SG11202101938QA - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- SG11202101938QA SG11202101938QA SG11202101938QA SG11202101938QA SG11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA SG 11202101938Q A SG11202101938Q A SG 11202101938QA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- epoxy resin
- epoxy
- composition
- resin
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18197295 | 2018-09-27 | ||
| PCT/EP2019/076010 WO2020064916A1 (en) | 2018-09-27 | 2019-09-26 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202101938QA true SG11202101938QA (en) | 2021-04-29 |
Family
ID=63896026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202101938QA SG11202101938QA (en) | 2018-09-27 | 2019-09-26 | Epoxy resin composition |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20210395513A1 (he) |
| EP (1) | EP3856840B1 (he) |
| JP (1) | JP7467431B2 (he) |
| KR (1) | KR20210064206A (he) |
| CN (1) | CN112839995A (he) |
| IL (1) | IL281713A (he) |
| SG (1) | SG11202101938QA (he) |
| WO (1) | WO2020064916A1 (he) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113614144B (zh) * | 2019-03-22 | 2023-03-28 | 三菱瓦斯化学株式会社 | 聚碳酸酯共聚物和聚硅氧烷化合物的制造方法、聚碳酸酯共聚物、聚硅氧烷化合物、组合物以及成型体 |
| CN111333673A (zh) * | 2020-04-26 | 2020-06-26 | 扬州天启新材料股份有限公司 | 一种嵌段链接的改性六氟双酚a型氰酸酯 |
| CN114874159B (zh) * | 2022-04-15 | 2023-09-29 | 西安瑞联新材料股份有限公司 | 脂肪族环氧化合物及其组合物与应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2620290B2 (ja) * | 1988-03-11 | 1997-06-11 | 旭電化工業株式会社 | シリルオキシ基を有するアリールエーテル化合物の製造法 |
| US5041514A (en) * | 1989-05-18 | 1991-08-20 | General Electric Company | Polymeric reaction products of biphenols and organosilicon materials and method for making |
| JPH0386716A (ja) | 1989-08-31 | 1991-04-11 | Toray Dow Corning Silicone Co Ltd | シリコーン樹脂で変性されたフェノール樹脂の製造方法 |
| DE4129000A1 (de) * | 1991-08-31 | 1993-03-04 | Hoechst Ag | Haertbare pulverfoermige mischungen auf basis von polyarylensiloxanen |
| JP3596630B2 (ja) * | 1995-02-28 | 2004-12-02 | 大日本インキ化学工業株式会社 | 硬化性エポキシ樹脂組成物 |
| DE60019046T2 (de) | 1999-01-29 | 2006-02-02 | Arakawa Chemical Industries, Ltd. | Härter für epoxidharze, epoxidharzzusammensetzung und verfahren zur herstellung von silan-modifiziertem phenolharz |
| JP4463908B2 (ja) | 1999-09-17 | 2010-05-19 | 日本曹達株式会社 | 新規ｏ−シリル化フェノール誘導体を成分化合物とするエポキシ樹脂硬化組成物 |
| JP2002105284A (ja) * | 2000-10-02 | 2002-04-10 | Teijin Chem Ltd | 難燃性エポキシ樹脂組成物およびこれを用いた積層板 |
| JP4821059B2 (ja) | 2001-06-29 | 2011-11-24 | 日立化成工業株式会社 | 樹脂組成物ならびにそれを用いた難燃性の積層板および印刷配線板 |
| JP4407885B2 (ja) * | 2003-04-08 | 2010-02-03 | エア・ウォーター株式会社 | フェノキシシラン化合物、その製法、並びにそれを含むエポキシ樹脂組成物及びその硬化物 |
| JP2006096838A (ja) * | 2004-09-29 | 2006-04-13 | Air Water Chemical Inc | エポキシ樹脂の硬化剤、その組成物及びその用途 |
| TWI506082B (zh) | 2009-11-26 | 2015-11-01 | Ajinomoto Kk | Epoxy resin composition |
| CN102985485B (zh) * | 2010-07-02 | 2014-09-03 | Dic株式会社 | 热固性树脂组合物、其固化物、活性酯树脂、半导体密封材料、预浸料、电路基板、及积层薄膜 |
| JP5234229B1 (ja) | 2011-05-27 | 2013-07-10 | 味の素株式会社 | 樹脂組成物 |
| KR101664948B1 (ko) | 2014-01-09 | 2016-10-13 | 한국생산기술연구원 | 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도 |
-
2019
- 2019-09-26 SG SG11202101938QA patent/SG11202101938QA/en unknown
- 2019-09-26 WO PCT/EP2019/076010 patent/WO2020064916A1/en unknown
- 2019-09-26 CN CN201980063568.9A patent/CN112839995A/zh active Pending
- 2019-09-26 US US17/281,230 patent/US20210395513A1/en not_active Abandoned
- 2019-09-26 JP JP2021517594A patent/JP7467431B2/ja active Active
- 2019-09-26 KR KR1020217008057A patent/KR20210064206A/ko unknown
- 2019-09-26 EP EP19773109.4A patent/EP3856840B1/en active Active
-
2021
- 2021-03-22 IL IL281713A patent/IL281713A/he unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210064206A (ko) | 2021-06-02 |
| EP3856840B1 (en) | 2024-08-21 |
| TW202014447A (zh) | 2020-04-16 |
| JP7467431B2 (ja) | 2024-04-15 |
| CN112839995A (zh) | 2021-05-25 |
| US20210395513A1 (en) | 2021-12-23 |
| WO2020064916A1 (en) | 2020-04-02 |
| EP3856840A1 (en) | 2021-08-04 |
| IL281713A (he) | 2021-05-31 |
| JP2022512567A (ja) | 2022-02-07 |
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