SG11202006955SA - Electroconductive adhesive composition, cured product of electroconductive adhesive, and electronic device - Google Patents
Electroconductive adhesive composition, cured product of electroconductive adhesive, and electronic deviceInfo
- Publication number
- SG11202006955SA SG11202006955SA SG11202006955SA SG11202006955SA SG11202006955SA SG 11202006955S A SG11202006955S A SG 11202006955SA SG 11202006955S A SG11202006955S A SG 11202006955SA SG 11202006955S A SG11202006955S A SG 11202006955SA SG 11202006955S A SG11202006955S A SG 11202006955SA
- Authority
- SG
- Singapore
- Prior art keywords
- electroconductive adhesive
- electronic device
- cured product
- adhesive composition
- electroconductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/092—Polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018009115A JP6584543B2 (ja) | 2018-01-23 | 2018-01-23 | 導電性接着剤組成物 |
PCT/JP2019/001884 WO2019146599A1 (ja) | 2018-01-23 | 2019-01-22 | 導電性接着剤組成物、導電性接着剤硬化物、及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202006955SA true SG11202006955SA (en) | 2020-08-28 |
Family
ID=67394654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202006955SA SG11202006955SA (en) | 2018-01-23 | 2019-01-22 | Electroconductive adhesive composition, cured product of electroconductive adhesive, and electronic device |
Country Status (8)
Country | Link |
---|---|
US (1) | US20210040357A1 (ja) |
JP (1) | JP6584543B2 (ja) |
KR (1) | KR102397224B1 (ja) |
CN (1) | CN111655815B (ja) |
DE (1) | DE112019000487T5 (ja) |
MY (1) | MY196342A (ja) |
SG (1) | SG11202006955SA (ja) |
WO (1) | WO2019146599A1 (ja) |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3222950B2 (ja) * | 1992-10-26 | 2001-10-29 | 旭化成株式会社 | 強固なはんだ付け可能な導電性ペースト |
JP2004179139A (ja) * | 2002-09-30 | 2004-06-24 | Sumitomo Osaka Cement Co Ltd | 導電性粒子とそれを含有する導電性接着材料及び透明導電膜形成用塗料及びそれを用いた透明導電膜並びに表示装置 |
JP2006073812A (ja) * | 2004-09-02 | 2006-03-16 | Kyocera Chemical Corp | ダイボンディングペースト |
JP5342453B2 (ja) * | 2007-11-28 | 2013-11-13 | パナソニック株式会社 | 導電性ペーストおよびこれを用いた電気電子機器 |
JP2010267579A (ja) | 2009-05-18 | 2010-11-25 | Mitsubishi Electric Corp | 導電性接着剤およびこれを用いた半導体装置の製造方法並びに半導体装置 |
JP2012188465A (ja) * | 2011-03-08 | 2012-10-04 | Hitachi Chemical Co Ltd | 樹脂ペースト組成物及び半導体装置 |
JP2013149774A (ja) * | 2012-01-19 | 2013-08-01 | Sekisui Chem Co Ltd | 異方性導電材料、接続構造体及び接続構造体の製造方法 |
JP2013206765A (ja) | 2012-03-29 | 2013-10-07 | Tanaka Kikinzoku Kogyo Kk | ダイボンド用導電性ペースト及び該導電性ペーストによるダイボンド方法 |
JP2014053484A (ja) | 2012-09-07 | 2014-03-20 | Hitachi Chemical Co Ltd | 研磨液、スラリ及び研磨方法 |
JP6033734B2 (ja) * | 2013-04-30 | 2016-11-30 | 日東電工株式会社 | フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法 |
CN105452414B (zh) * | 2013-08-06 | 2017-05-17 | 千住金属工业株式会社 | 导电性粘接剂、接合体和接头 |
JP6247059B2 (ja) * | 2013-09-05 | 2017-12-13 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
JP5806760B1 (ja) * | 2014-05-29 | 2015-11-10 | 田中貴金属工業株式会社 | 熱伝導性導電性接着剤組成物 |
JP6091019B2 (ja) * | 2015-02-02 | 2017-03-08 | 田中貴金属工業株式会社 | 熱伝導性導電性接着剤組成物 |
MY190140A (en) * | 2015-04-16 | 2022-03-30 | Furukawa Electric Co Ltd | Electrically conductive adhesive film and dicing die bonding film |
JP6563700B2 (ja) * | 2015-06-10 | 2019-08-21 | 京セラ株式会社 | 半導体接着用樹脂組成物、半導体接着用シート及びそれを用いた半導体装置 |
JP6919117B2 (ja) * | 2015-12-15 | 2021-08-18 | 三菱ケミカル株式会社 | 鉄化合物含有組成物の粒子、鉄化合物の変色抑制方法、並びに鉄化合物及びビタミンc含有組成物 |
JP2017203109A (ja) * | 2016-05-11 | 2017-11-16 | パナソニックIpマネジメント株式会社 | 導電性粒子を含む樹脂組成物およびその樹脂組成物を含む電子装置 |
