SG11202005798WA - Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same - Google Patents

Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Info

Publication number
SG11202005798WA
SG11202005798WA SG11202005798WA SG11202005798WA SG11202005798WA SG 11202005798W A SG11202005798W A SG 11202005798WA SG 11202005798W A SG11202005798W A SG 11202005798WA SG 11202005798W A SG11202005798W A SG 11202005798WA SG 11202005798W A SG11202005798W A SG 11202005798WA
Authority
SG
Singapore
Prior art keywords
semiconductor device
same
production method
adhesive sheet
producing
Prior art date
Application number
SG11202005798WA
Inventor
Yasufumi Kondou
Wenfeng Fu
Yuuki Matsunaga
Original Assignee
Tomoegawa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Co Ltd filed Critical Tomoegawa Co Ltd
Publication of SG11202005798WA publication Critical patent/SG11202005798WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J11/00—Recovery or working-up of waste materials
    • C08J11/04—Recovery or working-up of waste materials of polymers
    • C08J11/06—Recovery or working-up of waste materials of polymers without chemical reactions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling
SG11202005798WA 2018-02-12 2019-02-12 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same SG11202005798WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018022641A JP6909171B2 (en) 2018-02-12 2018-02-12 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it
PCT/JP2019/004810 WO2019156253A1 (en) 2018-02-12 2019-02-12 Adhesive sheet for semiconductor device production and semiconductor device production method using adhesive sheet for semiconductor device production

Publications (1)

Publication Number Publication Date
SG11202005798WA true SG11202005798WA (en) 2020-07-29

Family

ID=67549697

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005798WA SG11202005798WA (en) 2018-02-12 2019-02-12 Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same

Country Status (6)

Country Link
JP (1) JP6909171B2 (en)
KR (1) KR102481726B1 (en)
CN (1) CN111566177B (en)
SG (1) SG11202005798WA (en)
TW (1) TWI784129B (en)
WO (1) WO2019156253A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115699273A (en) * 2020-05-26 2023-02-03 株式会社巴川制纸所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
JPWO2022176585A1 (en) * 2021-02-16 2022-08-25

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302212B1 (en) * 1999-01-22 2001-09-22 한형수 Method for the preparation of the adhesive tape for the electronic parts
JP4665298B2 (en) * 2000-08-25 2011-04-06 東レ株式会社 TAPE WITH ADHESIVE FOR SEMICONDUCTOR DEVICE, COPPER-CLAD LAMINATE USING SAME, SEMICONDUCTOR CONNECTION BOARD AND SEMICONDUCTOR DEVICE
JP3779601B2 (en) 2001-11-28 2006-05-31 株式会社巴川製紙所 Mask sheet for semiconductor device assembly
JP2004182804A (en) * 2002-12-02 2004-07-02 Mitsui Chemicals Inc Resin composition and film adhesive composed thereof
JP4319892B2 (en) 2003-11-07 2009-08-26 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
TWI236075B (en) * 2004-03-12 2005-07-11 Uni Light Technology Inc Method for forming die protecting layer
JP2008095014A (en) * 2006-10-13 2008-04-24 Tomoegawa Paper Co Ltd Thermosetting resin composition for qfn(quad flat non-lead) and adhesive sheet
JP5486081B2 (en) * 2010-03-25 2014-05-07 株式会社巴川製紙所 Liquid adhesive and adhesive tape for electronic parts
JP5937398B2 (en) * 2012-03-26 2016-06-22 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device
KR101722137B1 (en) * 2014-01-03 2017-03-31 주식회사 엘지화학 Dicing film and dicing die-bonding film
KR102086978B1 (en) * 2014-08-29 2020-03-09 후루카와 덴키 고교 가부시키가이샤 Maleimide film
WO2016088744A1 (en) * 2014-12-01 2016-06-09 三菱瓦斯化学株式会社 Resin sheet and printed wiring board
KR101799499B1 (en) * 2014-12-24 2017-12-20 주식회사 엘지화학 Adhesive composition for semiconductor, adhesive film, dicing die bonding film, and semiconductor device
JP2016183237A (en) * 2015-03-26 2016-10-20 株式会社巴川製紙所 Resin composition and adhesive tape
CN106459719A (en) * 2015-04-29 2017-02-22 株式会社Lg化学 Resin composition for bonding semiconductor, adhesive film for semiconductor, and dicing die bonding film
JP6956492B2 (en) * 2017-02-02 2021-11-02 株式会社巴川製紙所 Adhesive sheet for manufacturing semiconductor devices and manufacturing method of semiconductor devices using it

Also Published As

Publication number Publication date
JP6909171B2 (en) 2021-07-28
JP2019137785A (en) 2019-08-22
CN111566177B (en) 2021-10-26
TW201937666A (en) 2019-09-16
WO2019156253A1 (en) 2019-08-15
TWI784129B (en) 2022-11-21
CN111566177A (en) 2020-08-21
KR102481726B1 (en) 2022-12-29
KR20200118811A (en) 2020-10-16

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