality of the film, effectively lift the convenience used；Exposed by LDI
Ray machine can effectively lift the precision of contraposition, effectively lift the convenience used；The design of characterization processes is aligned, can effectively be carried
The aligning accuracy of the film is risen, lifts the convenience used.
Finally it should be noted that：The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic.
Within the spirit and principles of the invention, any modification, equivalent replacement, improvement and so on, should be included in the present invention's
Within protection domain.
Claims (6)
1. design outer layer film aligning process for stabilizing, it is characterised in that：Include the following steps：
1) film makes：First, the sample with three-dimensional line is cleaned；Then, using three-dimensional scanning device to sample into
Row scanning, the threedimensional model of the sample is built according to the three-dimensional data of gained；Then dropped to established threedimensional model
Map operation is tieed up, obtains the two dimensional model of sample, in the extension composition algorithm using image, the two dimensional model of sample is carried out certainly
Long amplification is adapted to, obtains the two dimensional model of required size；Finally amplified two dimensional model will be being grown using a liter method for dimension
Threedimensional model is mapped as, and then obtains required film pattern.
2) circle of position is designed：Be equipped with contraposition circle best-fit structure on the film, above-mentioned contraposition circle best-fit structure include it is multiple to circle of position,
It is above-mentioned multiple to containing a contraposition reference circle in circle of position, it is above-mentioned multiple mutually outer to circle of position from above-mentioned multiple to the half of circle of position
Footpath is identical, the center of circle is arranged in a straight line, distance of center circle is equal；
3) verification circle design：With the method for concentric circles, verification circle best-fit structure, above-mentioned verification circle best-fit are equipped with circuit boards
Structure includes multiple verifications and justifies, and the center of circle of each verification circle is corresponding with each center of circle to circle of position on the film on circuit board；On
State in multiple verification circles containing a verification basic circle, the radius of above-mentioned verification basic circle, center location and contraposition reference circle
Radius, center location are identical；Above-mentioned multiple verification circles it is mutually outer from, to verify basic circle as starting point, above-mentioned multiple verification circles
Radius is sequentially increased；
4) location hole is drawn：Printed circuit board drawing and film drawing are fit together in a computer, pass through printed circuit
The position of positioning hole on plate drawing periphery draws location hole on film drawing；Then the film pattern output for having location hole will be drawn
After obtain the corresponding film.
5) film positioning hole forming：Location hole is gone out on film periphery with perforating press according to the position of positioning hole on film drawing,
The positioning bore dia gone out on the film is more than printed circuit board periphery positioning bore dia；
6) positioning holes on circuit board is molded：After plating, the aperture of printed circuit board location hole is washed into and the film for printed circuit board
Location hole aperture is consistent；
7) film aligning：The above-mentioned film is installed on the following table of exposure machine, it is above-mentioned during the automatic aligning of exposure machine
The film is fixed；Then foregoing circuit plate is installed on the upper table surface of exposure machine, during the automatic aligning of exposure machine,
Foregoing circuit plate can relative to the film movement on following table, after exposure machine automatic aligning, each verification on circuit board circle with
Each overlapping to circle of position on the film, circuit board is completed to align with the film；
8) contraposition detection：After circuit board and the film complete contraposition, to verify basic circle as starting point, the upper film is observed from small to large
Upper each verification circle overlaps degree with each on the lower film to circle of position, so that judging the aligning accuracy of the upper film and the lower film is
It is no to reach required precision；If verification basic circle is overlapped with contraposition reference circle, other each verifications in addition to basic circle is verified
Circle forms concentric circles with corresponding to circle of position respectively, i.e., each verification is justified respectively with corresponding to circle of position not inscribe, then circuit board
Reach requirement with the aligning accuracy of the film；If verify basic circle and contraposition reference circle it is misaligned, in addition to basic circle is verified
Other each verification circles cannot form concentric circles with corresponding to circle of position respectively, then the contraposition of circuit board and the film does not reach precision
It is required that at this time, to verify basic circle as starting point, each verification circle is observed one by one, finds out and justifies with the verification to circle of position inscribe, mutually
The verification of inscribe is round and is the contraposition offset of circuit board and the film to the radial difference between circle of position.
2. design outer layer film aligning process for stabilizing according to claim 1, it is characterised in that：What the step 1) obtained
Three-dimensional data will meet that required size and surface accuracy condition are amplified in growth；It is described grow amplify when, according on sample
The local similarity of three-dimensional line carries out two dimensional model transition, fusion.
3. design outer layer film aligning process for stabilizing according to claim 1, it is characterised in that：The contraposition circle best-fit knot
Equal linear array is justified in the verification to circle of position and verification circle best-fit structure of structure, aligns the contraposition reference circle of circle best-fit structure and tests
The verification basic circle of card circle best-fit structure is respectively positioned on the first place of linear.
4. design outer layer film aligning process for stabilizing according to claim 1, it is characterised in that：The step 7) is to ensure
Film aligning is accurate, first has in Quadratic Finite Element correct amount harmomegathus, it is proposed that amount at least 6 plates, are subject to average；The film aligning
It should be operated in dust free room, the temperature of the dust free room is in 18-22 DEG C, humidity in 45-65% sections, it is ensured that the film itself harmomegathus is steady
Calmly, deformation is small；The film medicine face wants pasting protective film, wipes and spends to prevent the film, causes batch ink remaining；It is excellent during the contraposition
First consider PIN nails, whether must have to inclined with 10 times of sem observations pad after Manual-alignment, preferentially be aligned using butterfly pad.
5. design outer layer film aligning process for stabilizing according to claim 1, it is characterised in that：The step 7) is using exposure
Ray machine is a kind of LDI exposure machines.
