CN103616801B - A kind of PCB surface ink exposes preparation method and the equipment of special high evenness light source - Google Patents
A kind of PCB surface ink exposes preparation method and the equipment of special high evenness light source Download PDFInfo
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- CN103616801B CN103616801B CN201310516897.9A CN201310516897A CN103616801B CN 103616801 B CN103616801 B CN 103616801B CN 201310516897 A CN201310516897 A CN 201310516897A CN 103616801 B CN103616801 B CN 103616801B
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Abstract
The invention discloses the preparation method that a kind of PCB surface ink exposes special high evenness light source, it comprises the steps, 1). many group UV optical modules are set, often organize UV optical module and be made up of UVLED chip, beam condensing unit; 2). array area territory, a face is set, in this array area territory, face, by parallel for described many groups UV optical module or Heterogeneous Permutation is orthogonal or approximate rectangular, forming surface array light source; 3). arrange a set of light-source control system, this system carries out brilliance control or failure monitoring to described area array light source; 4). switch on power, light-source control system is started working, described many groups UV optical module is transmitter-side hot spot respectively, control to reduce or eliminate unnecessary illumination overlapping region and light leak region between each group of adjacent UV optical module, make light source keep the high uniformity of brightness in whole range of exposures.The invention also discloses the equipment that a kind of PCB surface ink exposes special high evenness light source.
Description
Technical field
The present invention relates to the high uniformity light sources technical field of ultraviolet curing technology, optical technology, light source control technology, particularly a kind of PCB surface ink exposes preparation method and the equipment of special high evenness light source.
Background technology
In recent years along with the fast development of electronic technology, traditional mercury lamp exposure method for the solidification of PCB industry surface ink faces the challenge, although current whole PCB in China industry surface ink exposure almost all adopts traditional mercury lamp to be cured, but due to mercury lamp very power consumption itself, the pollution problem such as high temperature and release sulphuric dioxide simultaneously, is badly in need of industrial upgrading.
Current employing UVLED replaces traditional mercury lamp and brings into schedule, its efficiently energy-conservation and 50 times of serviceable lifes to mercury lamp are its maximum advantages, but for now, UVLED is adopted to exist technical immature, first be exactly uneven-brightness problem, because although traditional mercury lamp has shortcomings, the principle of mercury lamp luminescence determines that its uniformity coefficient is high, meets the requirement that PCB produces completely.And the area array light source of many UVLED compositions will be adopted to replace mercury lamp, homogeneity is great challenge, if do not solve the uniformity problems of light source, UVLED just can not obtain large-area popularization at the exposure machine of PCB industry.
Although China at present in Shenzhen, Wenzhou, the ground such as Shanghai Some Enterprises start the UVLED exposure machine developed for PCB industry and replace traditional mercury lamp exposure machine, saves energy can reach about 80%, but all can not realize spread at present, the uniformity coefficient that reason and difficult point are all embodied in light source can not reach the effect of traditional mercury lamp.These enterprises all adopt UVLED to produce circular hot spot in conjunction with optical lens, as accompanying drawing 1, shown in accompanying drawing 2, because what LED launched is circular light spot, nearly all optical lens is also all circular, therefore the hot spot designed also is circular naturally, and the large area exposure light source that multiple sphere shape light combines due to hot spot overlapping serious, the requirement of uniformity coefficient far below 85%, the welding resistance exposure requirement of least significant end can only be used for, wiring board for middle and high end exposes, because the brightness uniformity of light source is low, overexposure may be there is or leak exposure phenomenon, make the PCB circuit indentation produced, there is short circuit or open circuit hidden danger, can not use completely.
Therefore, research and develop a kind of adopt UVLED, the light source of high evenness, just become very urgent.
Summary of the invention
For the above-mentioned deficiency of prior art, the invention provides the preparation method that a kind of PCB surface ink exposes special high evenness light source, it solves the homogeneity question of light source well;
The present invention also provides enforcement PCB surface ink prepared by said method to expose special high evenness light source, and this light source can be directly installed on production line and carry out rapid curing, can replace mercury lamp pipe comprehensively, reach energy-efficient technique effect.