JP2019087396A (ja) * | 2017-11-07 | 2019-06-06 | 三菱マテリアル株式会社 | 銀ペースト、接合体及び接合体の製造方法 |
-
2018
- 2018-01-23 JP JP2018009115A patent/JP6584543B2/ja active Active
-
2019
- 2019-01-22 MY MYPI2020003759A patent/MY196342A/en unknown
- 2019-01-22 WO PCT/JP2019/001884 patent/WO2019146599A1/ja active Application Filing
- 2019-01-22 CN CN201980009210.8A patent/CN111655815B/zh active Active
- 2019-01-22 DE DE112019000487.5T patent/DE112019000487T5/de active Pending
- 2019-01-22 KR KR1020207021150A patent/KR102397224B1/ko active IP Right Grant
- 2019-01-22 US US16/963,922 patent/US20210040357A1/en not_active Abandoned
- 2019-01-22 SG SG11202006955SA patent/SG11202006955SA/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102397224B1 (ko) | 2022-05-12 |
JP6584543B2 (ja) | 2019-10-02 |
CN111655815A (zh) | 2020-09-11 |
JP2019127520A (ja) | 2019-08-01 |
KR20200093678A (ko) | 2020-08-05 |
WO2019146599A1 (ja) | 2019-08-01 |
MY196342A (en) | 2023-03-24 |
US20210040357A1 (en) | 2021-02-11 |
CN111655815B (zh) | 2022-08-02 |
DE112019000487T5 (de) | 2020-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3709609A4 (en) | ELECTRONIC DEVICE INCLUDING A FLEXIBLE DISPLAY, AND AN ELECTRONIC COMPONENT ARRANGEMENT STRUCTURE APPLIED THEREOF | |
EP3165549A4 (en) | Epoxy resin composition for electronic material, cured product thereof and electronic member | |
EP3636723A4 (en) | UV CURABLE SILICONE ADHESIVE COMPOSITION AND CURED OBJECT RECEIVED THEREFORE | |
EP3235874A4 (en) | Fluoroalkyl group-containing curable organopolysiloxane composition, cured product of same, and electronic component and display device each of which is provided with said cured product | |
EP3689995A4 (en) | UV CURABLE SILICONE ADHESIVE COMPOSITION AND CURED PRODUCT THEREOF | |
SG11201706068QA (en) | Resin, photosensitive resin composition, and electronic component and display device each using same | |
EP3668109A4 (en) | MICROPHONE COMPONENT AND ELECTRONIC DEVICE | |
EP3121651A4 (en) | Radiation-sensitive resin composition and electronic component | |
EP3132493A4 (en) | Electronic device and antenna using components of electronic device | |
SG11202000229WA (en) | Electroconductive adhesive composition | |
EP3039505A4 (en) | Wearable electronic devices and components thereof | |
EP3868835A4 (en) | TWO-COMPONENT HARDENABLE COMPOSITION KIT, THERMOCONDUCTIVE CURED PRODUCT, AND ELECTRONIC DEVICE | |
EP3431552A4 (en) | ADDITION-CURABLE SILICONE RUBBER COMPOSITION AND CURED PRODUCT | |
SG11202012017VA (en) | Curable resin composition and electronic component device | |
EP3149804A4 (en) | Electronic device and antenna of the same | |
SG11202008948UA (en) | Electroconductive adhesive composition | |
EP3778657A4 (en) | HARDENABLE COMPOSITION, HARDENED PRODUCT THEREOF, AND ELECTRONIC COMPONENT INCLUDING THIS HARDENED PRODUCT | |
EP3309219A4 (en) | Addition-curable silicone rubber composition and cured product | |
EP3121652A4 (en) | Radiation-sensitive resin composition and electronic component | |
EP3666828A4 (en) | ADDITION HARDENABLE SILICONE COMPOSITION AND HARDENED SILICONE RUBBER | |
EP3722091A4 (en) | LAMINATE AND ELECTRONIC DEVICE | |
SG11202006816YA (en) | Conductive adhesive and cured product thereof | |
EP3285134A4 (en) | Component and electronic device | |
EP3747933C0 (en) | RESIN COMPOSITION AND CURED MATERIAL THEREOF, ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT | |
IL250305A0 (en) | Electronic component with flexible terminal |