SG11202002228UA - Substrate holder for use in a lithographic apparatus - Google Patents
Substrate holder for use in a lithographic apparatusInfo
- Publication number
- SG11202002228UA SG11202002228UA SG11202002228UA SG11202002228UA SG11202002228UA SG 11202002228U A SG11202002228U A SG 11202002228UA SG 11202002228U A SG11202002228U A SG 11202002228UA SG 11202002228U A SG11202002228U A SG 11202002228UA SG 11202002228U A SG11202002228U A SG 11202002228UA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate holder
- lithographic apparatus
- lithographic
- holder
- substrate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17196086 | 2017-10-12 | ||
| EP18163985 | 2018-03-26 | ||
| PCT/EP2018/075293 WO2019072504A1 (en) | 2017-10-12 | 2018-09-19 | Substrate holder for use in a lithographic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202002228UA true SG11202002228UA (en) | 2020-04-29 |
Family
ID=63586754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202002228UA SG11202002228UA (en) | 2017-10-12 | 2018-09-19 | Substrate holder for use in a lithographic apparatus |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US11139196B2 (en) |
| EP (1) | EP3695276A1 (en) |
| JP (3) | JP7015910B2 (en) |
| KR (3) | KR102542369B1 (en) |
| CN (1) | CN111213093A (en) |
| NL (1) | NL2021663A (en) |
| SG (1) | SG11202002228UA (en) |
| TW (3) | TW202328827A (en) |
| WO (1) | WO2019072504A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023241893A1 (en) * | 2022-06-15 | 2023-12-21 | Asml Netherlands B.V. | Substrate support and lithographic apparatus |
Family Cites Families (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3312164B2 (en) | 1995-04-07 | 2002-08-05 | 日本電信電話株式会社 | Vacuum suction device |
| US5963840A (en) | 1996-11-13 | 1999-10-05 | Applied Materials, Inc. | Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions |
| WO1999049504A1 (en) | 1998-03-26 | 1999-09-30 | Nikon Corporation | Projection exposure method and system |
| US6251693B1 (en) | 1998-07-30 | 2001-06-26 | Micron Technology, Inc. | Semiconductor processing methods and semiconductor defect detection methods |
| EP1077393A2 (en) | 1999-08-19 | 2001-02-21 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
| US20030084918A1 (en) | 2001-11-07 | 2003-05-08 | Kim Yong Bae | Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes |
| US20040007325A1 (en) | 2002-06-11 | 2004-01-15 | Applied Materials, Inc. | Integrated equipment set for forming a low K dielectric interconnect on a substrate |
| EP1429188B1 (en) | 2002-11-12 | 2013-06-19 | ASML Netherlands B.V. | Lithographic projection apparatus |
| SG121818A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| SG121819A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| SG150388A1 (en) | 2002-12-10 | 2009-03-30 | Nikon Corp | Exposure apparatus and method for producing device |
| US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| TW200511388A (en) | 2003-06-13 | 2005-03-16 | Nikon Corp | Exposure method, substrate stage, exposure apparatus and method for manufacturing device |
| CN102043350B (en) | 2003-07-28 | 2014-01-29 | 株式会社尼康 | Exposure apparatus, device manufacturing method, and control method of exposure apparatus |
| JP4513534B2 (en) | 2003-12-03 | 2010-07-28 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
| JP2005175016A (en) | 2003-12-08 | 2005-06-30 | Canon Inc | Substrate holding device, exposure device using the same, and method of manufacturing device |
