CN206348594U - It is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system - Google Patents
It is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system Download PDFInfo
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- CN206348594U CN206348594U CN201621485709.6U CN201621485709U CN206348594U CN 206348594 U CN206348594 U CN 206348594U CN 201621485709 U CN201621485709 U CN 201621485709U CN 206348594 U CN206348594 U CN 206348594U
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- circuit board
- layer circuit
- inner layer
- light source
- marking device
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The utility model, which is provided, is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system, including light source, the diaphragm above light source and the collimation lens between light source and diaphragm, and the light source uses purple dual-colored LED.The utility model is used as light source using the purple dual-colored LED for providing feux rouges and ultraviolet light, glowed when being directed at the coordinate of system acquisition marking device before inner layer circuit board face exposure, ultraviolet light, inside layer circuit board reverse side marking point are sent out when inner layer circuit board face exposure；Increase collimation lens between light source and diaphragm simultaneously, make more uniform by the light of diaphragm；Marking device and institute's marking point are the problem of focal plane is inconsistent in Barebone during the utility model efficiently solves inner layer circuit board contraposition.
Description
Technical field
The utility model is related to laser direct-write photoetching technical field, and internal layer electricity is used in specifically a kind of direct-write photoetching system
The marking device of road plate contraposition.
Background technology
, it is necessary to be carried out to the tow sides of each inner layer circuit board pair during PCB industries process inner layer circuit board
Position, to ensure that all vias can correctly connect the circuit of tow sides, otherwise will produce there are problems that it is short-circuit,
Useless plate.
At present, the mode of PCB industries direct-write lithography machine position alignment of inner layer plates is to install marking device on support plate platform.Internal layer electricity
Before the plate face exposure of road, the coordinate of system acquisition marking device is directed at, inner layer circuit board face exposure coordinate system is determined；Internal layer electricity
While the plate face exposure of road, mark point is got to inner layer circuit board reverse side by marking device；Overturn inner layer circuit board, internal layer circuit
Before the exposure of plate reverse side, the coordinate of the multiple mark points of system acquisition is directed at, inner layer circuit board reverse side exposure coordinates system is determined, passes through two
Group coordinate system fitting, it is ensured that the figure of inner layer circuit board tow sides is corresponding.
Existing PCB industries direct-write lithography machine to Barebone use red illumination mode.Because internal layer circuit plate surface
Photosensitive material is not high to feux rouges light receiving efficiency, so will not be to the photosensitive of inner layer circuit board surface during alignment system acquisition mark point
Material produces influence.And the marking device that PCB industries direct-write lithography machine is used for position alignment of inner layer plates is made using UVLED or ultraviolet laser
For light source.The ultraviolet light light receiving efficiency highest that the photosensitive material of internal layer circuit plate surface is provided UVLED or ultraviolet laser, because
This marking device institute marking point is the most clear.But the ultraviolet light that UVLED or ultraviolet laser are provided can be to adopting to Barebone
The coordinate for collecting marking device produces influence.
Before inner layer circuit board face exposure, the coordinate of system acquisition marking device is directed at, it is main into the light to Barebone
The ultraviolet light sent for UVLED or ultraviolet laser；Before the exposure of inner layer circuit board reverse side, the alignment multiple mark points of system acquisition
Coordinate, is mainly feux rouges into the light to Barebone.Feux rouges is differed excessively with ultraviolet wavelength, therefore Jiao in Barebone
Face position difference is more.In order to ensure to obtain Barebone clearly as gathering the coordinate and collection mark point of marking device
The position of support plate platform Z axis will be inconsistent during coordinate, and the inconsistent of support plate platform Z axis position can influence the essence of position alignment of inner layer plates
Degree.
Utility model content
The purpose of this utility model, which is to provide, is used for the mark dress that inner layer circuit board is aligned in a kind of direct-write photoetching system
Put, to solve during inner layer circuit board contraposition marking device and institute marking point focal plane in Barebone is inconsistent asks
Topic.
The technical solution of the utility model is：
Be used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system, including light source, above the light source
Diaphragm and the collimation lens between light source and diaphragm, the light source use purple dual-colored LED, for working as internal layer circuit
Glowed when the coordinate of system acquisition marking device is directed at before plate face exposure, be additionally operable to send out when inner layer circuit board face exposure
Ultraviolet light, inside layer circuit board reverse side marking point.
It is used for the marking device that inner layer circuit board is aligned in described direct-write photoetching system, the light source is located at collimation lens
Lower focal position, the diaphragm be located at collimation lens upper focal position.
It is used for the marking device that inner layer circuit board is aligned in described direct-write photoetching system, the collimation lens uses biconvex
Lens.
It is used for the marking device that inner layer circuit board is aligned, the thang-kng bore dia of the diaphragm in described direct-write photoetching system
For 0.2mm.
The beneficial effects of the utility model are：
As shown from the above technical solution, the utility model is used as light using the purple dual-colored LED for providing feux rouges and ultraviolet light
Source, when being directed at the coordinate of system acquisition marking device before inner layer circuit board face exposure, purple dual-colored LED glows, when interior
During layer circuit board face exposure, purple dual-colored LED hair ultraviolet light, inside layer circuit board reverse side marking point；Simultaneously light source with
Increase collimation lens between diaphragm, make more uniform by the light of diaphragm；The utility model efficiently solves inner layer circuit board pair
Marking device and institute's marking point are the problem of focal plane is inconsistent in Barebone during position.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is application schematic diagram of the utility model during inner layer circuit board contraposition.