For achieving the above object, the technical solution used in the present invention is as follows:
PCB surface ink exposes a preparation method for special high evenness light source, and it is characterized in that, it comprises the steps:
1). many group UV optical modules are set, often organize UV optical module by UVLED chip and beam condensing unit composition;
2). array area territory, a face is set, in this array area territory, face, by parallel for described many groups UV optical module or Heterogeneous Permutation is orthogonal or approximate rectangular, forming surface array light source;
3). arrange a set of light-source control system, this system carries out brilliance control or failure monitoring to described area array light source;
4). switch on power, light-source control system is started working, described many groups UV optical module is transmitter-side hot spot respectively, control to reduce or eliminate unnecessary illumination overlapping region and light leak region between each group of adjacent UV optical module, make light source keep the high uniformity of brightness in whole range of exposures.
Described step 4) specifically comprise the following steps: under described UV optical module is placed in the irradiation distance of setting, the beams converge of UVLED chip emission is square focus spot by described beam condensing unit, is radiated at PCB surface; The edge contour of this square focus spot is by near linear or gradual change rectilinear(-al), adjacent each group of UV optical module is made to carry out permutation and combination with the near linear border of square focus spot or gradual change border, reduce or eliminate unnecessary illumination overlapping region and light leak region, forming the large area exposure light source that illumination is continuous, uniformity coefficient is high.
Described step 4) in square focus spot, its shape is square, rectangle or polygon one of square, its irradiation area edge contour is made to be a comparatively fuzzy gradual course, the composition on its border is made up of the circular arc of part by near linear, forms the boundary characteristic with near linear effect.
Described step 1) in, specifically each beam condensing unit described includes one or two above optically focused blocks; When adopting plural optically focused block, the center line of optically focused block and the center line of UVLED chip overlap, and described optically focused block is that bottom surface, front and back two is cambered surface, peripheric surface is the square of plane or polygon mirror;
Described step 4) in, the light beam that described UVLED chip sends, after beam condensing unit, makes beams converge be square focus spot.
A kind of PCB surface ink implementing above-mentioned preparation method exposes special high evenness light source, it comprises many group UV optical modules, the rectangular arrangement of this many group UV optical module, be arranged on a circuit board, composition area array light source, this UV optical module comprises UVLED chip and beam condensing unit, and described UVLED chip is arranged on below beam condensing unit, and each UVLED chip and each beam condensing unit one_to_one corresponding; The high evenness special light source of described PCB surface ink exposure also comprises a set of light-source control system, and this system carries out brilliance control and failure monitoring to described area array light source.
Described PCB surface ink exposes special high evenness light source and also comprises power supply, and this power supply connects described light-source control system and UVLED chip.
Described beam condensing unit includes one or two above optically focused blocks; When adopting plural optically focused block, the center line of optically focused block and the center line of UVLED chip overlap, and described optically focused block is that bottom surface, front and back two is cambered surface, peripheric surface is the square of plane or polygon mirror.
The invention has the advantages that: the present invention is for the circular arc border of traditional circular light spot, the near linear border of the square focus spot produced by double-deck square-lens or gradual change border, can effectively reduce or eliminate unnecessary illumination overlapping region and light leak region, thus be combined into the high large area light area of brightness uniformity; This light source adopts UVLED chip, and it is energy-conservation, efficient.
The present invention is by parallel or Heterogeneous Permutation many groups UV optical module is orthogonal or approximate rectangular, guarantee to reduce or eliminate unnecessary illumination overlapping region and light leak region between each group of adjacent UV optical module, efficiently solve the brightness uniformity sex chromosome mosaicism of light source in whole range of exposures, uniformity coefficient can reach more than 95%, is specially adapted to the solidification of high-precision PCB.
Method and apparatus provided by the invention, reliable, cost is low, stability is high, be applicable to directly installing and using on a production line, efficient, energy-conservation, automaticity is high.
Below in conjunction with drawings and Examples, the invention will be further described.
Accompanying drawing explanation
Fig. 1 is that traditional circular light spot combines overlapping schematic diagram;
Fig. 2 is traditional circular light spot combination light leak schematic diagram.
Fig. 3 is embodiment of the present invention monnolithic case structural representation;
Fig. 4 is the light path principle figure that square focus spot of the present invention is formed;
Fig. 5 is a square focus spot actual effect figure of the present invention;
Fig. 6 is multiple square focus spot actual effect figure of the present invention.
