SG11202012566RA - Liquid composition for forming knn film and method for forming knn film using said liquid composition - Google Patents
Liquid composition for forming knn film and method for forming knn film using said liquid compositionInfo
- Publication number
- SG11202012566RA SG11202012566RA SG11202012566RA SG11202012566RA SG11202012566RA SG 11202012566R A SG11202012566R A SG 11202012566RA SG 11202012566R A SG11202012566R A SG 11202012566RA SG 11202012566R A SG11202012566R A SG 11202012566RA SG 11202012566R A SG11202012566R A SG 11202012566RA
- Authority
- SG
- Singapore
- Prior art keywords
- liquid composition
- knn film
- forming
- forming knn
- film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G33/00—Compounds of niobium
- C01G33/006—Compounds containing, besides niobium, two or more other elements, with the exception of oxygen or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/092—Forming composite materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018118737A JP7192262B2 (ja) | 2018-06-22 | 2018-06-22 | Ｋｎｎ膜形成用液組成物及びこの液組成物を用いたｋｎｎ膜の形成方法 |
| PCT/JP2019/022748 WO2019244673A1 (ja) | 2018-06-22 | 2019-06-07 | Ｋｎｎ膜形成用液組成物及びこの液組成物を用いたｋｎｎ膜の形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202012566RA true SG11202012566RA (en) | 2021-02-25 |
Family
ID=68983944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202012566RA SG11202012566RA (en) | 2018-06-22 | 2019-06-07 | Liquid composition for forming knn film and method for forming knn film using said liquid composition |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20210188657A1 (ko) |
| EP (1) | EP3813131A4 (ko) |
| JP (1) | JP7192262B2 (ko) |
| KR (1) | KR20210020902A (ko) |
| CN (1) | CN112335062A (ko) |
| SG (1) | SG11202012566RA (ko) |
| TW (1) | TW202000986A (ko) |
| WO (1) | WO2019244673A1 (ko) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2445917C (en) * | 2002-10-28 | 2011-08-02 | Nof Corporation | Organic acid metal salt and coating liquid containing the same for forming a metal oxide film |
| TW200616634A (en) * | 2004-10-01 | 2006-06-01 | Bristol Myers Squibb Co | Crystalline forms and process for preparing spiro-hydantoin compounds |
| JP5526591B2 (ja) | 2009-01-20 | 2014-06-18 | 三菱マテリアル株式会社 | 強誘電体薄膜形成用組成物、強誘電体薄膜の形成方法並びに該方法により形成された強誘電体薄膜 |
| JP5812243B2 (ja) * | 2010-12-09 | 2015-11-11 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、圧電素子、超音波デバイス及びｉｒセンサー |
| JP2012139919A (ja) | 2010-12-28 | 2012-07-26 | Seiko Epson Corp | 液体噴射ヘッドの製造方法、液体噴射装置、及び圧電素子の製造方法 |
| JP2012169467A (ja) | 2011-02-15 | 2012-09-06 | Seiko Epson Corp | 圧電セラミックス膜形成用組成物、圧電素子の製造方法及び液体噴射ヘッドの製造方法 |
| JP5828293B2 (ja) | 2011-05-17 | 2015-12-02 | 三菱マテリアル株式会社 | Ｐｚｔ強誘電体薄膜の製造方法 |
| US9358925B2 (en) | 2013-10-23 | 2016-06-07 | Jtekt Corporation | Warning device for vehicle |
| JP2018082051A (ja) * | 2016-11-16 | 2018-05-24 | セイコーエプソン株式会社 | 圧電素子及び圧電素子応用デバイス |
| JP6790749B2 (ja) * | 2016-11-16 | 2020-11-25 | セイコーエプソン株式会社 | 圧電素子及び圧電素子応用デバイス |
-
2018
- 2018-06-22 JP JP2018118737A patent/JP7192262B2/ja active Active
-
2019
- 2019-06-07 KR KR1020207035675A patent/KR20210020902A/ko not_active Application Discontinuation
- 2019-06-07 EP EP19822480.0A patent/EP3813131A4/en not_active Withdrawn
- 2019-06-07 CN CN201980039936.6A patent/CN112335062A/zh active Pending
- 2019-06-07 US US17/252,432 patent/US20210188657A1/en not_active Abandoned
- 2019-06-07 WO PCT/JP2019/022748 patent/WO2019244673A1/ja active Application Filing
- 2019-06-07 SG SG11202012566RA patent/SG11202012566RA/en unknown
- 2019-06-13 TW TW108120447A patent/TW202000986A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7192262B2 (ja) | 2022-12-20 |
| JP2019220638A (ja) | 2019-12-26 |
| TW202000986A (zh) | 2020-01-01 |
| EP3813131A1 (en) | 2021-04-28 |
| WO2019244673A1 (ja) | 2019-12-26 |
| EP3813131A4 (en) | 2022-03-23 |
| US20210188657A1 (en) | 2021-06-24 |
| KR20210020902A (ko) | 2021-02-24 |
| CN112335062A (zh) | 2021-02-05 |
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