| JP4720506B2 (en) | 2003-12-15 | 2011-07-13 | 株式会社ニコン | Stage apparatus, exposure apparatus, and exposure method |
| WO2005059977A1 (en) | 2003-12-16 | 2005-06-30 | Nikon Corporation | Stage apparatus, exposure apparatus, and exposure method |
| JP2005259870A (en) | 2004-03-10 | 2005-09-22 | Nikon Corp | Substrate retainer, stage device, exposing device and exposing method |
| JP2005310933A (en) | 2004-04-20 | 2005-11-04 | Nikon Corp | Substrate-holding member, aligner, and device manufacturing method |
| CN102290365B (en) | 2004-06-09 | 2015-01-21 | 尼康股份有限公司 | Substrate holding device, exposure apparatus having same, exposure method and method for producing device |
| KR101378688B1 (en) | 2004-06-21 | 2014-03-27 | 가부시키가이샤 니콘 | Exposure equipment and device manufacturing method |
| US7517639B2 (en) | 2004-06-23 | 2009-04-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Seal ring arrangements for immersion lithography systems |
| EP1796143B1 (en) | 2004-09-01 | 2011-11-23 | Nikon Corporation | Substrate holder, stage apparatus, and exposure apparatus |
| SG10201801998TA (en) * | 2004-09-17 | 2018-04-27 | Nikon Corp | Substrate holding device, exposure apparatus, and device manufacturing method |
| WO2006049134A1 (en) | 2004-11-01 | 2006-05-11 | Nikon Corporation | Exposure apparatus and device producing method |
| EP2995997B1 (en) | 2004-12-15 | 2017-08-30 | Nikon Corporation | Exposure apparatus, exposure method, and device fabricating method |
| JPWO2006077859A1 (en) | 2005-01-18 | 2008-06-19 | 株式会社ニコン | Liquid removal apparatus, exposure apparatus, and device manufacturing method |
| JP4752320B2 (en) | 2005-04-28 | 2011-08-17 | 株式会社ニコン | Substrate holding apparatus and exposure apparatus, substrate holding method, exposure method, and device manufacturing method |
| WO2007007723A1 (en) | 2005-07-08 | 2007-01-18 | Nikon Corporation | Substrate for immersion exposure, exposure method and method for manufacturing device |
| KR101704310B1 (en) * | 2005-12-08 | 2017-02-07 | 가부시키가이샤 니콘 | Substrate holding device, exposure device, exposure method, and device fabrication method |
| US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
| WO2007083592A1 (en) | 2006-01-17 | 2007-07-26 | Nikon Corporation | Substrate holding apparatus, exposure apparatus, and device production method |
| KR100819556B1 (en) * | 2006-02-20 | 2008-04-07 | 삼성전자주식회사 | Waper stage and exposure equipment having the same and method for correcting wafer flatness using the same |
| US7675606B2 (en) | 2006-05-05 | 2010-03-09 | Asml Netherlands B.V. | Lithographic apparatus and method |
| WO2008029884A1 (en) | 2006-09-08 | 2008-03-13 | Nikon Corporation | Cleaning member, cleaning method and device manufacturing method |
| US8514365B2 (en) | 2007-06-01 | 2013-08-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| NL1036709A1 (en) | 2008-04-24 | 2009-10-27 | Asml Netherlands Bv | Lithographic apparatus and a method of operating the apparatus. |
| NL1036924A1 (en) | 2008-06-02 | 2009-12-03 | Asml Netherlands Bv | Substrate table, lithographic apparatus and device manufacturing method. |
| EP2365390A3 (en) | 2010-03-12 | 2017-10-04 | ASML Netherlands B.V. | Lithographic apparatus and method |
| US9329496B2 (en) | 2011-07-21 | 2016-05-03 | Nikon Corporation | Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium |
| NL2009189A (en) | 2011-08-17 | 2013-02-19 | Asml Netherlands Bv | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