1. circuit board 2.UVLED chip 3. beam condensing unit
Optically focused block 32. times optically focused block 4. square focus spot 5. circular light spots on 31..
Embodiment
See Fig. 3 ~ Fig. 6, PCB surface ink provided by the invention exposes the preparation method of special high evenness light source, and it comprises the steps:
1). many group UV optical modules are set, often organize UV optical module and form by UVLED chip 2 and beam condensing unit 3; Beam condensing unit 3 described in each includes one or two above optically focused blocks; When adopting plural optically focused block, the center line of optically focused block and the center line of UVLED chip 2 overlap, and described optically focused block is that bottom surface, front and back two is cambered surface, peripheric surface is the square of plane or polygon mirror; When adopting two optically focused blocks, to comprise on one optically focused block 31 and once optically focused block 32, wherein descend optically focused block 32 to be arranged on the side of close UVLED chip 2, upper optically focused block 31 is arranged on the outside of lower optically focused block 32, and upper optically focused block 31 overlaps with the center line of lower optically focused block 32 and the center line of UVLED chip 2;
2). array area territory, a face is set, in this array area territory, face, by parallel for described many groups UV optical module or Heterogeneous Permutation is orthogonal or approximate rectangular, forming surface array light source;
3). arrange a set of light-source control system, this system carries out brilliance control or failure monitoring to described area array light source;
4). switch on power, light-source control system is started working, described many groups UV optical module is transmitter-side hot spot 4 respectively, control to reduce or eliminate unnecessary illumination overlapping region and light leak region between each group of adjacent UV optical module, make light source keep the high uniformity of brightness in whole range of exposures; Wherein, the light beam that described UVLED chip 2 sends after the refraction of lower optically focused block 32, then through the refraction of upper optically focused block 31, completes the conversion of pointolite to area source, makes the beams converge sent be square focus spot 4.
Described step 4) in, under specifically described UV optical module being placed in the irradiation distance of setting, the beams converge of UVLED chip emission is square focus spot 4 by described beam condensing unit 3, is radiated at PCB surface; The edge contour of this square focus spot 4 is by near linear or gradual change rectilinear(-al), adjacent each group of UV optical module is made to carry out permutation and combination with the near linear border of square focus spot 4 or gradual change border, reduce or eliminate unnecessary illumination overlapping region and light leak region, forming the large area exposure light source that illumination is continuous, uniformity coefficient is high.
Described step 4) in square focus spot 4, its shape is square, rectangle or polygon one of square, its irradiation area edge contour is made to be a comparatively fuzzy gradual course, the composition on its border is made up of the circular arc of part by near linear, forms the boundary characteristic with near linear effect.
A kind of PCB surface ink implementing above-mentioned preparation method exposes special high evenness light source, it comprises many group UV optical modules, the rectangular arrangement of this many group UV optical module, be arranged on a circuit board 1, composition area array light source, this UV optical module comprises UVLED chip 2 and beam condensing unit 3, and described UVLED chip 2 is arranged on below beam condensing unit 3, and each UVLED chip 2 and each beam condensing unit 3 one_to_one corresponding; The high evenness special light source of described PCB surface ink exposure also comprises a set of light-source control system, and this system carries out brilliance control and failure monitoring to described area array light source.Described PCB surface ink exposes special high evenness light source and also comprises power supply, and this power supply connects described light-source control system and UVLED chip 2.
Described beam condensing unit 3 comprises optically focused block 31 and lower optically focused block 32, the light beam that described UVLED chip 2 sends is after the refraction of lower optically focused block 32, again through the refraction of upper optically focused block 31, be formed with the conversion of pointolite to area source, and beams converge is square focus spot 4.
Described lower optically focused block 32 is that bottom surface, front and back two is sphere, the face of surrounding is the lens of plane; Described upper optically focused block 31 is rear bottom surface is sphere, the face of surrounding and front bottom surface are the lens of plane.
In the present embodiment, also can be other versions and array configuration see the collector lens in accompanying drawing 3, figure, the hot spot of square focus spot 4 or squarish can be produced.UVLED chip 2 is high-power UVLED chip.