6. design outer layer film aligning process for stabilizing according to claim 1, it is characterised in that：Step 1) the line scanning
Equipment is roughness measuring instrument, profile measurer or probe-type measurement instrument；The three-dimensional scanning device for optical scanner or
Laser 3 d scanner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094336.9A CN107908085A (en) | 2017-11-09 | 2017-11-09 | Design outer layer film aligning process for stabilizing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711094336.9A CN107908085A (en) | 2017-11-09 | 2017-11-09 | Design outer layer film aligning process for stabilizing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107908085A true CN107908085A (en) | 2018-04-13 |
Family
ID=61843788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711094336.9A Pending CN107908085A (en) | 2017-11-09 | 2017-11-09 | Design outer layer film aligning process for stabilizing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107908085A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867266A (en) * | 2020-12-29 | 2021-05-28 | 惠州市麒麟达电子科技有限公司 | PCB grooving process method |
| CN113504702A (en) * | 2021-07-12 | 2021-10-15 | 天水华洋电子科技股份有限公司 | Method for manufacturing film glass mold |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5887343A (en) * | 1997-05-16 | 1999-03-30 | Harris Corporation | Direct chip attachment method |
| CN102520593A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Alignment verification method for exposure machine |
| CN202857150U (en) * | 2012-11-14 | 2013-04-03 | 胜华电子（惠阳）有限公司 | Auxiliary structure for aligning precision tests of LED (Light-Emitting Diode) light bar |
| CN103136381A (en) * | 2011-11-23 | 2013-06-05 | 比亚迪股份有限公司 | Film manufacturing method |
| CN103324040A (en) * | 2013-05-28 | 2013-09-25 | 吴子坚 | Method for raising contraposition precision between printed circuit board and film |
| CN103619127A (en) * | 2013-11-04 | 2014-03-05 | 深圳市鑫岸科技有限公司 | Method for realizing high-precision screen printing through direct solidification |
| CN206442606U (en) * | 2017-02-17 | 2017-08-25 | 河南海乐电子科技有限公司 | A kind of PIN follows closely alignment device |
-
2017
- 2017-11-09 CN CN201711094336.9A patent/CN107908085A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5887343A (en) * | 1997-05-16 | 1999-03-30 | Harris Corporation | Direct chip attachment method |
| CN103136381A (en) * | 2011-11-23 | 2013-06-05 | 比亚迪股份有限公司 | Film manufacturing method |
| CN102520593A (en) * | 2012-01-06 | 2012-06-27 | 汕头超声印制板公司 | Alignment verification method for exposure machine |
| CN202857150U (en) * | 2012-11-14 | 2013-04-03 | 胜华电子（惠阳）有限公司 | Auxiliary structure for aligning precision tests of LED (Light-Emitting Diode) light bar |
| CN103324040A (en) * | 2013-05-28 | 2013-09-25 | 吴子坚 | Method for raising contraposition precision between printed circuit board and film |
| CN103619127A (en) * | 2013-11-04 | 2014-03-05 | 深圳市鑫岸科技有限公司 | Method for realizing high-precision screen printing through direct solidification |
| CN206442606U (en) * | 2017-02-17 | 2017-08-25 | 河南海乐电子科技有限公司 | A kind of PIN follows closely alignment device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867266A (en) * | 2020-12-29 | 2021-05-28 | 惠州市麒麟达电子科技有限公司 | PCB grooving process method |
| CN113504702A (en) * | 2021-07-12 | 2021-10-15 | 天水华洋电子科技股份有限公司 | Method for manufacturing film glass mold |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105278261B (en) | A kind of measuring method of laser direct-writing exposure machine position alignment of inner layer plates precision | |
| CN113240674B (en) | Coplanarity detection method based on three-dimensional point cloud and two-dimensional image fusion | |
| CN101117043B (en) | Silk screen printing device | |
| CN102927903B (en) | Method and device for checking surface-mounted-technology (SMT)-based printed circuit board (PCB) | |
| TW388803B (en) | A structure and method of measuring overlapping marks | |
| CN106773525B (en) | Mask plate, alignment method, display panel, display device and alignment method thereof | |
| CN108845480A (en) | A kind of position alignment of inner layer plates accuracy measurement method | |
| CN108627104A (en) | A kind of dot laser measurement method of parts height dimension | |
| CN107908085A (en) | Design outer layer film aligning process for stabilizing | |
| JP2008539085A (en) | System and method for aligning a wafer processing system in a laser marking system | |
| CN103529659A (en) | Alignment precision detection method and system | |
| CN202057299U (en) | Image calibration template capable of automatically establishing image coordinate system | |
| JP2010169651A (en) | Substrate inspecting apparatus and inspecting tool | |
| CN114460442B (en) | High-precision needle drop compensation method and device for flying needle test and storage medium | |
| CN108333881A (en) | A kind of splicing adjustment method applied to write-through exposure machine | |
| TW201519398A (en) | Marking structure for substrate, substrate, and method of forming marking structure of substrate | |
| CN109539956A (en) | Plane detector | |
| CN113043738B (en) | Glass silk-screen deviation calculation method and device and visual positioning method | |
| CN116679535B (en) | Overlay error measurement method, device, system and storage medium | |
| CN203293646U (en) | Screen printing equipment and special measuring device for same | |
| CN116634129A (en) | Lithium battery coating size CCD camera system calibration device and method | |
| CN100552544C (en) | Exposure device and localization method | |
| CN114137799B (en) | Method for calibrating inner layer target of laser direct imaging equipment | |
| CN101226338B (en) | Method for detecting calibration degree of scanning exposure machine | |
| CN101140423B (en) | Transmission aligning mark combination used for mask alignment and mask alignment method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180413 |
|
| RJ01 | Rejection of invention patent application after publication |