SG11202009528QA - Method for manufacturing a monocrystalline layer of diamond or iridium material, and substrate for epitaxically growing a monocrystalline layer of diamond or iridium material - Google Patents

Method for manufacturing a monocrystalline layer of diamond or iridium material, and substrate for epitaxically growing a monocrystalline layer of diamond or iridium material

Info

Publication number
SG11202009528QA
SG11202009528QA SG11202009528QA SG11202009528QA SG11202009528QA SG 11202009528Q A SG11202009528Q A SG 11202009528QA SG 11202009528Q A SG11202009528Q A SG 11202009528QA SG 11202009528Q A SG11202009528Q A SG 11202009528QA SG 11202009528Q A SG11202009528Q A SG 11202009528QA
Authority
SG
Singapore
Prior art keywords
diamond
monocrystalline layer
iridium material
epitaxically
growing
Prior art date
Application number
SG11202009528QA
Other languages
English (en)
Inventor
Bruno Ghyselen
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11202009528QA publication Critical patent/SG11202009528QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/025—Epitaxial-layer growth characterised by the substrate
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/04—Diamond
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG11202009528QA 2018-03-28 2019-03-26 Method for manufacturing a monocrystalline layer of diamond or iridium material, and substrate for epitaxically growing a monocrystalline layer of diamond or iridium material SG11202009528QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1800255A FR3079535B1 (fr) 2018-03-28 2018-03-28 Procede de fabrication d'une couche monocristalline de materiau diamant ou iridium et substrat pour croissance par epitaxie d'une couche monocristalline de materiau diamant ou iridium
PCT/IB2019/000196 WO2019186262A1 (fr) 2018-03-28 2019-03-26 Procédé de fabrication d'une couche monocristalline de matériau diamant ou iridium et substrat pour croissance par épitaxie d'une couche monocristalline de matériau diamant ou iridium

Publications (1)

Publication Number Publication Date
SG11202009528QA true SG11202009528QA (en) 2020-10-29

Family

ID=63079954

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202009528QA SG11202009528QA (en) 2018-03-28 2019-03-26 Method for manufacturing a monocrystalline layer of diamond or iridium material, and substrate for epitaxically growing a monocrystalline layer of diamond or iridium material

Country Status (8)

Country Link
US (1) US11935743B2 (ja)
EP (1) EP3775329A1 (ja)
JP (1) JP7408893B2 (ja)
KR (1) KR102654904B1 (ja)
CN (1) CN111936676A (ja)
FR (1) FR3079535B1 (ja)
SG (1) SG11202009528QA (ja)
WO (1) WO2019186262A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3079531B1 (fr) * 2018-03-28 2022-03-18 Soitec Silicon On Insulator Procede de fabrication d'une couche monocristalline de materiau pzt et substrat pour croissance par epitaxie d'une couche monocristalline de materiau pzt
CN113373512B (zh) * 2021-05-24 2022-02-11 北京科技大学 基于铱-石墨烯结构化缓冲层的单晶金刚石外延生长方法
CN113832541B (zh) * 2021-09-29 2024-02-09 太原理工大学 用于外延生长大尺寸单晶金刚石的复合衬底的制备方法
JP2023116122A (ja) * 2022-02-09 2023-08-22 信越化学工業株式会社 下地基板及び単結晶ダイヤモンド積層基板並びにそれらの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124125A (ja) 2000-10-17 2002-04-26 Masaru Hiyamizu 照明器具つき屏風と衝立
US8507361B2 (en) 2000-11-27 2013-08-13 Soitec Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US6562127B1 (en) * 2002-01-16 2003-05-13 The United States Of America As Represented By The Secretary Of The Navy Method of making mosaic array of thin semiconductor material of large substrates
JP4016102B2 (ja) * 2003-01-17 2007-12-05 独立行政法人産業技術総合研究所 パルスレーザ蒸着によるダイアモンドの結晶薄膜の作製方法及び同方法で作製した薄膜
DE10320133B4 (de) 2003-05-06 2011-02-10 Universität Augsburg Verfahren zur Herstellung von einkristallinen oder quasi-einkristallinen Diamantschichten und auf einem Körper angeordnete einkristalline oder quasi-einkristalline Diamantschicht
JP5468528B2 (ja) 2010-06-28 2014-04-09 信越化学工業株式会社 単結晶ダイヤモンド成長用基材及びその製造方法並びに単結晶ダイヤモンド基板の製造方法
US9064789B2 (en) * 2013-08-12 2015-06-23 International Business Machines Corporation Bonded epitaxial oxide structures for compound semiconductor on silicon substrates
US10304739B2 (en) 2015-01-16 2019-05-28 Sumitomo Electric Industries, Ltd. Method for manufacturing semiconductor substrate, semiconductor substrate, method for manufacturing combined semiconductor substrate, combined semiconductor substrate, and semiconductor-joined substrate
JP7017299B2 (ja) * 2015-07-30 2022-02-08 信越化学工業株式会社 ダイヤモンド電子素子及びダイヤモンド電子素子の製造方法
CN107268076A (zh) * 2017-07-28 2017-10-20 西安交通大学 一种基于异质外延生长单晶金刚石的方法

Also Published As

Publication number Publication date
JP2021518322A (ja) 2021-08-02
US11935743B2 (en) 2024-03-19
WO2019186262A1 (fr) 2019-10-03
FR3079535A1 (fr) 2019-10-04
KR20200136437A (ko) 2020-12-07
EP3775329A1 (fr) 2021-02-17
KR102654904B1 (ko) 2024-04-04
US20210020434A1 (en) 2021-01-21
FR3079535B1 (fr) 2022-03-18
JP7408893B2 (ja) 2024-01-09
CN111936676A (zh) 2020-11-13

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