Accompanying drawing 6 is the Large area light source schematic diagram of the high brightness homogeneity of square focus spot 4 assembled arrangement that many group UV optical modules are launched, with the near linear boundary edge profile of square focus spot 4 for overlapping areas combine forms.
In fig. 1, after traditional circular light spot 5 combines, whole region is covered in order to realize illumination, circular light spot 5 must be overlapping just can avoid light leak, cause the light-source brightness of overlapping region apparently higher than Non-overlapping Domain like this, effectively cannot ensure the brightness uniformity of light source in whole rectangular area.
In fig 2, after traditional circular light spot 5 combines, there is not overlapping circular light spot 5 in rectangular area, but obviously there is light leakage phenomena, and uniformity coefficient is low.
The present invention is for the circular arc border of traditional circular light spot 5, the near linear border of the square focus spot 4 formed or gradual change border, effectively reduce or eliminate unnecessary illumination overlapping region and light leak region, thus be combined into the high light source of brightness uniformity.Method and apparatus provided by the invention, reliable, cost is low, stability is high, be applicable to installing and using online.
The present invention is by parallel or Heterogeneous Permutation many groups UV optical module, guarantee to reduce or eliminate unnecessary illumination overlapping region and light leak region between each group of adjacent UV optical module, effective solution light source, at the brightness uniformity sex chromosome mosaicism of whole range of exposures, is specially adapted to the solidification of high-precision PCB.
The present invention is not limited to above-mentioned embodiment; adopt the step identical or approximate with the above embodiment of the present invention and structure; and other obtaining expose preparation method and the equipment of special high evenness light source for PCB surface ink, all within protection scope of the present invention.
Claims (7)
1. PCB surface ink exposes a preparation method for special high evenness light source, and it is characterized in that, it comprises the steps:
1). many group UV optical modules are set, often organize UV optical module by UVLED chip and beam condensing unit composition, described beam condensing unit comprises plural optically focused block, when adopting two optically focused blocks, to comprise on one optically focused block and once optically focused block, wherein descend optically focused block to be arranged on the side of close UVLED chip, upper optically focused block is arranged on the outside of lower optically focused block, and upper optically focused block overlaps with the center line of lower optically focused block and the center line of UVLED chip;
2). array area territory, a face is set, in this array area territory, face, by parallel for described many groups UV optical module or Heterogeneous Permutation is orthogonal or approximate rectangular, forming surface array light source;
3). arrange a set of light-source control system, this system carries out brilliance control or failure monitoring to described area array light source;
4). switch on power, light-source control system is started working, described many groups UV optical module is transmitter-side hot spot respectively, control to reduce or eliminate unnecessary illumination overlapping region and light leak region between each group of adjacent UV optical module, make light source keep the high uniformity of brightness in whole range of exposures.
2. PCB surface ink exposes the preparation method of special high evenness light source according to claim 1, it is characterized in that, described step 4) specifically comprise the following steps:
Under described UV optical module is placed in the irradiation distance of setting, the beams converge of UVLED chip emission is square focus spot by described beam condensing unit, is radiated at PCB surface; The edge contour of this square focus spot, by near linear or gradual change rectilinear(-al), makes adjacent each group of UV optical module carry out permutation and combination with the near linear border of square focus spot or gradual change border, reduces or eliminate unnecessary illumination overlapping region and light leak region.
3. PCB surface ink according to claim 1 exposes the preparation method of special high evenness light source, and it is characterized in that, it is further comprising the steps of:
Described step 4) in square focus spot, its shape is square, rectangle or polygon one of square, its irradiation area edge contour is made to be a comparatively fuzzy gradual course, the composition on its border is made up of the circular arc of part by near linear, forms the boundary characteristic with near linear effect.
4. PCB surface ink according to claim 3 exposes the preparation method of special high evenness light source, it is characterized in that, described step 1) in, when described beam condensing unit adopts plural optically focused block, the center line of optically focused block and the center line of UVLED chip overlap, and described optically focused block is that bottom surface, front and back two is cambered surface, peripheric surface is the square of plane or polygon mirror;
Described step 4) in, the light beam that described UVLED chip sends, after beam condensing unit, makes beams converge be square focus spot.