| WO2013178438A1 (en) | 2012-05-29 | 2013-12-05 | Asml Netherlands B.V. | Object holder and lithographic apparatus |
| US9177849B2 (en) | 2012-12-18 | 2015-11-03 | Intermolecular, Inc. | Chuck for mounting a semiconductor wafer for liquid immersion processing |
| US9835957B2 (en) * | 2013-09-27 | 2017-12-05 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
| CN104698767B (en) | 2013-12-10 | 2017-01-18 | 上海微电子装备有限公司 | Liquid control device of immersion type lithography machine |
| JP6262866B2 (en) | 2014-01-20 | 2018-01-17 | エーエスエムエル ネザーランズ ビー．ブイ． | Lithography support table, lithographic apparatus, and device manufacturing method |
| USRE49142E1 (en) | 2014-08-06 | 2022-07-19 | Asml Netherlands B.V. | Lithographic apparatus and an object positioning system |
| US9287183B1 (en) | 2015-03-31 | 2016-03-15 | Lam Research Corporation | Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch |
| KR102108243B1 (en) | 2015-09-28 | 2020-05-08 | 에이에스엠엘 네델란즈 비.브이. | Substrate holder, lithographic apparatus and device manufacturing method |
| CN108292109B (en) | 2015-12-15 | 2020-05-12 | Asml荷兰有限公司 | Substrate holder, lithographic apparatus and device manufacturing method |
| EP3455677A1 (en) * | 2016-05-12 | 2019-03-20 | ASML Netherlands B.V. | Extraction body for lithographic apparatus |
-
2018
- 2018-09-19 CN CN201880066459.8A patent/CN111213093A/en active Pending
- 2018-09-19 JP JP2020516431A patent/JP7015910B2/en active Active
- 2018-09-19 KR KR1020227023263A patent/KR102542369B1/en not_active Application Discontinuation
- 2018-09-19 SG SG11202002228UA patent/SG11202002228UA/en unknown
- 2018-09-19 KR KR1020207010609A patent/KR102419650B1/en active IP Right Grant
- 2018-09-19 US US16/650,939 patent/US11139196B2/en active Active
- 2018-09-19 KR KR1020237019102A patent/KR20230087619A/en not_active Application Discontinuation
- 2018-09-19 WO PCT/EP2018/075293 patent/WO2019072504A1/en unknown
- 2018-09-19 EP EP18769724.8A patent/EP3695276A1/en active Pending
- 2018-09-19 NL NL2021663A patent/NL2021663A/en unknown
- 2018-10-11 TW TW112111641A patent/TW202328827A/en unknown
- 2018-10-11 TW TW110104463A patent/TWI792180B/en active
- 2018-10-11 TW TW107135803A patent/TW201923481A/en unknown
-
2021
- 2021-09-22 US US17/481,978 patent/US11749556B2/en active Active
-
2022
- 2022-01-24 JP JP2022008547A patent/JP7350906B2/en active Active
-
2023
- 2023-07-18 US US18/354,227 patent/US20230360954A1/en active Pending
- 2023-09-13 JP JP2023148083A patent/JP2023174658A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202328827A (en) | 2023-07-16 |
| JP7015910B2 (en) | 2022-02-03 |
| TW202131109A (en) | 2021-08-16 |
| KR102419650B1 (en) | 2022-07-11 |
| TW201923481A (en) | 2019-06-16 |
| WO2019072504A1 (en) | 2019-04-18 |
| US11139196B2 (en) | 2021-10-05 |
| KR20230087619A (en) | 2023-06-16 |
| NL2021663A (en) | 2019-04-17 |
| US20200294841A1 (en) | 2020-09-17 |
| JP7350906B2 (en) | 2023-09-26 |
| TWI792180B (en) | 2023-02-11 |
| KR20220103190A (en) | 2022-07-21 |
| US20220051927A1 (en) | 2022-02-17 |
| KR102542369B1 (en) | 2023-06-13 |
| EP3695276A1 (en) | 2020-08-19 |
| JP2020537331A (en) | 2020-12-17 |
| US20230360954A1 (en) | 2023-11-09 |
| US11749556B2 (en) | 2023-09-05 |
| KR20200049859A (en) | 2020-05-08 |
| JP2023174658A (en) | 2023-12-08 |
| CN111213093A (en) | 2020-05-29 |
| JP2022060232A (en) | 2022-04-14 |
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