SG11202102115YA - Fiducial-filtering automatic wafer centering process and associated system - Google Patents

Fiducial-filtering automatic wafer centering process and associated system

Info

Publication number
SG11202102115YA
SG11202102115YA SG11202102115YA SG11202102115YA SG11202102115YA SG 11202102115Y A SG11202102115Y A SG 11202102115YA SG 11202102115Y A SG11202102115Y A SG 11202102115YA SG 11202102115Y A SG11202102115Y A SG 11202102115YA SG 11202102115Y A SG11202102115Y A SG 11202102115YA
Authority
SG
Singapore
Prior art keywords
fiducial
associated system
centering process
automatic wafer
wafer centering
Prior art date
Application number
SG11202102115YA
Other languages
English (en)
Inventor
Benjamin Mooring
Damon Genetti
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG11202102115YA publication Critical patent/SG11202102115YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
SG11202102115YA 2018-09-14 2019-09-09 Fiducial-filtering automatic wafer centering process and associated system SG11202102115YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/131,692 US10790237B2 (en) 2018-09-14 2018-09-14 Fiducial-filtering automatic wafer centering process and associated system
PCT/US2019/050256 WO2020055766A1 (fr) 2018-09-14 2019-09-09 Procédé de centrage automatique de tranche à filtrage de repère et système associé

Publications (1)

Publication Number Publication Date
SG11202102115YA true SG11202102115YA (en) 2021-04-29

Family

ID=69772274

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202102115YA SG11202102115YA (en) 2018-09-14 2019-09-09 Fiducial-filtering automatic wafer centering process and associated system

Country Status (8)

Country Link
US (1) US10790237B2 (fr)
EP (1) EP3850658A4 (fr)
JP (1) JP7450609B2 (fr)
KR (1) KR20210045500A (fr)
CN (1) CN112703590A (fr)
SG (1) SG11202102115YA (fr)
TW (1) TWI825172B (fr)
WO (1) WO2020055766A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10847393B2 (en) 2018-09-04 2020-11-24 Applied Materials, Inc. Method and apparatus for measuring process kit centering
KR20210039523A (ko) * 2019-10-01 2021-04-12 삼성전자주식회사 웨이퍼 이송 장치 및 이를 이용한 웨이퍼 이송 방법
US20210375654A1 (en) * 2020-05-26 2021-12-02 Asm Ip Holding B.V. Automatic system calibration for wafer handling
CN111649701B (zh) * 2020-06-30 2021-10-29 长春博信光电子有限公司 一种复曲面镜偏心值检测方法和装置
US11942345B2 (en) * 2022-07-15 2024-03-26 Applied Materials, Inc. Automated substrate placement to chamber center

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US5706201A (en) * 1996-05-07 1998-01-06 Fortrend Engineering Corporation Software to determine the position of the center of a wafer
US6405101B1 (en) * 1998-11-17 2002-06-11 Novellus Systems, Inc. Wafer centering system and method
US6629053B1 (en) * 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
US7008802B2 (en) * 2001-05-29 2006-03-07 Asm America, Inc. Method and apparatus to correct water drift
US6990430B2 (en) * 2002-12-20 2006-01-24 Brooks Automation, Inc. System and method for on-the-fly eccentricity recognition
US8634633B2 (en) * 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
JPWO2006025386A1 (ja) * 2004-08-31 2008-05-08 株式会社ニコン 位置合わせ方法、処理システム、基板の投入再現性計測方法、位置計測方法、露光方法、基板処理装置、計測方法及び計測装置
US8545165B2 (en) * 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
US7616804B2 (en) 2006-07-11 2009-11-10 Rudolph Technologies, Inc. Wafer edge inspection and metrology
US7860601B2 (en) * 2006-12-15 2010-12-28 Quickmill, Inc. Profile characterization
JP2009088398A (ja) 2007-10-02 2009-04-23 Olympus Corp 円盤体の求心方法
JP5733437B2 (ja) 2010-08-20 2015-06-10 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及び記録媒体
US8673793B2 (en) 2011-01-25 2014-03-18 Innovalight Inc Method for automatic offset calculation for deposition of an aligned metal pattern onto selective emitter pattern and subsequent monitoring of alignment
JP6268297B2 (ja) 2013-12-31 2018-01-24 シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド シリコンウエハのプリアライメント装置及びその方法
US9734568B2 (en) 2014-02-25 2017-08-15 Kla-Tencor Corporation Automated inline inspection and metrology using shadow-gram images
CN105988305B (zh) 2015-02-28 2018-03-02 上海微电子装备（集团）股份有限公司 硅片预对准方法
US20170004987A1 (en) * 2015-06-30 2017-01-05 Kevin P. Fairbairn System and Method for Real Time Positioning of a Substrate in a Vacuum Processing System
KR101757815B1 (ko) 2015-09-25 2017-07-14 세메스 주식회사 기판 중심 검출 방법, 기판 반송 방법, 반송 유닛 및 이를 포함하는 기판 처리 장치.
JP6617963B2 (ja) * 2016-02-17 2019-12-11 株式会社Ｓｃｒｅｅｎホールディングス 基板保持状態の異常検査の検査領域の自動決定方法および基板処理装置

Also Published As

Publication number Publication date
US20200091085A1 (en) 2020-03-19
WO2020055766A1 (fr) 2020-03-19
JP2022500844A (ja) 2022-01-04
CN112703590A (zh) 2021-04-23
TW202027185A (zh) 2020-07-16
JP7450609B2 (ja) 2024-03-15
US10790237B2 (en) 2020-09-29
EP3850658A1 (fr) 2021-07-21
TWI825172B (zh) 2023-12-11
EP3850658A4 (fr) 2022-07-20
KR20210045500A (ko) 2021-04-26

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