SG11202006417XA - Sputtering target and magnetic film - Google Patents
Sputtering target and magnetic filmInfo
- Publication number
- SG11202006417XA SG11202006417XA SG11202006417XA SG11202006417XA SG11202006417XA SG 11202006417X A SG11202006417X A SG 11202006417XA SG 11202006417X A SG11202006417X A SG 11202006417XA SG 11202006417X A SG11202006417X A SG 11202006417XA SG 11202006417X A SG11202006417X A SG 11202006417XA
- Authority
- SG
- Singapore
- Prior art keywords
- sputtering target
- magnetic film
- magnetic
- film
- sputtering
- Prior art date
Links
- 238000005477 sputtering target Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0433—Nickel- or cobalt-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/07—Alloys based on nickel or cobalt based on cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/06—Alloys based on chromium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/64—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent
- G11B5/65—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition
- G11B5/658—Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition containing oxygen, e.g. molecular oxygen or magnetic oxide
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/16—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing cobalt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
- H01F41/183—Sputtering targets therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2201/00—Treatment under specific atmosphere
- B22F2201/20—Use of vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1017—Multiple heating or additional steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Magnetic Record Carriers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018150676 | 2018-08-09 | ||
PCT/JP2019/020558 WO2020031461A1 (en) | 2018-08-09 | 2019-05-23 | Sputtering target and magnetic film |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202006417XA true SG11202006417XA (en) | 2020-08-28 |
Family
ID=69414658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202006417XA SG11202006417XA (en) | 2018-08-09 | 2019-05-23 | Sputtering target and magnetic film |
Country Status (6)
Country | Link |
---|---|
US (1) | US11894221B2 (en) |
JP (1) | JP7153729B2 (en) |
CN (1) | CN111566253B (en) |
SG (1) | SG11202006417XA (en) |
TW (1) | TWI727322B (en) |
WO (1) | WO2020031461A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI727322B (en) * | 2018-08-09 | 2021-05-11 | 日商Jx金屬股份有限公司 | Sputtering target and magnetic film |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60228637A (en) | 1984-04-25 | 1985-11-13 | Toshiba Corp | Co alloy for magnetic recording medium |
US5652054A (en) * | 1994-07-11 | 1997-07-29 | Kabushiki Kaisha Toshiba | Magnetic recording media having a magnetic thin film made of magnetic metals grains and nonmagnetic matrix |
JP2001256631A (en) | 2000-01-05 | 2001-09-21 | Naruse Atsushi | Magnetic recording medium and method of manufacturing the same |
CN100450783C (en) * | 2004-08-31 | 2009-01-14 | 株式会社理光 | Write-onece-read-many optical recording medium and its sputtering target |
JP2006155861A (en) | 2004-10-29 | 2006-06-15 | Showa Denko Kk | Perpendicular magnetic recording medium, production process thereof, and magnetic recording and reproducing apparatus |
JP4377861B2 (en) * | 2005-07-22 | 2009-12-02 | 株式会社神戸製鋼所 | Ag alloy reflecting film for optical information recording medium, optical information recording medium, and Ag alloy sputtering target for forming Ag alloy reflecting film for optical information recording medium |
US7488526B2 (en) * | 2005-11-22 | 2009-02-10 | Ricoh Company, Ltd. | Sputtering target and manufacturing method therefor, and optical recording medium and manufacturing method therefor |
JP2009090601A (en) | 2007-10-11 | 2009-04-30 | Kobe Steel Ltd | Recording layer for optical information recording medium, optical information recording medium, and sputtering target |
JP2011084804A (en) * | 2009-09-18 | 2011-04-28 | Kobelco Kaken:Kk | Metal oxide-metal composite sputtering target |
KR20120057629A (en) * | 2009-09-18 | 2012-06-05 | 소니 주식회사 | Recording layer for optical information recording medium, optical information recording medium, and sputtering target |
JP2011174174A (en) | 2010-01-26 | 2011-09-08 | Mitsubishi Materials Corp | Sputtering target for forming magnetic recording medium film, and method for producing the same |
JP2011175725A (en) | 2010-01-26 | 2011-09-08 | Mitsubishi Materials Corp | Sputtering target for forming magnetic recording medium film and method for manufacturing the same |
JP5375707B2 (en) | 2010-03-28 | 2013-12-25 | 三菱マテリアル株式会社 | Sputtering target for forming a magnetic recording film and method for producing the same |
JP5536540B2 (en) * | 2010-05-26 | 2014-07-02 | 昭和電工株式会社 | Magnetic recording medium and magnetic recording / reproducing apparatus |
JP4885333B1 (en) | 2010-09-03 | 2012-02-29 | Jx日鉱日石金属株式会社 | Ferromagnetic sputtering target |
JP2012117147A (en) | 2010-11-12 | 2012-06-21 | Jx Nippon Mining & Metals Corp | Sputtering target with remained cobalt oxide |
JP5394575B2 (en) * | 2010-12-17 | 2014-01-22 | Jx日鉱日石金属株式会社 | Ferromagnetic sputtering target |
US20130213802A1 (en) | 2010-12-22 | 2013-08-22 | Jx Nippon Mining & Metals Corporation | Sintered Compact Sputtering Target |
JP5801496B2 (en) * | 2013-03-12 | 2015-10-28 | Jx日鉱日石金属株式会社 | Sputtering target |
JP6490589B2 (en) | 2013-10-29 | 2019-03-27 | 田中貴金属工業株式会社 | Target for magnetron sputtering |
CN105917021B (en) * | 2014-03-25 | 2018-04-17 | 捷客斯金属株式会社 | Sb Te base alloy sinter sputtering targets |
JP6284126B2 (en) | 2014-12-15 | 2018-02-28 | 昭和電工株式会社 | Vertical recording medium, vertical recording / reproducing apparatus |
JP6626732B2 (en) * | 2015-06-29 | 2019-12-25 | 山陽特殊製鋼株式会社 | Sputtering target material |
TWI727322B (en) | 2018-08-09 | 2021-05-11 | 日商Jx金屬股份有限公司 | Sputtering target and magnetic film |
US11618944B2 (en) * | 2018-08-09 | 2023-04-04 | Jx Nippon Mining & Metals Corporation | Sputtering target, magnetic film, and perpendicular magnetic recording medium |
JPWO2020031459A1 (en) | 2018-08-09 | 2021-08-02 | Jx金属株式会社 | Sputtering target, granular film and vertical magnetic recording medium |
-
2019
- 2019-05-20 TW TW108117345A patent/TWI727322B/en active
- 2019-05-23 SG SG11202006417XA patent/SG11202006417XA/en unknown
- 2019-05-23 JP JP2020536337A patent/JP7153729B2/en active Active
- 2019-05-23 CN CN201980007232.0A patent/CN111566253B/en active Active
- 2019-05-23 WO PCT/JP2019/020558 patent/WO2020031461A1/en active Application Filing
- 2019-05-23 US US16/960,384 patent/US11894221B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP7153729B2 (en) | 2022-10-14 |
US20200357438A1 (en) | 2020-11-12 |
JPWO2020031461A1 (en) | 2021-08-26 |
WO2020031461A1 (en) | 2020-02-13 |
TWI727322B (en) | 2021-05-11 |
CN111566253B (en) | 2023-06-27 |
TW202009307A (en) | 2020-03-01 |
US11894221B2 (en) | 2024-02-06 |
CN111566253A (en) | 2020-08-21 |
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