5. the PCB surface ink implementing the claims one of 1 ~ 4 described preparation method exposes special high evenness light source, it is characterized in that, it comprises many group UV optical modules, the rectangular arrangement of this many group UV optical module, be arranged on a circuit board, composition area array light source, this UV optical module comprises UVLED chip and beam condensing unit, described UVLED chip is arranged on below beam condensing unit, and each UVLED chip and each beam condensing unit one_to_one corresponding, when adopting two optically focused blocks, to comprise on one optically focused block and once optically focused block, optically focused block is wherein descended to be arranged on the side of close UVLED chip, upper optically focused block is arranged on the outside of lower optically focused block, upper optically focused block overlaps with the center line of lower optically focused block and the center line of UVLED chip, the high evenness special light source of described PCB surface ink exposure also comprises a set of light-source control system, and this system carries out brilliance control and failure monitoring to described area array light source.
6. PCB surface ink exposes special high evenness light source according to claim 5, and it is characterized in that, it also comprises power supply, and this power supply connects described light-source control system and UVLED chip.
7. PCB surface ink exposes special high evenness light source according to claim 5, it is characterized in that, described beam condensing unit includes plural optically focused block; The center line of described optically focused block and the center line of UVLED chip overlap, and described optically focused block is that bottom surface, front and back two is cambered surface, peripheric surface is the square of plane or polygon mirror.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310516897.9A CN103616801B (en) | 2013-10-28 | 2013-10-28 | A kind of PCB surface ink exposes preparation method and the equipment of special high evenness light source |
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| CN201310516897.9A CN103616801B (en) | 2013-10-28 | 2013-10-28 | A kind of PCB surface ink exposes preparation method and the equipment of special high evenness light source |
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| CN103616801A CN103616801A (en) | 2014-03-05 |
| CN103616801B true CN103616801B (en) | 2016-01-13 |
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| CN108286682A (en) * | 2018-02-12 | 2018-07-17 | 丁强 | Enhance the integrated module and strip-shaped light source of UVLED radiation peak intensity |
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| CN1417644A (en) * | 2001-11-05 | 2003-05-14 | 三星电子株式会社 | Object-exposing equipment and method |
| CN101174093A (en) * | 2006-11-03 | 2008-05-07 | 上海微电子装备有限公司 | Photo-etching illumination system |
| CN101477311A (en) * | 2007-12-31 | 2009-07-08 | 乐金显示有限公司 | Exposure method and exposure apparatus for photosensitive film |
| CN101866053A (en) * | 2009-04-20 | 2010-10-20 | 优志旺电机株式会社 | Integrator and light irradiation device |
| CN101936503A (en) * | 2009-06-29 | 2011-01-05 | 优志旺电机株式会社 | Integrator and light irradiating apparatus using the same |
| CN102360122A (en) * | 2011-09-30 | 2012-02-22 | 中国科学院光电技术研究所 | Fly-eye lens |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000098619A (en) * | 1998-09-22 | 2000-04-07 | Sanee Giken Kk | Light source device |
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- 2013-10-28 CN CN201310516897.9A patent/CN103616801B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1417644A (en) * | 2001-11-05 | 2003-05-14 | 三星电子株式会社 | Object-exposing equipment and method |
| CN101174093A (en) * | 2006-11-03 | 2008-05-07 | 上海微电子装备有限公司 | Photo-etching illumination system |
| CN101477311A (en) * | 2007-12-31 | 2009-07-08 | 乐金显示有限公司 | Exposure method and exposure apparatus for photosensitive film |
| CN101866053A (en) * | 2009-04-20 | 2010-10-20 | 优志旺电机株式会社 | Integrator and light irradiation device |
| CN101936503A (en) * | 2009-06-29 | 2011-01-05 | 优志旺电机株式会社 | Integrator and light irradiating apparatus using the same |
| CN102360122A (en) * | 2011-09-30 | 2012-02-22 | 中国科学院光电技术研究所 | Fly-eye lens |
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Address after: No. 333, Zhushan Zhenxing Road, Dongcheng District, Dongguan City, Guangdong Province Patentee after: Guangdong Keshi Optical Technology Co.,Ltd. Address before: 523000 Room 601, building a, Lianchuang building, Jiaowei Industrial Zone, Shaxiang, Luosha community, Guancheng, Dongguan City, Guangdong Province Patentee before: CST AUTOMATION TECHNOLOGY Co.,Ltd. |