SG11202008822YA - Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device - Google Patents

Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

Info

Publication number
SG11202008822YA
SG11202008822YA SG11202008822YA SG11202008822YA SG11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA
Authority
SG
Singapore
Prior art keywords
micromechanical device
producing
optical windows
inclined optical
micromechanical
Prior art date
Application number
SG11202008822YA
Other languages
English (en)
Inventor
Benjamin Steuer
Stefan Pinter
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of SG11202008822YA publication Critical patent/SG11202008822YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/05—Aligning components to be assembled
    • B81C2203/052—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
    • B81C2203/054—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
SG11202008822YA 2018-05-09 2019-03-07 Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device SG11202008822YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018207201.9A DE102018207201A1 (de) 2018-05-09 2018-05-09 Herstellungsverfahren für eine mikromechanische Vorrichtung mit geneigten optischen Fenstern und entsprechende mikromechanische Vorrichtung
PCT/EP2019/055747 WO2019214867A1 (de) 2018-05-09 2019-03-07 Herstellungsverfahren für eine mikromechanische vorrichtung mit geneigten optischen fenstern und entsprechende mikromechanische vorrichtung

Publications (1)

Publication Number Publication Date
SG11202008822YA true SG11202008822YA (en) 2020-10-29

Family

ID=65724406

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008822YA SG11202008822YA (en) 2018-05-09 2019-03-07 Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

Country Status (7)

Country Link
US (1) US11584640B2 (zh)
JP (1) JP7098755B2 (zh)
CN (1) CN112105580B (zh)
DE (1) DE102018207201A1 (zh)
SG (1) SG11202008822YA (zh)
TW (1) TWI825093B (zh)
WO (1) WO2019214867A1 (zh)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2275845B1 (en) 2000-01-28 2017-04-26 Seiko Epson Corporation Optical reflection polarizer
US7303645B2 (en) * 2003-10-24 2007-12-04 Miradia Inc. Method and system for hermetically sealing packages for optics
KR100707179B1 (ko) 2005-02-07 2007-04-13 삼성전자주식회사 광스캐너 패키지 및 그 제조방법
KR100667291B1 (ko) 2005-07-27 2007-01-12 삼성전자주식회사 마이크로 미러 소자 패키지 및 그 제조방법
DE102008012826B4 (de) * 2007-04-02 2012-11-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erzeugung einer dreidimensionalen mikromechanischen Struktur aus zweidimensionalen Elementen und mikromechanisches Bauelement
DE102008040528B4 (de) 2008-07-18 2018-11-08 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauteil und ein mikromechanisches Bauteil
DE102010062009B4 (de) 2010-11-26 2019-07-04 Robert Bosch Gmbh Verfahren zum Herstellen von Schrägflächen in einem Substrat und Wafer mit Schrägfläche
DE102010062118B4 (de) 2010-11-29 2018-09-27 Robert Bosch Gmbh Herstellungsverfahren für eine Abdeckvorrichtung für ein mikro-opto-mechanisches Bauteil
DE102012206858B4 (de) 2012-04-25 2021-05-20 Robert Bosch Gmbh Verfahren zum Herstellen einer optischen Fenstervorrichtung für eine MEMS-Vorrichtung
DE102013211886A1 (de) 2013-06-24 2014-12-24 Robert Bosch Gmbh Fensterbestückte Abdeckung für eine optische Vorrichtung und Herstellungsverfahren zum Herstellen einer fensterbestückten Abdeckung für eine optische Vorrichtung
DE102014202830B4 (de) * 2014-02-17 2022-10-06 Robert Bosch Gmbh Herstellungsverfahren für einen mit transparenten Platten bestückten Wafer
US9850124B2 (en) * 2015-10-27 2017-12-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package for reducing parasitic light and method of manufacturing the same
DE102016105440A1 (de) * 2016-03-23 2017-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Komponenten unter Verwendung von Funktionselementen
DE102016216918A1 (de) * 2016-09-07 2018-03-08 Robert Bosch Gmbh Herstellungsverfahren für eine mikromechanische Vorrichtung mit einem geneigten optischen Fenster und entsprechende mikromechanische Vorrichtung
DE102018211548A1 (de) * 2018-07-11 2020-01-16 Robert Bosch Gmbh Herstellungsverfahren für eine mikromechanische Vorrichtung mit geneigten optischen Fenstern und mikromechanische Vorrichtung mit geneigten optischen Fenstern

Also Published As

Publication number Publication date
JP7098755B2 (ja) 2022-07-11
CN112105580A (zh) 2020-12-18
DE102018207201A1 (de) 2019-11-14
TWI825093B (zh) 2023-12-11
WO2019214867A1 (de) 2019-11-14
US20200391998A1 (en) 2020-12-17
US11584640B2 (en) 2023-02-21
TW201946864A (zh) 2019-12-16
JP2021523024A (ja) 2021-09-02
CN112105580B (zh) 2024-04-16

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