SG11202008822YA - Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device - Google Patents

Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

Info

Publication number
SG11202008822YA
SG11202008822YA SG11202008822YA SG11202008822YA SG11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA SG 11202008822Y A SG11202008822Y A SG 11202008822YA
Authority
SG
Singapore
Prior art keywords
micromechanical device
producing
optical windows
inclined optical
micromechanical
Prior art date
Application number
SG11202008822YA
Inventor
Benjamin Steuer
Stefan Pinter
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of SG11202008822YA publication Critical patent/SG11202008822YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0067—Packages or encapsulation for controlling the passage of optical signals through the package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/05—Aligning components to be assembled
    • B81C2203/052—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
    • B81C2203/054—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus using structural alignment aids, e.g. spacers, interposers, male/female parts, rods or balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
SG11202008822YA 2018-05-09 2019-03-07 Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device SG11202008822YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018207201.9A DE102018207201A1 (en) 2018-05-09 2018-05-09 Manufacturing method for a micromechanical device with inclined optical windows and corresponding micromechanical device
PCT/EP2019/055747 WO2019214867A1 (en) 2018-05-09 2019-03-07 Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

Publications (1)

Publication Number Publication Date
SG11202008822YA true SG11202008822YA (en) 2020-10-29

Family

ID=65724406

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008822YA SG11202008822YA (en) 2018-05-09 2019-03-07 Method for producing a micromechanical device having inclined optical windows, and corresponding micromechanical device

Country Status (7)

Country Link
US (1) US11584640B2 (en)
JP (1) JP7098755B2 (en)
CN (1) CN112105580B (en)
DE (1) DE102018207201A1 (en)
SG (1) SG11202008822YA (en)
TW (1) TWI825093B (en)
WO (1) WO2019214867A1 (en)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1180711A4 (en) 2000-01-28 2005-10-12 Seiko Epson Corp Optical reflection polarizer and projector comprising the same
US7303645B2 (en) * 2003-10-24 2007-12-04 Miradia Inc. Method and system for hermetically sealing packages for optics
KR100707179B1 (en) 2005-02-07 2007-04-13 삼성전자주식회사 Optical scanner package and method for manufacturing the same
KR100667291B1 (en) 2005-07-27 2007-01-12 삼성전자주식회사 Micro-mirror device package and process for fabricating thereof
DE102008012826B4 (en) * 2007-04-02 2012-11-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a three-dimensional micromechanical structure from two-dimensional elements and micromechanical component
DE102008040528B4 (en) 2008-07-18 2018-11-08 Robert Bosch Gmbh Manufacturing method for a micromechanical component and a micromechanical component
DE102010062009B4 (en) * 2010-11-26 2019-07-04 Robert Bosch Gmbh Method for producing inclined surfaces in a substrate and wafer with inclined surface
DE102010062118B4 (en) 2010-11-29 2018-09-27 Robert Bosch Gmbh Manufacturing method for a covering device for a micro-opto-mechanical component
DE102012206858B4 (en) 2012-04-25 2021-05-20 Robert Bosch Gmbh A method of making an optical window device for a MEMS device
DE102013211886A1 (en) 2013-06-24 2014-12-24 Robert Bosch Gmbh A window-mounted optical device cover and a manufacturing method of manufacturing a window-mounted optical device cover
DE102014202830B4 (en) 2014-02-17 2022-10-06 Robert Bosch Gmbh Manufacturing process for a wafer equipped with transparent plates
US9850124B2 (en) * 2015-10-27 2017-12-26 Advanced Semiconductor Engineering, Inc. Semiconductor device package for reducing parasitic light and method of manufacturing the same
DE102016105440A1 (en) * 2016-03-23 2017-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for producing optical components using functional elements
DE102016216918A1 (en) * 2016-09-07 2018-03-08 Robert Bosch Gmbh Manufacturing method for a micromechanical device with a tilted optical window and corresponding micromechanical device
DE102018211548A1 (en) * 2018-07-11 2020-01-16 Robert Bosch Gmbh Manufacturing method for a micromechanical device with inclined optical windows and a micromechanical device with inclined optical windows

Also Published As

Publication number Publication date
WO2019214867A1 (en) 2019-11-14
TWI825093B (en) 2023-12-11
DE102018207201A1 (en) 2019-11-14
TW201946864A (en) 2019-12-16
CN112105580A (en) 2020-12-18
JP7098755B2 (en) 2022-07-11
US20200391998A1 (en) 2020-12-17
JP2021523024A (en) 2021-09-02
US11584640B2 (en) 2023-02-21
CN112105580B (en) 2024-04-16

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