SG11202004183TA - Composition and method for polishing memory hard disks exhibiting reduced surface scratching - Google Patents
Composition and method for polishing memory hard disks exhibiting reduced surface scratchingInfo
- Publication number
- SG11202004183TA SG11202004183TA SG11202004183TA SG11202004183TA SG11202004183TA SG 11202004183T A SG11202004183T A SG 11202004183TA SG 11202004183T A SG11202004183T A SG 11202004183TA SG 11202004183T A SG11202004183T A SG 11202004183TA SG 11202004183T A SG11202004183T A SG 11202004183TA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- hard disks
- reduced surface
- exhibiting reduced
- memory hard
- Prior art date
Links
- 230000001747 exhibiting effect Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 238000006748 scratching Methods 0.000 title 1
- 230000002393 scratching effect Effects 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dispersion Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/817,959 US20190153262A1 (en) | 2017-11-20 | 2017-11-20 | Composition and method for polishing memory hard disks exhibiting reduced surface scratching |
PCT/US2018/057478 WO2019099161A2 (en) | 2017-11-20 | 2018-10-25 | Composition and method for polishing memory hard disks exhibiting reduced surface scratching |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202004183TA true SG11202004183TA (en) | 2020-06-29 |
Family
ID=66533873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202004183TA SG11202004183TA (en) | 2017-11-20 | 2018-10-25 | Composition and method for polishing memory hard disks exhibiting reduced surface scratching |
Country Status (8)
Country | Link |
---|---|
US (1) | US20190153262A1 (en) |
EP (1) | EP3714013B8 (en) |
JP (1) | JP7163387B2 (en) |
KR (1) | KR20200078670A (en) |
CN (1) | CN111655809B (en) |
SG (1) | SG11202004183TA (en) |
TW (1) | TWI692510B (en) |
WO (1) | WO2019099161A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11202006025YA (en) * | 2017-12-27 | 2020-07-29 | Kao Corp | Method for producing aluminum platter |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
JP3869608B2 (en) * | 2000-01-25 | 2007-01-17 | Necエレクトロニクス株式会社 | Anticorrosive |
JP4009986B2 (en) * | 2000-11-29 | 2007-11-21 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method for polishing memory hard disk using the same |
US6805812B2 (en) * | 2001-10-11 | 2004-10-19 | Cabot Microelectronics Corporation | Phosphono compound-containing polishing composition and method of using same |
KR100952870B1 (en) * | 2001-10-26 | 2010-04-13 | 아사히 가라스 가부시키가이샤 | Polishing compound, method for production thereof and polishing method |
US6682575B2 (en) * | 2002-03-05 | 2004-01-27 | Cabot Microelectronics Corporation | Methanol-containing silica-based CMP compositions |
KR20060016498A (en) * | 2004-08-18 | 2006-02-22 | 삼성전자주식회사 | Slurry composition, method for forming the slurry composition and method for polishing an object using the slurry composition |
US20090094901A1 (en) * | 2006-04-24 | 2009-04-16 | Hitachi Chemical Co. Ltd. | CMP Polishing Liquid and Polishing Method |
KR20130027057A (en) * | 2006-07-05 | 2013-03-14 | 히타치가세이가부시끼가이샤 | Polishing liquid for cmp and polishing method |
US8821750B2 (en) * | 2007-02-27 | 2014-09-02 | Hitachi Chemical Co., Ltd. | Metal polishing slurry and polishing method |
JP5285866B2 (en) * | 2007-03-26 | 2013-09-11 | 富士フイルム株式会社 | Polishing liquid |
MY151756A (en) * | 2007-10-29 | 2014-06-30 | Kao Corp | Polishing composition for hard disk substrate |