Embodiment
Below in conjunction with the accompanying drawings the utility model is further illustrated with specific embodiment.
As shown in Figure 1 and Figure 2, the marking device that inner layer circuit board is aligned, mark dress are used in a kind of direct-write photoetching system
Putting 10 includes light source 101, the diaphragm 102 above light source and the collimation lens between light source 101 and diaphragm 102
103.Light source 101 uses purple dual-colored LED, can send the light of different colours under different voltage control, i.e., when internal layer electricity
Glowed when gathering the coordinate of marking device 10 to Barebone 30 before the exposure of road plate front 401, when inner layer circuit board front 401 exposes
Light time sends out ultraviolet light, the inside marking point 50 of layer circuit board reverse side 402.Collimation lens 103 uses biconvex lens, light source 101
In the lower focal position of collimation lens 103, diaphragm 102 is located at the upper focal position of collimation lens 103.The light hole of diaphragm 102
A diameter of 0.2mm.
Operation principle of the present utility model：
Such as Fig. 2（a）Shown, before the exposure of inner layer circuit board front 401, light source 101 is glowed, and mark is gathered to Barebone 30
The coordinate of device 10, determines inner layer circuit board face exposure coordinate system.Such as Fig. 2（b）It is shown, confirm inner layer circuit board face exposure
After coordinate system, inner layer circuit board front 401 exposes, the hair ultraviolet light of light source 101, is marked a little in inner layer circuit board reverse side 402
50.Such as Fig. 2（c）It is shown, after the completion of the exposure of inner layer circuit board front 401, overturn inner layer circuit board, inner layer circuit board reverse side 402
Upward, before the exposure of inner layer circuit board reverse side 402, the coordinate of mark point 50 is gathered to Barebone 30, determines that inner layer circuit board is anti-
Face exposure coordinates system.It is fitted by two groups of coordinate systems, it is ensured that the figure of inner layer circuit board tow sides is corresponding.
Embodiment described above is only that preferred embodiment of the present utility model is described, not to this practicality
New scope is defined, on the premise of the utility model design spirit is not departed from, and those of ordinary skill in the art are to this
Various modifications and improvement that the technical scheme of utility model is made, all should fall into the guarantor that claims of the present utility model are determined
In the range of shield.
Claims (4)
1. it is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system, it is characterised in that：Including light source, it is located at
Diaphragm above light source and the collimation lens between light source and diaphragm, the light source use purple dual-colored LED, for working as
Glow, be additionally operable to when inner layer circuit board front when the coordinate of system acquisition marking device is directed at before inner layer circuit board face exposure
Ultraviolet light, inside layer circuit board reverse side marking point are sent out during exposure.
2. being used for the marking device that inner layer circuit board is aligned in direct-write photoetching system according to claim 1, its feature exists
In：The light source is located at the lower focal position of collimation lens, and the diaphragm is located at the upper focal position of collimation lens.
3. being used for the marking device that inner layer circuit board is aligned in direct-write photoetching system according to claim 1, its feature exists
In：The collimation lens uses biconvex lens.
4. being used for the marking device that inner layer circuit board is aligned in direct-write photoetching system according to claim 1, its feature exists
In：The a diameter of 0.2mm of light hole of the diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621485709.6U CN206348594U (en) | 2016-12-31 | 2016-12-31 | It is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621485709.6U CN206348594U (en) | 2016-12-31 | 2016-12-31 | It is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206348594U true CN206348594U (en) | 2017-07-21 |
Family
ID=59323197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621485709.6U Active CN206348594U (en) | 2016-12-31 | 2016-12-31 | It is used for the marking device that inner layer circuit board is aligned in a kind of direct-write photoetching system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206348594U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
| CN112965340A (en) * | 2021-02-04 | 2021-06-15 | 电子科技大学 | Compact maskless photoetching system and exposure method thereof |
-
2016
- 2016-12-31 CN CN201621485709.6U patent/CN206348594U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020124406A1 (en) * | 2018-12-19 | 2020-06-25 | 江苏影速集成电路装备股份有限公司 | Alignment device, method and equipment for double-sided exposure |
| CN112965340A (en) * | 2021-02-04 | 2021-06-15 | 电子科技大学 | Compact maskless photoetching system and exposure method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Qi Inventor after: Li Xiangbin Inventor after: Fan Yunrui Inventor before: Zhang Qi Inventor before: Li Xiangbin Inventor before: Fan Yunrui |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 230088 the 11 level of F3 two, two innovation industrial park, No. 2800, innovation Avenue, Hi-tech Zone, Hefei, Anhui. Patentee after: Hefei Xinqi microelectronics equipment Co., Ltd Address before: Two, H2 building, No. 2800, Wangjiang Industrial Park, 230088 Wangjiang West Road, hi tech Zone, Anhui, Hefei, 533 Patentee before: HEFEI XINQI MICROELECTRONIC EQUIPMENT CO., LTD. |