US8247326B2 (en) * | 2008-07-10 | 2012-08-21 | Cabot Microelectronics Corporation | Method of polishing nickel-phosphorous |
US8883034B2 (en) * | 2009-09-16 | 2014-11-11 | Brian Reiss | Composition and method for polishing bulk silicon |
JP5657247B2 (en) * | 2009-12-25 | 2015-01-21 | 花王株式会社 | Polishing liquid composition |
JP5695367B2 (en) * | 2010-08-23 | 2015-04-01 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method using the same |
JP5979871B2 (en) * | 2011-03-09 | 2016-08-31 | 花王株式会社 | Manufacturing method of magnetic disk substrate |
KR102028217B1 (en) * | 2011-11-25 | 2019-10-02 | 가부시키가이샤 후지미인코퍼레이티드 | Polishing composition |
US9039914B2 (en) * | 2012-05-23 | 2015-05-26 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous-coated memory disks |
US8518135B1 (en) * | 2012-08-27 | 2013-08-27 | Cabot Microelectronics Corporation | Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks |
KR101573113B1 (en) * | 2013-08-30 | 2015-12-01 | 엘티씨에이엠 주식회사 | Slurry Composition for Chemical Mechanical Polishing |
WO2015138209A1 (en) * | 2014-03-12 | 2015-09-17 | Cabot Microelectronics Corporation | Compositions and methods for cmp of tungsten materials |
US9401104B2 (en) * | 2014-05-05 | 2016-07-26 | Cabot Microelectronics Corporation | Polishing composition for edge roll-off improvement |
US9803109B2 (en) * | 2015-02-03 | 2017-10-31 | Cabot Microelectronics Corporation | CMP composition for silicon nitride removal |
US10315285B2 (en) * | 2015-04-06 | 2019-06-11 | Cabot Microelectronics Corporation | CMP composition and method for polishing rigid disks |
KR101854499B1 (en) * | 2015-04-24 | 2018-05-04 | 삼성에스디아이 주식회사 | Cmp slurry composition for copper wire and polishing method using the same |
JPWO2017061109A1 (en) * | 2015-10-07 | 2018-07-19 | 三洋化成工業株式会社 | Abrasive material for magnetic disk and method of manufacturing magnetic disk |
KR101854510B1 (en) * | 2015-12-11 | 2018-05-03 | 삼성에스디아이 주식회사 | Cmp slurry composition for metal wiring and polishing method using the same |
CN106928861A (en) * | 2015-12-31 | 2017-07-07 | 安集微电子科技(上海)有限公司 | A kind of barrier layer chemical mechanical polishing liquid of alkalescence |
JP2017139386A (en) * | 2016-02-04 | 2017-08-10 | 東京応化工業株式会社 | Polishing liquid for CMP and polishing method |
-
2017
- 2017-11-20 US US15/817,959 patent/US20190153262A1/en not_active Abandoned
-
2018
- 2018-10-25 KR KR1020207017526A patent/KR20200078670A/en not_active Application Discontinuation
- 2018-10-25 WO PCT/US2018/057478 patent/WO2019099161A2/en unknown
- 2018-10-25 SG SG11202004183TA patent/SG11202004183TA/en unknown
- 2018-10-25 JP JP2020526585A patent/JP7163387B2/en active Active
- 2018-10-25 EP EP18879392.1A patent/EP3714013B8/en active Active
- 2018-10-25 CN CN201880075109.8A patent/CN111655809B/en active Active
- 2018-10-25 TW TW107137666A patent/TWI692510B/en active
Also Published As
Publication number | Publication date |
---|---|
CN111655809B (en) | 2022-05-17 |
EP3714013A4 (en) | 2021-09-01 |
EP3714013A2 (en) | 2020-09-30 |
EP3714013B1 (en) | 2023-12-27 |
TWI692510B (en) | 2020-05-01 |
CN111655809A (en) | 2020-09-11 |
KR20200078670A (en) | 2020-07-01 |
WO2019099161A2 (en) | 2019-05-23 |
TW201922980A (en) | 2019-06-16 |
JP2021503684A (en) | 2021-02-12 |
US20190153262A1 (en) | 2019-05-23 |
EP3714013B8 (en) | 2024-04-03 |
WO2019099161A3 (en) | 2019-06-27 |
JP7163387B2 (en) | 2022-10-31 |
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